Description
Please contact us if you are interested in the following Thin Film Processing Equipment and tools. The Thin Film Processing Equipment and tools are only for end users and are subject to prior sale without notice. Appreciate your time.
| Equip Code | Name | Type |
| 1 | 110 C Oven | Other |
| 16 | 4″ (Old) Electron Beam Evaporation System | Evaporation |
| 32 | 62700 Eurotherm Furnace | Other |
| 36 | 790 Plasmatherm #1 PECVD | PECVD |
| 39 | 80+ PECVD | PECVD |
| 46 | 90 C Oven | Other |
| 65 | AET RTP | RTP |
| 101 | Aixtron Black Magic graphene CVD furnace | Other |
| 102 | Aixtron MOCVD – III-Nsystem | Other |
| 103 | Aixtron MOCVD – III-Vsystem | Other |
| 104 | AJA ATC 2200 UHV Sputtering System | Sputter |
| 105 | AJA ATC Orion 8 UHV Sputtering System | Sputter |
| 106 | AJA DC Sputter Deposition Tool | Sputter |
| 107 | AJA Evaporator | Evaporation |
| 109 | AJA Orion 8 Sputter System | Sputter |
| 110 | AJA Phase II J Sputtering System | Sputter |
| 111 | AJA RF Sputter Deposition Tool | Sputter |
| 112 | AJA Sputter Deposition | Sputter |
| 113 | AJA Sputtering System | Sputter |
| 114 | AJA Sputtering System | Sputter |
| 115 | AJA Sputtering System | Sputter |
| 116 | ALD | ALD |
| 117 | ALD | ALD |
| 118 | ALD | ALD |
| 119 | ALD1 | ALD |
| 120 | ALD2 | ALD |
| 121 | ALDE1 | ALD |
| 124 | AllWin 610 Rapid Thermal Annealer | RTA/RTP |
| 133 | Amod Evaporator | Evaporation |
| 134 | Amorphous Silicon LPCVD System | CVD |
| 143 | Angstrom EvoVac Electron Beam Evaporator | Evaporation |
| 144 | Angstrom Nexdep Thermal E-Beam Evaporator | Evaporation |
| 145 | Angstrom Sputter System | Sputter |
| 146 | Annealsys Rapid Thermal Processor | RTA/RTP |
| 150 | Applied Mateiral’s P5000 | PECVD |
| 151 | Applied Materials Centurion Epitaxial System | Other |
| 157 | Arradiance ALD | ALD |
| 166 | AST 280 RTA | Annealing |
| 168 | Atmosphere Oxidation System (tube 21) | Oxidation |
| 169 | Atmosphere Oxidation System (tube 22) | Oxidation |
| 170 | Atmosphere Oxidation System (tube 23) | Oxidation |
| 171 | Atmosphere Oxidation System (tube 24) | Oxidation |
| 179 | Atomic Layer Deposition | ALD |
| 180 | Atomic Layer Deposition | ALD |
| 181 | Atomic Layer Deposition | ALD |
| 182 | Atomic Layer Deposition System (ALD) | Oxidation |
| 183 | Atomic Layer Deposition System (ALD) | ALD |
| 184 | Atomic Layer Deposition System (ALD) | ALD |
| 185 | Atomic Layer Deposition System (ALD) | ALD |
| 187 | ATV PEO 603 | Oxidation |
| 206 | Ball Mixer | Other |
| 222 | Batter Tester | Other |
| 224 | Belt Furnace | Annealing |
| 226 | Beneq TFS200 Atomic Layer Deposition | ALD |
| 240 | Black Magic PECVD | PECVD |
| 242 | Blue M Programmable Oven | Other |
| 244 | Boron Disk Doping (Tylan Furnace D2) | Doping |
| 245 | Boron Doping – Bank D-1 | Doping |
| 246 | Boron Doping Furnace (BBr3) | Doping |
