Description
Nordiko 2000 Sputtering Deposition System. Control of pumpdown, valving, wafer transfer, and deposition is provided by a Model 5TI Process Controller. This Controller is simple, reliable, and also has a manual control feature to facilitate maintenance and enable the performance of special processes requiring manual control.The Nordiko 2000 is designed primarily for R&D (Advanced Process Development) and Pilot Production applications. The “base” Nordiko 2000 can be configured without an automation system or load lock for restricted budgets. These items can be modularly added on as the application and funds develop.
- Substrate heat to 350ºC, 550ºC or 850ºC.
- Substrate cooling via water-cooled or gas injected work holder with auto clamping.
- High power RF bias with excellent power transfer stability during rotation.
- RF etch capability.
- Four sputtering electrodes; 2″, 3″, 4″, 6″, and 8″ diameter planar target electrodes.
- Sequential or co-deposition sputtering modes.
- Target electrodes are arranged in the same plane as standard, but cluster-focused or off-axis geometry’s are available
- Source to substrate distance may be varied during process.
- Work holder may be dedicated to a full load of wafers, or segmented to allow for a variety of process options.
- Work holder may be used in static or rotational operation.
- Ion Beam “soft etch” using Nordiko patented RF excited filamentless ion beam gun.
- Automated load lock .
- Process control automation system.
- AII mechanized set-points are stored in software for easy adjustment from key board
- Installation through clean room wall or free standing.
- All servicing from rear of machine.
- Small foot print.
- 24.5″ diameter stainless steel substrate table.
- Up or down sputtering geometry’s.
Valid time: Subject to prior sale without notice.
Contact us (sales@semistarcorp.com) for the availability and more info pls. Appreciate your time.
ID-SS1184