Description
Please contact us for the availability of the PVA Tepla 660 used semiconductor equipment.
Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Fast and damage free plasma processing. Rotating stage inside chamber for even plasma cleaning. Three MFC controlled process gas inputs and one vent gas input. Includes oil free dry pump. Year of Mfg.: 2008.
The items are subject to prior sale without notice. These items are only for end users.
SS5626