| 248 | Brewer CEE 100 Spin Coat System | Spin Coating |
| 282 | Cambridge NanoTech ALD | ALD |
| 283 | Cambridge NanoTech Plasma ALD – Metal (left) | ALD |
| 284 | Cambridge NanoTech Plasma ALD – Oxide (right) | ALD |
| 285 | Cambridge NanoTech S200 | ALD |
| 286 | Cambridge Nanotech/Ultratech Savannah | ALD |
| 291 | Carbolite Tube Furnace | Other |
| 292 | Carbon Nanotube/Graphene Furnace | CVD |
| 309 | CHA E-beam evaporator | Evaporation |
| 310 | CHA E-beam evaporator | Evaporation |
| 311 | CHA E-beam Evaporator | Evaporation |
| 312 | CHA E-beam Evaporator 1 (dielectrics) | Evaporation |
| 313 | CHA E-beam Evaporator 2 (metals) | Evaporation |
| 314 | CHA Evaporator | Evaporation |
| 325 | CMOS Wet Oxide -Bank E-2 | Oxidation |
| 351 | Cooke Thermal Evaporator | Evaporation |
| 352 | Copper Plating | Plating |
| 355 | CPA Sputter System | Sputter |
| 379 | CTRLayer Anti-Reflective Coater | Evaporation |
| 380 | CtrLayer SDS | Sputter |
| 383 | CVC DC Sputterer | Sputter |
| 384 | CVC E-Beam Evaporator 1 | Evaporation |
| 385 | CVC E-Beam Evaporator 2 — Instructional Center | Evaporation |
| 386 | CVC Sputter Deposition | Sputter |
| 387 | CVD FirstNano Graphene Furnace 1 | CVD |
| 388 | CVD FirstNano Graphene Furnace 2 | CVD |
| 389 | CVD FirstNano SiGe Nanowire Furnace | CVD |
| 390 | CVD Reactor | CVD |
| 400 | DC Sputter System | Sputter |
| 401 | DC Sputtering System | Sputter |
| 419 | Denton 502A Thermal Evaporator | Evaporation |
| 420 | Denton Discovery – RF/DC Sputterer | Sputter |
| 421 | Denton Discovery 18 Sputter System | Sputter |
| 422 | Denton Discovery 2 | Sputter |
| 423 | Denton Discovery 635 Sputter System | Sputter |
| 424 | Denton E-Beam Evaporator | Evaporation |
| 425 | Denton Explorer – E-beam Evaporator | Evaporation |
| 426 | Denton Explorer 14 | Sputter |
| 427 | Denton Infinity | Evaporation |
| 428 | Denton Thermal Evaporator | Evaporation |
| 429 | deposition: KJL Evaporator | Evaporation |
| 430 | deposition: Oerlikon Univex Sputter | Sputter |
| 432 | Develop Track | Other |
| 444 | Diffusion Furnace | Doping |
| 475 | Drive-In Anneal / Re-Oxidation (Tylan Furnace D4) | Annealing |
| 476 | Dry Oxidation (Tylan Furnace D3) | Oxidation |
| 477 | Dry Oxide-CMOS-CVD – Bank E-1 | Oxidation |
| 491 | E-beam Evaporator | Evaporation |
| 492 | E-beam evaporator | Evaporation |
| 493 | E-beam Evaporator | Evaporation |
| 498 | E-Beam Thermal Evaporator Lesker PVD 75 (PVD-02) | Evaporation |
| 502 | EBE | Evaporation |
| 503 | Ebeam evaporator | Evaporation |
| 506 | Ebeam/Sputter Deposition System | Sputter |
| 508 | EBL CEE Spinner | Spin Coating |
| 520 | Edwards thermal evaporator | Other |
| 522 | Electrode Fabricator | Annealing |
| 523 | Electroless Plating Line | Plating |
| 525 | Electrolytic Plating Line | Plating |
| 527 | Electron Beam Evaporator | Evaporation |
