Description
Please contact us for the availability of the used ATC-Orion 5 UHV with Load-Lock ATC ORION SERIES SPUTTERING SYSTEM.
Info from OEM for your reference only.
Compact Systems
- Price range: $50,000 – $300,000
- 10″, 12″ and 14″ chamber Ø
- HV and UHV versions
- 1.5″, 2″ and 3″ sputter sources
- Substrate holders to 6″ Ø
- Load lock
- Substrate cassettes
- Auto-loading
- Computer control
- Custom engineered versions
- Much more than a tabletop system
AJA International ATC Orion Series Sputtering Systems are compact versions of the popular ATC Flagship Series physical vapor deposition tools designed to deliver maximum performance for limited budgets. These HV and UHV systems inherit many design features and common parts from the highly evolved ATC sputtering tools. The standard ATC Orion modules (chambers, frames, cluster flanges, etc.) are generally in stock at AJA thereby reducing delivery times.
These popular systems use AJA’s exclusive Stiletto (HV) and A300-XP (UHV) magnetron sputtering sources (2″ and 3″) and can be fitted with heating and cooling stages to accommodate substrates up to 6″ Ø. Substrate temperature ranges from cooled LN2 to 1000°C are available depending on size and configuration. Typically, ATC Orion Systems feature a number of fixed angle sputter sources. The Orion 8 accommodates up to (8) 2″ sputter sources or (5) 3″ sputter sources, the Orion 5 accommodates up to (5) 2″ sputter sources. A special version of the Orion 8 is also available that features (4) 2″ magnetron sputtering sources with in-situ tilt capability. ATC Orion Systems can also be easily connected to each other or to other ATC Systems for multi-chamber (e.g. metal/oxide) or multi-technique (e.g. sputter/evaporation/PLD/ion milling) configurations.
ATC-Orion 5 UHV with Load-Lock : Fitted with up to (5) 2″ UHV magnetron sputter sources.
ATC-Orion 8 UHV : Fitted with up to (5) 3″ or (8) 2″ UHV magnetron sputtering sources. This unit features a turbo-pumped vacuum load lock with 6 position cassette.
ATC-Orion 8 HV : Fitted with up to (5) 3″ or (8) 2″ HV magnetron sputter sources. This unit features a HiPIMS power supply.
The ATC Orion Series Sputtering Systems feature a con-focal sputter source flange oriented at specific angles determined from many years of experience with the in-situ tilt sources found on the flagship ATC systems. The specially designed chimney/ground shield/shutter system allows a high degree of deposition uniformity over substrates more than twice the target diameter. A typical deposition profile with SiO2 on a 4″ diameter Si wafer is shown.
Deposition rate is a function of sputter yield of the material, maximum allowable power density into the target (depends on heat transfer capability of target material), and type of power used (e.g. RF, DC, pulsed DC).
Maximum deposition rates are achieved with materials such as Au – high sputter yield, excellent heat transfer material and can be sputtered with DC (most efficient).
Slow deposition rates can be expected with materials such as Al2O3 – very low sputter yield, poor heat transfer material and must be sputtered with RF (1/2 the efficiency of DC). Typical rates are 0-18 Å/sec with Au, 0-9 Å/sec with Cu and 0-0.16 Å/sec with Al2O3 in a confocal configuration with 2″ sources on a 100 mm Ø substrate.
Direct deposition at short working distances (50-100 mm) can achieve higher rates but con-focal geometry results in much better uniformity, the ability to co-deposit alloy films and the ability to grow better ultra-thin film multilayers since the substrate is always “in the plasma.” The cost of the smaller targets employed in con-focal configurations can also significantly reduce operating cost.
The items are subject to prior sale without notice. These items are only for end users.
SSEB380
