Model: Branson/IPC 3100 semiconductor process equipment
Category: Plasma Asher Plasma Descum
Original Equipment Manufacturer: Branson/IPC
Condition: AS IS,WHERE IS ( Refurbished by seller is optional at extra charge)
Wafer Size: 6 inch configuration. Other wafer size is optional.
Valid Time: Subject to prior sale
Lead Time: Ready to go
Location: Silicon Valley, CA, U.S.A.
Installation and training: Available at extra charge at refurbish condition
Service Contract: Available at extra charge at refurbish condition
Branson/IPC 3100 description for reference
The Branson/IPC 3100 Plasma Systems generate a low pressure, low temperature gaseous plasma. In this machine plasma reactions, such as ashing, etching, and polymer surface modification can be performed quickly and reproducibly. The Branson/IPC 3100 comprises a source of RF electrical power, means for coupling the RF power into the plasma treatment chambers, and a system to control the flow of reactant plasma gases.
The reactor treatment chambers vary from model to model in this series. Each chamber has a hinged access door through which samples are inserted or removed. The door is sealed with a bell jar gasket. The RF generator in this series provides RF power, dynamically regulated to maintain constant level into a normal load or to limit power output if the load is removed.
Two seperate units are provided which are interconnected by gas hoses and electrical cables. These are the RF GENERATOR and the REACTOR CENTER. The REACTOR CENiER contains the Reactor Chambers, the Gas Controls, RF Power Matching Controls, and Timer.
All the Branson/IPC 3100S Plasma Asher Plasma Descum semiconductor process equipment trademarks belongs to Branson/IPC, the original equipment manufacturer. All rights reserved.