Description
Toray Flip chip Bonder, FC 3500 NS
Chip size [mm]Thermo-compression process. Number of chip typesWafer : 1, Waffle tray : Max 3. Chip orientation. 1 Slim chip (Min. 1.0mm Wide) and large-sized chip (Max. 30.0mm Long × 30.0mm wide) can be processed with an optional heat tool.
Valid Time: Subject to prior sale without notice.
SS192000008939