| 528 | Electron Beam Evaporator | Evaporation |
| 529 | Electron Beam Evaporator | Evaporation |
| 538 | Electroplating Bench | Plating |
| 539 | Electroplating Hood – Au | Plating |
| 540 | Electroplating Hood – Cu | Plating |
| 541 | Electroplating Hood – Ni | Plating |
| 542 | Electroplating Process Bench | Other |
| 558 | Emitech K575X Sputter Coater | Sputter |
| 572 | EVAP1 | Evaporation |
| 573 | EVAP1 | Evaporation |
| 574 | EVAP2 | Evaporation |
| 575 | EVAP2 | Evaporation |
| 576 | EVAP3 | Evaporation |
| 579 | EVG 101 Resist Spray Coater | Spray Coating |
| 580 | EVG 101 Spin Coater | Spin Coating |
| 623 | Fiji Atomic Layer Deposition | ALD |
| 624 | Fiji Atomic Layer Deposition | ALD |
| 639 | First Nano carbon nanotube CVD furnace | Other |
| 655 | Forming Gas Anneal (Tylan Furnace C4) | Annealing |
| 658 | Forming Gas Anneal of High-K Dielectrics (Tylan Furnace C1) | Annealing |
| 659 | Forming gas furnace | Annealing |
| 677 | FURN2-Tube1 | Annealing |
| 678 | FURN2-Tube2 | Oxidation |
| 679 | FURN2-Tube3 | Annealing |
| 680 | Furnace | Oxidation |
| 681 | Furnaces and Controllers Lindberg | Oxidation |
| 700 | GEMStar ALD and Pulsed CVD | ALD |
| 702 | General Furnace | Oxidation |
| 703 | General Material Anneal 1 – Bank A-1 | Annealing |
| 708 | Glove Box | Other |
| 715 | Gold Plating | Plating |
| 718 | GSI PECVD | PECVD |
| 731 | HD-PCVD | PECVD |
| 732 | Headway Manual Resist Spinner | Spin Coating |
| 735 | Headway Spinner I | Spin Coating |
| 736 | Heatpulse 210T Rapid Thermal Annealing System | Annealing |
| 737 | Heatpulse 610 | Annealing |
| 755 | HEX Deposition system | Other |
| 805 | Hummer V Sputter Coater | Evaporation |
| 807 | Hybrid Thin Film Deposition System | Other |
| 817 | IBS/e | Other |
| 836 | Innotec ES26C E-Gun Evaporator | Evaporation |
| 846 | Intermediate Coating Platform | Other |
| 848 | IntlVac Nanochrome I Evaporator System | Evaporation |
| 849 | IntlVac Nanochrome I Sputter System | Sputter |
| 852 | Ion assist E-beam Evaporator | Evaporation |
| 867 | IR Image Furnace | Other |
| 898 | JetFirst RTP | RTP |
| 900 | Jipelec Rapid Thermal Processor | RTA/RTP |
| 928 | Key High Thermal Evaporator | Evaporation |
| 937 | KJL_south cleanroom | Sputter |
| 952 | Kurt Lesker Electron Beam Evaporation System | Evaporation |
| 972 | Laurell Manual Resist Spinner | Spin Coating |
| 973 | Laurell Spin Processor with Wet Station | Spin Coating |
| 974 | Laurell Spinner | Spin Coating |
| 975 | Laurell Spinner | Spin Coating |
| 991 | Lesker E-beam Evaporator – Soft-Lithography | Evaporation |
| 992 | Lesker Nano 36 (PVD01) | Evaporation |
| 993 | Lesker PVD 75 (PVD-03) | Sputter |
| 994 | Lesker PVD 75 (PVD-04) | Evaporation |
| 995 | Lesker PVD 75 Evaporator | Evaporation |
| 996 | Lesker PVD 75 Sputterer | Sputter |
