Description
K&S 7100ad wafer dicing saw
Condition: Used
Valid Term: These are subject to prior sale. These are only for end user. Appreciate your time.
Location: CA, USA-SS7270W
Info for your reference.
- Precision dicing saw for silicon wafers and thin substrates up to 200mm diameter
- accepts 2″/3″ hubbed or annular blades
- DC brushless 60,000 rpm air bearing 1.2Kw motor
- 0.2u resolution
- feed rate up to 350mm/s
- touch down blade height sensor
- Matrox vision system with auto focus and auto illumination
- 2x-8x zoom
- 2 arc-sec rotary axis repeatability
- 200-240v, 50/60hz
- software ver. 4.3.2
- operating manuals
- specify 200mm or 150mm ceramic wafer chuck.
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