Description
Typical NANOTECHNOLOGY Lab Fab Equipment
Please contact us for our Main Refurbished Equipment. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
| 1 | 3D Printer – Prusa I3 MK3S (PLA/ABS/PETG) (FlexFill/Ninjaflex) |
| 2 | 3D Printer – Prusa SL1 (tough resin) (flexible resin) |
| 3 | Advanced Imaging PC |
| 4 | Angstrom Glovebox – Inert PureLab HE |
| 5 | Assorted spinners and hot plates |
| 6 | Atomic Force Microscope – Bruker Dimension Icon |
| 7 | Atomic Layer Deposition (ALD) – PicoSun R-200 |
| 8 | ATOMIC LAYER DEPOSITION SYSTEM,ALD Equipment: SAVANNAH S200-ALD |
| 9 | Confocal Raman Microscope – Thermo Scientific DXR |
| 10 | Dicing Saw – Disco DAD3220 |
| 11 | Dual Beam Focused Ion Beam – Scanning Electron Microscope (FIB-SEM) – FEI Helios NanoLab G3 CX |
| 12 | Electron Beam Lithography System – Raith eLiNE |
| 13 | Electroplating System – Nickel – Silicon Valley Wafer Plating: The Immersion – Beaker-on-a-Stick System |
| 14 | Evaporator Equipment: Airco FC-1800 |
| 15 | Evaporator Equipment: CHA Evaporator |
| 16 | Evaporator Equipment: CHA Mark 50 |
| 17 | Evaporator Equipment: Temescal BJD-1800 |
| 18 | Evaporator Equipment: Temescal FC-1800 |
| 19 | Evaporator Equipment: Temescal FC-1800 |
| 20 | Evaporator Equipment: TES FC-1800 |
| 21 | Evaporator Equipment: Varian 3120 E-Beam |
| 22 | Fourier Transform Infrared Spectroscopy (FTIR) with photoelastic modulator – Bruker Tensor 27 |
| 23 | ICP DRIE Equipment: STS ICP Bosch Process |
| 24 | ICP DRIE Equipment: STS ICP HRM |
| 25 | ICP DRIE Equipment: STS ICP Multiplex |
| 26 | Inspection Microscope – Nikon LV100 |
| 27 | Laser Writer – Heidelberg Instruments μPG 101 |
| 28 | Laser Writer – Heidelberg Instruments μPG 101 |
| 29 | Layout Editor Software – Tanner L-Edit |
| 30 | Mask Aligner – Karl Suss MA-6 |
| 31 | Mask Aligner – Karl Suss MA-6 |
| 32 | Mask Aligner – Karl Suss MA-6 |
| 33 | Metrology: Awgage-150,Allwin21 |
| 34 | Metrology: Gaertner L117 |
| 35 | Metrology: KLA Tencor P6 |
| 36 | Metrology: KLA Tencor P-7 |
| 37 | Metrology: Microscope AFX-II |
| 38 | Metrology: ResMap 178 |
| 39 | Metrology: Sloan Dektak II |
| 40 | Metrology: Tencor Mgage-200 |
| 41 | Metrology: Tencor Mgage-300 |
| 42 | Metrology: Tencor Sonogage 200 |
| 43 | Microfluidic Flow Control System – Fluigent LineUp Series |
| 44 | Microscope – Nikon Optical Microscope with Digital Image Capture & Transfer Station |
| 45 | Microscope – Olympus Optical Microscope with Digital Image Capture |
| 46 | Multimode Deposition Chamber – Angstrom Amod – Combined e-beam, Resistive & Sputter Deposition Chamber |
| 47 | NanoAssemblr – Pecision NanoAssemblr Benchtop |
| 48 | NanoSight – Malvern Panalytical Nanosight NS300 |
| 49 | Nitrogen Glovebox – Mbraun Unilab Workstation |
| 50 | Optical Stereomicroscope – Motic SMZ 168 TLED, Moticam 5+ |
| 51 | Optical Stereomicroscope – Motic SMZ 168 TLED, Moticam 5+ |
| 52 | PDMS Aligner – ThorLabs motion control, DinoLite Optics |
| 53 | PECVD – Trion Orion II |
| 54 | PECVD: PlasmaTherm 700 |
| 55 | PECVD: PlasmaLab 80 Plus |
| 56 | PECVD: Plasmalab 80+ DPCVD |
| 57 | PECVD: PlasmaTherm 720 |
| 58 | PECVD: PlasmaTherm 790 |
| 59 | PECVD: STS PECVD |
| 60 | Photoplotter – Bungard Filmstar-PLUS Small |
