Description
Please contact us for the availability of the Trion Technology PHANTOM II used semiconductor equipment.
ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in seperate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.
The items are subject to prior sale without notice. These items are only for end users.
SS5626