Description
Refurbished STS / SPTS Multiplex Bosch ICP DRIE Deep Silicon Etcher
SemiStar Corp. offers a refurbished STS / SPTS Multiplex Bosch Process ICP DRIE Etcher. This system is designed for deep reactive ion etching (DRIE) of silicon and is suitable for Bosch Process deep silicon etch, MEMS fabrication, silicon micromachining, deep trenches, high-aspect-ratio structures, and semiconductor research and development.
This available STS Multiplex Bosch ICP DRIE system is configured for 4-inch wafers with a single-wafer loadlock, electrostatic chuck (ESC), helium backside cooling, independent ICP coil and platen RF power, multiple process gas MFCs, and a Leybold MAG900 turbomolecular pump.
SemiStar will supply this system in refurbished working condition to OEM specifications with its current equipment configuration. The system will be inspected, cleaned, refurbished, repaired as necessary, and functionally tested before shipment. Installation, startup assistance, training, and warranty can be provided according to the final quotation and project scope.
Photos show the actual available STS Multiplex Bosch Process ICP DRIE system. Final refurbishment scope, acceptance criteria, delivery schedule, installation, and warranty are based on SemiStar’s official quotation.
STS Multiplex Bosch ICP DRIE System Configuration
| Item | Configuration |
|---|---|
| Manufacturer | STS |
| Model | STS Multiplex Bosch Process |
| System Type | ICP DRIE Deep Silicon Etcher |
| Primary Process | Bosch Process Deep Reactive Ion Etching (DRIE) |
| Wafer Size | 4 inch |
| Wafer Handling | Manual / Single-Wafer Loadlock |
| Process Modules | 1 Process Module |
| Chuck | Electrostatic Chuck (ESC) |
| Backside Cooling | Helium Backside Cooling |
| ICP Coil RF Generator | ENI ACG-10B, 0–1000 W |
| Platen RF Generator | ENI ACG-3B, 0–300 W |
| High Vacuum Pump | Leybold MAG900 Turbomolecular Pump |
| Gas Delivery | Multiple MFC Gas Lines / Remote Gas Box |
| Electrical Power | 208 VAC, 60 Hz |
Actual Installed Process Gas / MFC Configuration
The available STS Multiplex Bosch ICP DRIE system is equipped with the following process gas MFC configuration. In addition to the primary SF6 and C4F8 Bosch Process chemistry, the system has additional installed gas capability for compatible ICP plasma etch process development.
| Gas | MFC Range | MFC / Configuration |
|---|---|---|
| C4F8 | 200 sccm | Mykrolis |
| SF6 | 200 sccm | Mykrolis |
| CH4 | 0–200 sccm | Tylan |
| H2 | 0–200 sccm | Tylan |
| O2 | 100 sccm | Tylan / N2-Calibrated MFC |
| Ar | 50 sccm | Tylan / N2-Calibrated MFC |
| SF6 | 0–100 sccm | MKS |
| C2F6 | 0–100 sccm | MKS |
| Cl2 | 0–200 sccm | MKS |
| SiCl4 | 0–99.9 sccm | MKS / BCl3 0–100 sccm MFC |
Bosch Deep Silicon Etch Process
The STS Multiplex Bosch Process platform is designed for deep silicon etching using alternating etch and passivation cycles. The Bosch process typically uses SF6 for silicon etching and C4F8 for sidewall passivation. Repeated etch and passivation cycles enable deep, anisotropic silicon structures with high aspect ratios.
The ICP source and platen bias are independently powered. The ICP coil provides high-density plasma, while the platen RF controls ion energy at the wafer. The electrostatic chuck and helium backside cooling provide wafer holding and thermal management during the etch process.
The system’s additional installed gas configuration provides hardware flexibility for other compatible ICP plasma etch process development. Actual process performance depends on substrate, material stack, mask material, feature geometry, recipe, chamber condition, and process requirements.
