Description
Please contact us for the availability of the Oxford Instruments 80 Plus RIE used semiconductor equipment.
Compact Plasma Reactive Ion Etching System RIE. The vacuum chamber is configured for optimal gas conductance at the wafer thus maximizing etch rate and uniformity. All parameters controlled via front panel display. 9 in. dia. platen. Previously used with four MFC and gases used were CF4, O2, CHF3, AR. Does not have turbo pump option installed. Includes vacuum pump. 208V, 3 Ph, 60 Hz.
The items are subject to prior sale without notice. These items are only for end users.
SS5626