| 997 | Lesker PVD75 #1 Sputter Deposition | Sputter |
| 998 | Lesker PVD75 #2 ZnO Sputter deposition | Sputter |
| 999 | Lesker PVD75 #3 E-beam evaporator | Evaporation |
| 1000 | Lesker PVD75 #4 E-beam evaporator | Evaporation |
| 1001 | Lesker Sputter | Evaporation |
| 1004 | Lindberg Furnace | Annealing |
| 1005 | Lindberg Furnace 1 (CMOS Sintering Tube) | Other |
| 1006 | Lindberg Furnace 2 (Polymer Curing Tube) | Other |
| 1007 | Lindberg Furnace 3 (Oxidation Tube) | Other |
| 1008 | Lindberg Furnace 4 (Polymer Curing Tube) | Other |
| 1009 | Lindburg Blue M Ovens | Annealing |
| 1020 | Low Pressure Chemical Vapor Deposition System (tube 32) | CVD |
| 1021 | Low Pressure Chemical Vapor Deposition System (tube 33) | CVD |
| 1025 | LPCVD | Oxidation |
| 1026 | LPCVD BPSG | CVD |
| 1027 | LPCVD CMOS N+ Polysilicon – Bank D-3 | CVD |
| 1028 | LPCVD CMOS Nitride – Bank E-4 | CVD |
| 1029 | LPCVD Low Temperature Oxide (LTO) – Bank B-3 | CVD |
| 1030 | LPCVD MRL furnaces | CVD |
| 1031 | LPCVD N+/P+ Polysilicon – Bank C-4 | CVD |
| 1032 | LPCVD Nitride – B4 | CVD |
| 1033 | LPCVD P+polysilicon CVD- Bank D-4 | CVD |
| 1034 | LPCVD TEOS Oxide- Bank C-3 | CVD |
| 1035 | LPCVD Undoped Polysilicon – Bank E-3 | CVD |
| 1039 | Magnetron Sputtering Coating | Sputter |
| 1050 | Manual Spin Coater | Spin Coating |
| 1076 | Mass-Selected Ion Deposition System – Electrospray Source | Other |
| 1087 | Metallica Sputter System | Sputter |
| 1088 | Metalorganic Vapor Deposition System | CVD |
| 1138 | Mini Tystar Tube 1 | Oxidation |
| 1139 | Mini Tystar Tube 2 | Oxidation |
| 1140 | Mini Tystar Tube 3 | Oxidation |
| 1141 | Mini-Brute Furnace | Annealing |
| 1146 | MOCVD Reactor | CVD |
| 1147 | Modulab Evaporator | Evaporation |
| 1149 | Molecular Beam Epitaxy | MBE |
| 1150 | Molecular Beam Epitaxy (MBE) | MBE |
| 1151 | Molecular Beam Epitaxy, Multi-source | MBE |
| 1153 | Molecular Vapor Deposition | CVD |
| 1154 | MOS Clean Anneal 2 – Bank B-1 | Annealing |
| 1157 | MOS Metal Anneal 3 -Bank C-1 | Annealing |
| 1158 | MOS Metal Anneal 4 -Bank C-2 | Annealing |
| 1160 | MRC 944 Sputtering Tool | Sputter |
| 1162 | MRL 1414 Diffusion Furnace | Oxidation |
| 1163 | MRL boron diffusion | Doping |
| 1164 | MRL Furnace – Tube 3 | Oxidation |
| 1165 | MRL Furnace – Tube 4 | Annealing |
| 1166 | MRL furnaces | Annealing |
| 1167 | MRL Oxidation | Oxidation |
| 1220 | Nexx PECVD | PECVD |
| 1222 | Neytech Furnace | Other |
| 1233 | Novellus Concept II PECVD | PECVD |
| 1240 | Oerlikon Sputter | Sputter |
| 1266 | Orion V | Sputter |
| 1267 | Orion V | Sputter |
| 1268 | Orion VIII | Sputter |
| 1271 | OVEN1 | Annealing |
| 1272 | OVEN2 | Other |
| 1273 | OVEN4 | Annealing |
| 1274 | OVEN5 | Other |
| 1275 | OVEN6 | Other |
| 1279 | Oxford ALD FlexAL | ALD |
| 1289 | Oxford PECVD | PECVD |
| 1290 | Oxford PECVD | PECVD |