| 61 | Plasma Asher Descum equipment: AST Barrel Asher |
| 62 | Plasma Asher Descum equipment: AW-105R, Allwin21 |
| 63 | Plasma Asher Descum equipment: AW-B3000,Allwin21 |
| 64 | Plasma Asher Descum equipment: Branson/IPC 3000 |
| 65 | Plasma Asher Descum equipment: Branson/IPC L3200 |
| 66 | Plasma Asher Descum equipment: Gasonics Aura 1000 |
| 67 | Plasma Asher Descum equipment: Gasonics Aura 2000 |
| 68 | Plasma Asher Descum equipment: Gasonics Aura 3000 |
| 69 | Plasma Asher Descum equipment: Gasonics Aura 3010 |
| 70 | Plasma Asher Descum equipment: Gasonics L3510 |
| 71 | Plasma Asher Descum equipment: March PX-250 |
| 72 | Plasma Asher Descum equipment: Matrix 105 |
| 73 | Plasma Asher Descum equipment: Matrix 205 |
| 74 | Plasma Asher Descum equipment: Matrix 209S |
| 75 | Plasma Asher Descum equipment: Plasma Etch BT1 |
| 76 | Plasma Asher Descum equipment: PlasmaEtch PE-100 |
| 77 | Plasma Asher Descum equipment: Technics 2000 |
| 78 | Plasma Asher Descum equipment: Technics PE-IIA |
| 79 | Plasma Cleaner – Fischione Model 1020 |
| 80 | Plasma Etch – Trion Minilock II |
| 81 | Plasma Etch – Harrick Plasma PDC-32G Plasma Cleaner |
| 82 | Plasma Etch – Oxford PlasmaPro 100 Cobra |
| 83 | Plasma Etch – PVA TePla IoN Wave |
| 84 | Plasma Etch – Trion Phantom II |
| 85 | Plasma Etch – Harrick Plasma PDC-32G Plasma Cleaner |
| 86 | Plasma Etch – Oxford PlasmaPro 100 Cobra |
| 87 | Plasma Etch – PVA TePla IoN Wave |
| 88 | Plasma Etch – Trion Phantom II |
| 89 | Plasma Etcher: AW-901eR,Allwin21 |
| 90 | Plasma Etcher: AW-903eR |
| 91 | Plasma Etcher: Lam AutoEtch 490 |
| 92 | Plasma Etcher: Lam AutoEtch 590 |
| 93 | Plasma Etcher: Lam Rainbow 4420 |
| 94 | Plasma Etcher: Matrix 303 |
| 95 | Plasma Etcher: Matrix 403 |
| 96 | Plasma Etcher: PlasmaTherm 700 |
| 97 | Plasma Etcher: Tegal 901e |
| 98 | Plasma Etcher: Tegal 903e |
| 99 | Porous Silicon Etching System – AMMT MPSB 100 |
| 100 | Probe Station – Micromanipulator 450PM, Keithley 4200A-SCS |
| 101 | Process Hood – Acid/Base |
| 102 | Process Hood – Develop |
| 103 | Process Hood – EBL |
| 104 | Process Hood – HF |
| 105 | Process Hood – Liftoff |
| 106 | Process Hood – Microfluidics |
| 107 | Process Hood – Miscellaneous |
| 108 | Process Hood – RCA Clean |
| 109 | Process Hood -Photoresist |
| 110 | Quartz Crystal Microbalance w/ Dissipation Monitoring (QCM-D) – Biolin Scientific Qsense E4 |
| 111 | Rapid Thermal processing Equipment: AG Associates Heatpulse 210 |
| 112 | Rapid Thermal processing Equipment: AG Associates Heatpulse 310 |
| 113 | Rapid Thermal processing Equipment: AG Associates Heatpulse 410 |
| 114 | Rapid Thermal processing Equipment: AG Associates Heatpulse 4100 |
| 115 | Rapid Thermal processing Equipment: AG Associates Heatpulse 4100S |
| 116 | Rapid Thermal processing Equipment: AG Associates Heatpulse 4108 |
| 117 | Rapid Thermal processing Equipment: AG Associates Heatpulse 610 |
| 118 | Rapid Thermal processing Equipment: AG Associates Heatpulse 610I |
| 119 | Rapid Thermal processing Equipment: AG Associates Heatpulse 8108 |
| 120 | Rapid Thermal processing Equipment: AG Associates Heatpulse 8800 |
| 121 | Rapid Thermal processing Equipment: AnnealSys AS-One |
| 122 | Rapid Thermal processing Equipment: JETFIRST 100 -RTP |
