Description
Please contact us if you are interested in the following Packaging Equipment. The Packaging Equipment are only for end users and are subject to prior sale without notice. Appreciate your time.
| Equip Code | Name | Type |
| 53 | ACF Heat Sealer | Bonding |
| 62 | ADT 7100 Dicing Saw | Dicing |
| 63 | ADT 7100 Dicing Saw | Dicing |
| 132 | AML Wafer bonder | Bonding |
| 153 | Aqueous Cleaner | Other |
| 188 | Au Ball Bonder | Bonding |
| 192 | Autoclave | Other |
| 196 | Automatic Dicing Saw | Dicing |
| 198 | AWB04 Wafer Bonder | Bonding |
| 204 | Ball Bonder | Other |
| 207 | Ball Wire Bonder | Bonding |
| 227 | BGA Rework Station | Other |
| 276 | Bump Plating Machine | Other |
| 326 | CMP System | CMP |
| 398 | Dage Shear Tester | Other |
| 402 | Decapsulation System | Other |
| 436 | Dicing Saw | Dicing |
| 437 | Dicing Saw | Dicing |
| 438 | Dicing Saw-DISCO | Dicing |
| 439 | Die Bonder | Bonding |
| 457 | Disco 552 Saw | Dicing |
| 458 | Disco Automatic Dicing Saw 3220 | Dicing |
| 459 | Disco DAD3240 Automatic Dicing Saw | Dicing |
| 460 | Disco Dicing Saw | Dicing |
| 461 | Disco wafer dicing saw | Dicing |
| 462 | DISCO Wafer Saw | Dicing |
| 463 | Disco-Saw | Dicing |
| 467 | Dispenser | Other |
| 468 | Dispensing Tool | Bonding |
| 571 | EV Group Wafer Bonder | Bonding |
| 582 | EVG 501 Wafer Bonder | Bonding |
| 583 | EVG 510 Wafer Bonder | Bonding |
| 587 | EVG 620 Wafer Bond Aligner | Bonding |
| 591 | Excimer Laser | Other |
| 637 | Finetech Flip Chip Bonder | Bonding |
| 638 | Finetech Sub-micron Flip-chip Bonder | Bonding |
| 645 | Flip Chip Bonder | Bonding |
| 646 | Flip-Chip Bonder | Bonding |
| 647 | Flipchip Bonder | Bonding |
| 648 | Flow Mach2-1313b Waterjet Cutting Machine | Dicing |
| 683 | Fusion Splicer | Other |
| 714 | GnP Poli-400L | CMP |
| 902 | K&S 1472 Wire Bonder 1 | Bonding |
| 903 | K&S 1472 Wire Bonder 2 | Bonding |
| 904 | K&S 4124 Wire Bonder | Bonding |
| 905 | K&S 4522 Ball Bonder | Bonding |
| 906 | K&S 4523 Ball Wire Bonder | Bonding |
| 907 | K&S 4523A Wedge Wire Bonder | Bonding |
| 908 | K&S 4523AD Wire Bonder | Bonding |
| 923 | Karl Suss SB6 Bonder | Bonding |
| 924 | Karl Suss SB8E Bonder | Bonding |
| 949 | KS Ball Bonder | Bonding |
| 951 | Kulicke 4523 Wire Bonder | Bonding |
| 958 | Lam IPEC 472 CMP | CMP |
| 962 | Laminator | Other |
| 963 | lapping-1 | Other |
| 1015 | Logitech CMP | CMP |
| 1016 | Logitech LP50 Lapper | Other |
| 1017 | Logitech PM5 Polisher 1 | Other |
| 1018 | Logitech SS Bonder | Bonding |
| 1037 | LSD-100 Scriber/Cleaver | Other |
| 1048 | Manual Flip Chip Bonder | Bonding |
| 1051 | Manual Wire Bonder | Bonding |
| 1101 | Microdrill | Drilling |
| 1148 | Molding Press | Other |
| 1365 | Pick & Place | Other |
| 1376 | Plasma Cleaner | Other |
| 1433 | Precision CNC Dicing / Cutting Saw | Dicing |
| 1434 | Press | Other |
| 1479 | Quick Circuit 7000 PCB Milling Machine | Other |
| 1524 | Reflow Oven | Other |
| 1580 | SAW3 | Dicing |
| 1583 | SB1 | Dicing |
| 1610 | Screen Printer | Other |
| 1611 | Screen Printer | Other |
| 1631 | Semi-Automated Die Bonder | Other |
| 1633 | Semi-Automatic Wire Bonder | Bonding |
| 1749 | Stencil Printer | Other |
| 1799 | Suss SB8e Substrate Bonder | Bonding |
| 1809 | Tape Frame Applicator | Dicing |
| 1947 | Ultrasonic (wedge) Wire Bonder | Bonding |
| 2017 | Wafer Back Grinder | Other |
| 2018 | Wafer Bonder | Bonding |
| 2019 | Wafer Cleaner | Other |
| 2020 | Wafer Dicing Saw | Dicing |
| 2022 | Wafer Level Bonder | Bonding |
| 2023 | Wafer Mount Station (MicroAutomation) | Other |
| 2024 | Wafer Polisher | CMP |
| 2028 | Wedge Bonder | Other |
| 2029 | Wedge/Ball Bonder | Other |
| 2030 | WestBond | Bonding |
| 2031 | Westbond Wirebonder | Bonding |
| 2032 | Westbond Wirebonder | Bonding |
| 2043 | WIBO1 | Bonding |
| 2045 | Wire Bonder | Bonding |
| 2046 | Wire Bonder | Bonding |
| 2047 | Wire Bonder | Bonding |
| 2048 | Wire Bonder | Bonding |
| 2050 | Wirebonder | Bonding |
| 2051 | Wirebonder (Ball) | Bonding |
| 2052 | Wirebonder Wedge | Bonding |
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