| 1291 | Oxford Plasma Lab 100 | PECVD |
| 1309 | Paralyne Deposition System | Other |
| 1311 | PARYL1 | Evaporation |
| 1312 | Parylene Coater | Other |
| 1313 | Parylene Coater | Other |
| 1314 | Parylene Coater | Other |
| 1315 | Parylene Deposition | CVD |
| 1319 | PdR Atomic Layer Deposition | ALD |
| 1320 | PDS 2010 Parylene Coater | Other |
| 1325 | PEALD | ALD |
| 1326 | PECVD | PECVD |
| 1327 | PECVD1 | PECVD |
| 1328 | PECVD1 | PECVD |
| 1329 | PECVD2 | PECVD |
| 1330 | PECVD; Diamond | PECVD |
| 1339 | PGSTAT | ALD |
| 1344 | phosphorous diffusion | Doping |
| 1345 | Phosphorus Disk Doping (Tylan Furnace C3) | Doping |
| 1346 | Phosphorus Doping – Bank D-2 | Doping |
| 1361 | Photoresist Spinner/Thermal Bench | Spin Coating |
| 1381 | Plasma CVD TEOS Oxide | CVD |
| 1382 | Plasma Enhanced Chemical Vapor Deposition | PECVD |
| 1383 | Plasma Enhanced Chemical Vapor Deposition (PECVD) | PECVD |
| 1389 | Plasma Therm PECVD | PECVD |
| 1396 | Plasma-enhanced Chemical Vapor Deposition System | PECVD |
| 1398 | Plasma-Therm Apex SLR HDPCVD | CVD |
| 1402 | Plasma-Therm Vision 310 PECVD | PECVD |
| 1403 | PlasmaQuest | PECVD |
| 1404 | Plasmatech CVD | CVD |
| 1407 | PlasmaTherm Shuttlecock PECVD System | PECVD |
| 1408 | PlasmaTherm Versaline HDP VCD System | PECVD |
| 1409 | Plating Station 1 | Plating |
| 1410 | Plating Station 2 | Plating |
| 1411 | Plating Station 3 | Plating |
| 1412 | Plating Station 4 | Plating |
| 1413 | PLD | Other |
| 1414 | POCL3 MRL furnaces | Doping |
| 1416 | Polaron | Evaporation |
| 1419 | Polyimide Curing Oven | Other |
| 1455 | Pulsed Laser Deposition | Other |
| 1456 | Pulsed Laser Deposition System | Other |
| 1457 | Pulsed-CVD | Other |
| 1460 | PVD 75 Sputter Deposition | Sputter |
| 1461 | PVD Filament Evaporator (Instructional Lab) | Evaporation |
| 1462 | PVD75 Filament Evaporator | Evaporation |
| 1463 | PVD75 RF Sputterer | Sputter |
| 1497 | Rapid Thermal Annealer | RTA/RTP |
| 1498 | Rapid Thermal Annealer | RTA/RTP |
| 1499 | Rapid Thermal Annealer | RTA/RTP |
| 1500 | Rapid Thermal Annealer | RTA/RTP |
| 1501 | Rapid Thermal Annealer | RTA/RTP |
| 1502 | Rapid Thermal Annealer | RTA/RTP |
| 1503 | Rapid Thermal Annealer | Other |
| 1504 | Rapid Thermal Annealer 1 | RTA/RTP |
| 1505 | Rapid Thermal Annealer 2 | RTA/RTP |
| 1506 | Rapid Thermal Annealing System | RTA/RTP |
| 1507 | Rapid Thermal Processing (RTP) | RTA/RTP |
| 1508 | Rapid Thermal Processing System | RTA/RTP |
| 1509 | Rapid Thermal Processor | RTA/RTP |
| 1510 | Rapid Thermal Processor | RTA/RTP |
| 1511 | Rapid Thermal Processor – AG 8108 | RTA/RTP |
| 1527 | Resistive Heated Evaporation | Evaporation |
| 1529 | Reynolds Plating Bench | Plating |
| 1535 | ReynoldsTech Polymer Vapor Deposition | Other |
| 1536 | RF-PECVD | CVD |
| 1537 | RF/DC Sputter deposition | Sputter |
| 1558 | Roll-to-Roll Coater | Other |
