Description
NEE-4000 E-Beam Systems Electron Beam Evaporation (Download Brochure)
The Electron Beam Evaporation System is available in two different configurations. A compact vertical dual chamber configuration features a 14″ cube main chamber where the platen is located, and underneath the main chamber a secondary chamber is provided for housing the e-beam source. This configuration can be provided with a gate valve between the two chambers to be used as a load lock to keep the e-beam source and the evaporation pockets in vacuum while substrates are loaded and unloaded from the main chamber. For applications where automatic loading and unloading of wafers are needed, a third load lock chamber is attached to the left face of the cube for another load lock. In this case, the main chamber can be kept at low 10-7 Torr range at all times and evaporation can start just a few minutes after loading the wafer. The second configuration features a single large chamber design that allows e-beam evaporation guns, magnetrons, and thermal evaporation mounted onto the baseplate. In this configuration coating of mulitple wafers are possible using planetary substrate holder.NANO-MASTER offers combinatorial evaporation system using substrate masking and computer controlled evaporation rates for individual e-beam evaporators
- Electropolished 14” cubical or 21”x21”x22” 304L SS chamber
- 5×10-7 Torr base pressure attained with turbomolecular pumping package
- 4x 15cc pocket E-gun
- Source and substrate shutters
- 6kW and 10kW switching power supply
- Automatic pocket indexing
- Programmable sweep controller
- 26” x 44” footprint with SS panels for Class 100 cleanrooms
- Quartz crystal thickness sensor
- Substrate rotation
- LabVIEW user interface
- EMO protection and safety interlocks
Options
- Substrate heating up to 800°C or cooling
- Glancing Angle Deposition (GLAD) with rotation
- Planetary substrate holder
- Substrate RF/DC bias
- Dual e-beam source for co-evaporation
- Ion source for substrate cleaning and ion assisted evaporation
- Additional PVD sources (thermal, sputtering)
- MFC’s for reactive evaporation
- Automatic load/unload
Applications:
- Lift Off
- Optical Coatings
- Thin Film Transistors
- Active CIGS layer
- Josephson Junctions
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Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid
SS10840
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