The Appiled Materials 0200-10042 QUARTZ COVER,INNER,8”,NOTCH,STEP3,ESC AMAT Etch is only for end user. Please contact us if you have any questions. Subject to prior sale without notice. Appreciate your time!
Location: USA
QTY: >40
Condition: New
ID-SS380EB
Metrology | Tester | Wafer Carriers
Main Refurbished Equipment
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SeriesIn-line Systems,SIV SeriesSDH-4550LR&D,CS-200, 300mm,ENTRON-EXENTRON-EX2,Evaporation Roll Coater,EW SeriesR&D/Pilot Production,Ei-5In-line Systems,Ei-H series,Si Processing,IMX-3500SOPHI-200/260 ,SiC,IH-860,Brazing Furnace,FB SeriesFHHn series ,Vacuum Sintering,FSC ,eriesVacuum,Induction Melting,FMI Series,Vacuum Heat Treatment,FHB-60CFHV Series,Single-Substrate,CC Series,CME Series,In-line Systems, ULGLAZE Series,Lyophilizer,DFB Series,Micropowder Dry, UPD-400D,FM Series,DFR Series,Centrifugal Type,CEH-400B,ULVAC,Rapid Thermal Process, Modular Process Technology, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG 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RTA-4000,ULVAC RTA-6000,ULVAC RTA-8000,ULVAC RTA-12000, EasyTube® 3000EXT, CVD Equipment Corporation, Dr. Eberl MBE-Komponenten GmbH, AO 600,Rapid Thermal Annealing System,MBE Components,MBE Systems,OCTOPLUS 300,OCTOPLUS 400,OCTOPLUS 500,OCTOPLUS 500 EBV,OCTOPLUS 600,OCTOPLUS 600 EBV,OCTOPLUS-O 400,Thin Film Systems,Organic Deposition System,Rapid Thermal Annealing,MBE Components,Thin Film / CIGS / CZTS / CdTe,ECM, Annealsys AS-Premium, Annealsys Zenith-100, Annealsys AS-One, Annealsys AS-Master, Jipelec JetStar, Annealsys AS-Micro, Jipelec JetLight, Jipelec JetFirst 100, Jipelec JetFirst 200, Jipelec JetFirst 300, CreaTec Fischer & Co. 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formation,radical-based oxidation process,rapid thermal processing spike anneal,300mm RTP spike anneal process,ramp-up methodologies, rampdown methodologies,Rapid thermal annealing apparatus,RTA furnace,Dai-ichi Kiden,Dai-ichi Kiden RSA, Combustion furnace, High vacuum heating system, Vertical high temperature heating system,Induction heating system(elevating),Ultra high temperature heating system,CreaTec Fischer,Growth Systems,Mini MBE System,LT-STM/AFM,Evaporators,Centrotherm,centrotherm c.HORICOO 300 ,horizontal batch-type system,centrotherm c.HORICOO 200 , field-proven , ultra-versatile tube furnace system ,centrotherm c.VERTICOO , batch-type wafer processing , semiconductor device fabrication, atmospheric processes, LPCVD processes,centrotherm c.ACTIVATOR, high-temperature annealing, high-volume SiC device manufacturing, electrical activation , post implantation annealing ,SiC MOSFET , diode manufacturing,Cost-efficient dopant activation,Annealing of AlN seed layers , Annealing of AlN epitaxial layers,centrotherm c.OXIDATOR , high-temperature oxidation furnace , Rapid Thermal Processing system for silicon and compound semiconductors,c.RAPID 200,fully automatic loading system,centrotherm PECVD,c.PLASMA, c.DIFF,centrotherm highly versatile diffusion,wide band gap,c.CRYSCOO HTA,AP Systems,AP Systems Korea,KORONA RTP-12MP, KORONA RTP-12LPO , KORONA RTP-12LR/LPRR,Seebeck Coefficient / Electric Resistance Measurement System ZEM-3 series，Mini Lamp Annealer MILA-5050， Atmospheric Thermoelectric Module Evaluation System F-PEM，
