Description
Please contact us for the availability of the following used semiconductor equipment and parts- PVA Tepla 660 Microwave Plasma Cleaning System
- Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
- The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines.
- Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there.
- Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform.
- Any size of magazine can be processed.
- Fast and damage free plasma processing.
- Rotating stage inside chamber for even plasma cleaning.
- Three MFC controlled process gas inputs and one vent gas input.
The items are subject to prior sale without notice. These items are only for end users.
SSEB380
