Description
Semiconductor Equipment and Lab equipment. These are subject to prior sale without notice. These are only for end users. Appreciate your time.
| Brand | Model | Model 2 | Wafer Size |
| Hitachi | CG4000 | – | 12 |
| KLA | F5X | Film Measurement | 8 |
| KLA | Spectra FX200 | Film Measurement | 12 |
| KLA | P20H | Profiler | 8 |
| SEZ | RST-101 | 1 Chamber | 6 |
| SEZ | 101 | 1 Chamber | 4, 6 |
| SEZ | RST 101 | 1 Chamber | 4, 6 |
| SEZ | RST-201 | 1 Chamber | 6 |
| SEZ | 303 | 1 Chamber | 12 |
| SEZ | 304 | 1 Chamber | 8, 12 |
| SEZ | 305 | 1 Chamber | 8, 12 |
| SEZ | 323 | 2 Chambers | 8, 12 |
| SEZ | 323 | 2 Chambers | 8, 12 |
| SEZ | 323 | 2 Chambers | 8, 12 |
| SEZ | 323 | 2 Chambers | 8, 12 |
| SEZ | 323 | 2 Chambers | 8, 12 |
| SEZ | DV34 | 4 Chambers | 8, 12 |
| SEZ | DV34 | 4 Chambers | 8, 12 |
| SEZ | DV34 | 4 Chambers | 8, 12 |
| SEZ | DV34 | 4 Chambers | 8, 12 |
| SEZ | DV34 | 4 Chambers | 8, 12 |
| SEZ | DV34 | 4 Chambers | 8, 12 |
| SEZ | ES34 | 4 Chambers | 8, 12 |
| SEZ | ES34 | 4 Chambers | 8, 12 |
| SEZ | DV-Prime | 8 Chambers | 12 |
| SEZ | DV-Prime | 8 Chambers | 12 |
| SEZ | DV-Prime | 8 Chambers | 12 |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| Teradyne | Magnum II ICP | – | |
| TEL | Expedius + | 12 | |
| TEL | Expedius + | 12 | |
| ASM | E2000+ | ||
| ASM | A412 | Dual ATM Oxide (Dry Oxide) | 12 |
| ASM | A412 | Dual Reactor Poly | 12 |
| ASM | A412 | Dual Reactor Poly | 12 |
| ASM | A412 | Nitride Dual Reactor | 12 |
| ASM | A412 | Vertical LPCVD Furnace (Poly) | 12 |
| ASM | A412 | Vertical LPCVD Furnace (Poly) | 12 |
| ASM | A412 | Vertical LPCVD Furnace (Poly) | 12 |
| ASM | A412 | Vertical LPCVD Furnace (Poly) | 12 |
| ASM | A412 | Vertical LPCVD Furnace (Poly) | 12 |
| ASM | A412 | Vertical LPCVD Furnace (Poly) | 12 |
| ASM | A412 | Veritcal LPCVD Furnace (NITR) | 12 |
| ASM | Eagle-12 Rapidfire | PECVD (Chemical Vapor Deposition) | 12 |
| ASM | Epsilon E2000 Plus (RP&SiGe) | ||
| ASM | A400 Furnace Single Reactor | Nitride, x01 Reactor | 8 |
| Suss Microtec | Falcon | Coat / Develop | 4, 5, 6, 8 |
| Suss Microtec | ACS200/Falcon | 3x Coater | 4, 5, 6, 8 |
| Suss Microtec | ACS200/Falcon | 4x Developer | 4, 5, 6, 8 |
| Suss Microtec | ACS300 | 4x Developer | 8, 12 |
| Suss Microtec | Gamma | ||
| Suss Microtec | Gamma | ||
| Suss Microtec | Gamma 80 | Coater-CSM | |
| Suss Microtec | Gamma 80 | Coater-CSM | – |
| Semitool | Raider | ECD 310 | 12 |
| Semitool | STORM | 300 | 12 |
| Semitool | STORM 3 | 4 | |
| Semitool | STORM 3 | 4 | |
| Semitool | SST 201 (Cintillio) | 1 Chamber | 8 |
| Semitool | SST 742 | Wet | 6 |
| Semitool | SST 742 | Wet | 8 |
| Semitool | SSTC421280M | Spray solvent tool (Phototresist) | 6 |
| Semitool | SST632 | ||
| Semitool | SRD 280 S | ||
| Semitool | SRD | ||
| Semitool | SRD | 6 | |
| Semitool | SRD | 6 | |
| DNS | FS-820 L | Wafercleaner, 3 Baths | 6 |
| DNS | FS-820 L | Wafercleaner, 3 Baths | 6 |
| DNS | SS W60A | Wafer Scrubber SS-W60A-A | |
| Hitachi | S-3400N | SEM | – |
| Hitachi | S-4500 | SEM | – |
| Hitachi | S-4700 REM | SEM | |
| Hitachi | S-4800 (Type 2 model) | SEM | – |
| Hitachi | S-5000 | SEM | – |
| Hitachi | S-5000/H | SEM | – |
| Hitachi | 7800H | CD-SEM | |
| Hitachi | S-8840 | CD-SEM | 8 |
| Hitachi | S-9260A | CD-SEM | 8 |
| Hitachi | S-9260A | CD-SEM | 8 |
| Hitachi | S-9260A | CD-SEM | 8 |
| Hitachi | S-9360 | CD-SEM | 8, 12 |
| AMAT | Semivision CX200 | – | |
| Esec | 2008XP | Die Bonder | 6 |
| Esec | 2008XP | Die Bonder | 6 |
| Ultrafab | WetBench QD72 | 2 tank Wet Bench | 6 |
| Accretech | UF200 | Prober | 8 |
| Accretech | UF200 | Prober | 8 |
| TEGAL | Tegal 901 (Poly) | Etch | 6 |
| TEGAL | 980 | QT58 | |
| TEGAL | 981 | Etch | 8 |
| Comet | (7) R20 Transfer Station | 6,8 | |
| Comet | Comet 2 Station wafer Transfer System | – | |
| Philips | XRF 2800 | 8 | |
| Prometrix | FT750-01 | – | |
| RECIF | ANF8 | Notch Aligner | 8 |
| RECIF | BPP200A01 | Transfer Station | |
| TEL | Ofen Tel Minibatch | Formula Nitride | 12 |
| TEL | Ofen Tel Minibatch | Formula Oxide | 12 |
| TEL | UW200Z | Batch wafer processing | 8 |
| AMAT | eMax CT Plus Chamber | 12 | |
| AMAT | Enabler Chamber | 12 | |
| AMAT | eMax CT Plus Chamber | 12 | |
| AMAT | eMax CT Chamber | 12 | |
| AMAT | Axiom HT Plus Chamber | 12 | |
| AMAT | Enabler Chamber | 12 | |
| KLA Tencor | P11 Surface Profiler | – | – |
| IPEC/Westech | Avanti 472 | Wafer Polisher | 6 |
| TePLA | 303 AL PC | Plasma/Etch | 6 |
| PVA TePLA | 300 AL PC | Photoresist Stripping, Surface cleaning | 6 |
| Linn High Therm | KH-64-S | Coating oven | – |
| Leica | INS-200 | ||
| Rigaku | System R3630 | RR42036 Wafer Analyser(XRF) | |
| Dektak 8 | |||
| LDS 3 | LGS 200A | ||
| LDS 1 | Laserjet LDS | 200A | |
| Matech | Waveetch | 456G2 | |
| Fluidair | Acid Etch | HF_HN03_HCI | |
| Tencor | FLX-2908 |
SS6540-1-1-1