| 1560 | RTA – AG610a | RTA/RTP |
| 1561 | RTA – AG610b | RTA/RTP |
| 1562 | RTA-Clean | RTA/RTP |
| 1563 | RTA-Metals | RTA/RTP |
| 1564 | RTA1 | RTA/RTP |
| 1571 | Sandvik/MRL | Annealing |
| 1572 | Sandvik/MRL | Annealing |
| 1573 | Sandvik/MRL | Annealing |
| 1574 | Sandvik/MRL | Annealing |
| 1576 | Savanah ALD | ALD |
| 1577 | Savannah Atomic Layer Deposition | Sputter |
| 1578 | Savannah Atomic Layer Deposition System | ALD |
| 1579 | Savannah/Plasma Cleaner in Glovebox System | ALD |
| 1585 | SC4500 Even-Hour Evaporator | Evaporation |
| 1586 | SC4500 Odd-Hour Evaporator | Evaporation |
| 1601 | Schmid APCVD | CVD |
| 1612 | Screen Printers | Annealing |
| 1614 | SCS G3P8 Spin Coater — Instructional Center | Spin Coating |
| 1615 | SCS G3P8 Spin Coater 1 (small pieces) | Spin Coating |
| 1616 | SCS G3P8 Spin Coater 2 – Pettit | Spin Coating |
| 1617 | SCS G3P8 Spin Coater 3 – Inorganic | Spin Coating |
| 1618 | SCS Parylene coater | Other |
| 1619 | SCS Parylene Coater | Other |
| 1630 | SEMCON electroplating | Plating |
| 1644 | Sharon E-Beam Evaporator | Evaporation |
| 1645 | Sharon Thermal Evaporator TE-3 | Evaporation |
| 1646 | Sharon Thermal Evaporator TE-4 | Evaporation |
| 1647 | Sharon Thermal Evaporator TE-5 | Evaporation |
| 1655 | Silicon Dioxide LPCVD System | CVD |
| 1656 | Silicon Nitride LPCVD System | CVD |
| 1662 | Singe Oven | Other |
| 1687 | South KJL | Sputter |
| 1698 | Spin Coater | Spin Coating |
| 1699 | Spin Coater | Spin Coating |
| 1700 | Spin Coater 1 | Spin Coating |
| 1701 | Spin Coater 2 | Spin Coating |
| 1708 | Spin Track | Spin Coating |
| 1727 | SPUT2 | Sputter |
| 1728 | SPUT3 | Sputter |
| 1733 | Sputter deposition | Sputter |
| 1734 | Sputter Deposition System | Sputter |
| 1735 | Sputter-Lesker | Sputter |
| 1736 | Sputtering | Sputter |
| 1737 | Sputtering System (Large) | Sputter |
| 1738 | Sputtering System (Small) | Sputter |
| 1739 | Sputtering System – 3 target | Sputter |
| 1740 | Sputtering System – 6 target | Sputter |
| 1745 | SSI RTP | RTP |
| 1746 | Stand Alone Glovebox | Spin Coating |
| 1747 | Static Platform | Other |
| 1748 | Steam Oxidation (Furnace D1) | Oxidation |
| 1752 | STF1200 Oxidation and Annealing Furnace | Oxidation |
| 1768 | STS PECVD | PECVD |
| 1769 | STS PECVD 2 | PECVD |
| 1770 | STS PECVD 3 | PECVD |
| 1772 | STS Plasma Enhanced CVD | PECVD |
| 1783 | Sulfurization furnace | Other |
| 1786 | Surrey CNT NanoGrowth | Other |
| 1787 | Suss AltaSpray Spray Coater | Spray Coating |
| 1801 | SVG Resist Coat Tracks 1&2 | Spin Coating |
| 1802 | SVG Resist Develop tracks 1&2 | Other |
| 1807 | TANG | Sputter |
| 1808 | Tank Mixer | Annealing |
| 1815 | Technotron-ASTeX | Other |
| 1816 | Technotron-ASTeX | Other |
| 1817 | Technotron-ASTeX | Other |
| 1828 | Temescal BJD 1800 Ebeam Evaporator (1) | Evaporation |