| 123 | Rapid Thermal processing Equipment: JETFIRST 150 -RTP |
| 124 | Rapid Thermal processing Equipment: JETFIRST 200 RTP |
| 125 | Rapid Thermal processing Equipment: Jipelec Jetfirst 200 |
| 126 | Rapid Thermal processing Equipment: MPT RTP-3000 |
| 127 | Rapid Thermal Processor – SSI Solaris 150 |
| 128 | Resistive Evaporator #1 – Angstrom Amod – Resistive Chamber |
| 129 | RIE Equipment: OXFORD 100 RIE |
| 130 | RIE Equipment: Oxford 133 RIE |
| 131 | RIE Equipment: PlasmaTherm 720 |
| 132 | RIE Equipment: PlasmaTherm 790 RIE |
| 133 | RIE Equipment: SAMCO RIE 10 NR |
| 134 | Scanning Electron Microscope – Zeiss Merlin with Gemini II Column |
| 135 | SCANNING ELECTRON MICROSCOPE , SEM: F.E.I.Quanta 200 |
| 136 | SCANNING ELECTRON MICROSCOPE , SEM: HITACHI S-4700 |
| 137 | Schlenk Line – Dual Manifold Vacuum/Argon Line |
| 138 | Screen Printer – MTI EQ-SPC-2-LD |
| 139 | Solar Testing – Oriel Instruments 100W Xenon Lamp with AM 1.5G filter, Oriel Instruments Cornerstone 130 monochromater, Keithley 2400 SMU |
| 140 | Spectrophotofluorometer – Jobin Yvon Fluorolog-3 FL3-111 |
| 141 | Spectrophotometer – Agilent Technologies Cary 5000 UV-VIS-NIR |
| 142 | Spectroscopic Ellipsometer – JA Woollam M-2000VI |
| 143 | Sputter Coater – Cressington 108 |
| 144 | Sputter Deposition – AJA ATC-2200 |
| 145 | Sputtering Deposition equipment: Allwin21 AccuSputter AW4450 |
| 146 | Sputtering Deposition equipment: CPA S-Gun -Sputter |
| 147 | Sputtering Deposition equipment: Emscope SC-650 |
| 148 | Sputtering Deposition equipment: MRC 603 693 TES |
| 149 | Sputtering Deposition equipment: MRC 603 Sputter |
| 150 | Sputtering Deposition equipment: MRC 643 -Sputter |
| 151 | Sputtering Deposition equipment: MRC 8671 Sputtering |
| 152 | Sputtering Deposition equipment: Perkin-Elmer 2400 |
| 153 | Sputtering Deposition equipment: Perkin-Elmer 4400 |
| 154 | Sputtering Deposition equipment: Perkin-Elmer 4450 |
| 155 | Sputtering Deposition equipment: Temescal BJD-1800 |
| 156 | Standard Oven – Yamato Drying Oven DX 300 |
| 157 | Standard Oven – Thermo Scientific Heratherm OGS60 |
| 158 | Standard vacuum and general purpose ovens |
| 159 | Stylus Profilometer – Bruker Dektak 150 |
| 160 | Stylus Profilometer – KLA Tencor P-7 |
| 161 | Tester Instrument: HEWLETT PACKARD,Agilent HP 4062UX |
| 162 | Thermogravimetric Analyzer (TGA) – Instrument Specialists TGA-1000 |
| 163 | Transmission Electron Microscope – FEI Tecnai G2 Osiris S/TEM |
| 164 | Tube Furnace – Lindberg Blue M (1″) |
| 165 | Tube Furnace – Lindberg Blue M (1″) |
| 166 | Tube Furnace – MTI OTF-1200X (4″) |
| 167 | Tube Furnace – MTI OTF-1200X (4″) |
| 168 | UV Ozone Cleaner – Jelight M42 |
| 169 | Vacuum Oven – Thermo Scientific Lindberg Blue M Model No. VO1218A |
| 170 | Vacuum Oven – Yield Engineering Systems (YES) 310TA HMDS Vapor-Prime & Image-Reversal Vacuum Oven |
| 171 | Wafer probe: Cascade PS-21 |
| 172 | Wafer probe: Electroglas EG 1034 |
| 173 | Wafer probe: Electroglas EG 2001 |
| 174 | Wafer probe: Electroglas EG 4090u+ |
| 175 | Wafer probe: Electroglas EG 4090X |
| 176 | Wax Printer – Xerox ColorQube 8570 |
| 177 | Wire Bonder – Westbound Wedge 7476D |
| 178 | Zetasizer – Malvern Panalytical Advance Series Ultra (Red Label) |
SS10661-20240524
