Description
Please contact us for the availability of the Oxford Instruments Plasmalab 180 ICP used semiconductor equipment.
ICP Inductively Coupled Plasma High Density Etching System. The Plasmalab System 100 ICP 180 is a load locked plasma etching system configured for reactive ion etching with ICP (Inductively Coupled Plasma) source. The system control is done by computer which provides fully automatic operation. Maximum substrate size 150 mm, currently configured for 100 mm wafers. Chuck type mechanical clamping. Backside helium cooling. Alcatel turbo pump with controller and roughing pump. Gas box with six MFC gas controllers. Previously used gases CHF3/CHF4, C3F8, C4F8, Argon, Oxygen, Hydrogen, Chlorine. 208V, 3 Ph, 50/60 Hz.
The items are subject to prior sale without notice. These items are only for end users.
SS5626