| 1829 | Temescal BJD 1800 Ebeam Evaporator (2) | Evaporation |
| 1831 | Tempress boron diffusion | Doping |
| 1832 | Tempress Furnace | Oxidation |
| 1833 | Tempress Metal Anneal | Annealing |
| 1834 | Tempress Oxidation | Oxidation |
| 1835 | Tempress phosphorus diffusion | Doping |
| 1844 | TFM2.1200 Vapor Phase Deposition System | CVD |
| 1846 | TFT LPCVD LT41(low temp oxide) Bank A-3 | CVD |
| 1847 | TFT Polysilicon – Bank A-4 | CVD |
| 1848 | TFT Wet/Dry Oxide -Bank A-2 | Oxidation |
| 1852 | Thermal Deposition #1 (Digital Interface) | Evaporation |
| 1853 | Thermal Deposition #2 (Analog Interface) | Evaporation |
| 1854 | Thermal Evaporator | Evaporation |
| 1855 | Thermal Evaporator | Evaporation |
| 1856 | Thermal Evaporator Denton Vacuum Explorer 14 | Evaporation |
| 1857 | Thermal Evaporator (Bell Jar) | Evaporation |
| 1858 | Thermal Oxidation | Oxidation |
| 1860 | Thermco LPCVD Low Temperature Oxide | CVD |
| 1861 | Thermco LPCVD Poly 1/2 | CVD |
| 1862 | Thermco Oxidation Furnace | Oxidation |
| 1868 | Thermo LPCVD Nitride | CVD |
| 1873 | Thermoevaporator | Evaporation |
| 1880 | Thin Film Processing | Spin Coating |
| 1885 | Thinky Mixer | Other |
| 1923 | Tystar Bank1 Low Temp Silicon Dioxide | Oxidation |
| 1924 | Tystar Bank1 Non-Metal Anneal | Annealing |
| 1925 | Tystar Bank1 Polysilicon | Annealing |
| 1926 | Tystar Bank1 Silicon Nitride | CVD |
| 1927 | Tystar Bank2 Metal Anneal | Annealing |
| 1928 | Tystar Bank2 TEOS Silicon Dioxide | Oxidation |
| 1929 | Tystar Bank2 Wet/Dry Oxidation | Oxidation |
| 1930 | Tystar LPCVD nitride | Other |
| 1931 | Tystar LPCVD polysilicon | Other |
| 1932 | Tystar Mini-Tytan 4600 Furnace System | CVD |
| 1933 | Tystar Nitride Furnace 1 | Doping |
| 1934 | Tystar Nitride Furnace 2 | Doping |
| 1935 | Tystar Nitride Furnace 3 | Oxidation |
| 1936 | Tystar Nitride Furnace 4 | Other |
| 1937 | Tystar Oxidation Furnace | Oxidation |
| 1938 | Tystar Poly Furnace 1 | Annealing |
| 1939 | Tystar Poly Furnace 2 | Oxidation |
| 1940 | Tystar Poly Furnace 3 | Other |
| 1941 | Tystar Poly Furnace 4 | Other |
| 1942 | Tystar TEOS Deposition | CVD |
| 1952 | Ultratech/Cambridge Fiji G2 Plasma-Enhanced ALD | ALD |
| 1953 | Ultratech/Cambridge Savannah ALD System | ALD |
| 1955 | Ultron UH-102 UV Curing Oven | Resist Processing |
| 1957 | Ulvac Mini-Annealer | Annealing |
| 1959 | Unaxis PECVD | PECVD |
| 1962 | Unifilm Sputterer | Sputter |
| 1966 | UT PTL-LPCVD-Nitride | CVD |
| 1967 | UT PTL-LPCVD-Polysilicon | CVD |
| 1968 | UT PTL-LTO | CVD |
| 1975 | Vapor treatment system | Other |
| 1992 | Veeco Thermal Evaporator | Evaporation |
| 2042 | Wet/Dry Oxide – Bank B-2 | Oxidation |
| 2106 | YES Prime Oven | Other |
| 2110 | YES-310TA Vapor Prime and Image Reversal Oven | Resist Processing |
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