Typical Applications
- Bosch Process deep silicon etching
- Deep Reactive Ion Etching (DRIE)
- MEMS fabrication
- Deep silicon trenches
- High-aspect-ratio silicon structures
- Silicon micromachining
- Through-wafer silicon etching
- SOI wafer processing
- MEMS trenches and cavities
- Microfluidic structures
- Silicon sensor fabrication
- University, research institute, and semiconductor R&D applications
Key System Features
- STS Multiplex Bosch Process ICP DRIE platform
- 4-inch wafer configuration
- Single-wafer loadlock
- Electrostatic chuck (ESC)
- Helium backside wafer cooling
- Independent ICP coil and platen RF power
- ENI ACG-10B 1000 W ICP RF generator
- ENI ACG-3B 300 W platen RF generator
- Leybold MAG900 turbomolecular high-vacuum pump
- Multiple installed process gas MFCs
- SF6 and C4F8 configuration for Bosch deep silicon etching
- Additional CH4, H2, O2, Ar, C2F6, Cl2 and SiCl4 / BCl3 MFC capability
Refurbished to OEM Specifications
SemiStar supplies this STS Multiplex Bosch ICP DRIE system in refurbished working condition to OEM specifications with the current system configuration. The objective of the refurbishment is to restore the equipment to proper operating condition while maintaining the original STS system architecture and installed configuration.
The refurbishment scope includes inspection and cleaning of the system, process chamber and loadlock; troubleshooting of electrical, mechanical, vacuum, RF, gas delivery, cooling, control, and wafer handling systems; repair or replacement of necessary components; verification of the vacuum system; RF generator and matching system testing; gas delivery and MFC testing; ESC and helium backside cooling verification; loadlock operation testing; control system testing; and final system functional testing.
Components are repaired, refurbished, or replaced as necessary according to system condition and the final refurbishment scope. The completed system will be tested prior to shipment. Final acceptance requirements and any customer-specific process testing are defined in SemiStar’s official quotation.
Why Buy a Refurbished STS Multiplex Bosch DRIE?
The STS Multiplex Bosch platform has been widely used in semiconductor fabs, MEMS facilities, universities, and research laboratories for deep silicon etching. A properly refurbished system can provide an economical alternative for organizations that require proven ICP DRIE technology without purchasing a new-generation DRIE system.
SemiStar combines equipment refurbishment, spare parts, technical support, installation, and field service to support the equipment after delivery. The actual system configuration is clearly documented so customers can evaluate the equipment against their process and facility requirements before purchase.
Application Review
Deep silicon etch requirements can vary significantly between applications. Before ordering, customers should provide their wafer size, substrate material, mask material, target etch depth, minimum feature size, required aspect ratio, sidewall profile, desired etch rate, process gases, and any special wafer handling or temperature-control requirements.
SemiStar can review these requirements against the actual STS Multiplex Bosch ICP DRIE configuration before finalizing the equipment quotation.
Related STS / SPTS Equipment
SemiStar may also have other STS / SPTS refurbished equipment available, including Multiplex Bosch DRIE, ICP RIE, HRM, M/PLEX, and other plasma etch configurations.
For other RIE, ICP and DRIE equipment, please visit our RIE / ICP / DRIE / Bosch Process equipment category.
Important Notes
- This equipment will be sold in refurbished working condition to OEM specifications with the current configuration.
- Refurbished equipment availability is subject to prior sale.
- Photos show the actual available equipment unless otherwise noted.
- Installed MFCs and gas configuration are based on the current equipment configuration.
- Actual process results depend on wafer material, mask, feature geometry, process recipe, facilities, and application requirements.
- Specific customer process performance is not guaranteed unless explicitly included as an acceptance requirement in SemiStar’s quotation.
- Final refurbishment scope, acceptance criteria, installation scope, warranty, delivery schedule, and commercial terms are based on SemiStar’s official quotation.
- SemiStar does not provide spare parts or service support for STS / SPTS systems not sold by SemiStar.
- All OEM names, trademarks, and model names belong to their respective owners.
- All website information is for reference only and is not a purchase specification. Final configuration, scope, price, specifications, and terms are based on SemiStar’s official quotation.
Request a Quote for STS Multiplex Bosch ICP DRIE
Please contact SemiStar with your target application and required configuration. Helpful information includes wafer size, substrate material, material to be etched, mask material, target etch depth, minimum feature size, required aspect ratio, sidewall requirements, process gases, facility limitations, budget, and expected purchase timeline.
Contact SemiStar
SS380-MSP-325-OEM-43