Description
Nordiko 8550 Sputtering Deposition System. The main chamber is pumped commonly by a CTI Cryotorr 8 cryogenic pump with a speed of 1400 liters/second for Nitrogen and 4000 liters/second for water vapor. Cryopump autoregeneration is standard on automatic systems with hot Nitrogen purge. The cryo is backed by a two stage direct drive rotary pump with a speed of 28 m3/hr (19.5 CFM @ 60 Hz). Turbomolecular pumping options are also available for reactive applications or in requirements which demand rapid system cycling. Automatic pump down control is standard on all Nordiko deposition systems. The Nordiko microprocessor based system allows either fully automatic pump down control or interlocked manual control. A combined inverted magnetron-dual Pirani gauge unit with digital read out is used to provide a pressure signal to the control system for changing over from rough to fine pumping. A capacitance manometer is available where more accurate measurement and control is desirable. The main chamber Pirani gauge is used to monitor pressure during sputtering. The Nordiko is an enlarged version of the 2550 tool, encompassing increased chamber volume and substrate table capacity, for the highest throughputs possible for Full Production.
- Six sputtering electrode capacity; 8″ (200mm) diameter planar targets.
- Sequential multi-layer processing or co-deposit from any alternating pair of electrodes.
- Oversize 32.5″ (800mm) diameter work holder can accommodate a large number of substrates for maximum loading and subsequent batch processing.
- Four sputtering electrode capacity; 10″ (250mm) diameter planar targets.
- Accommodates substrates up to 6″ x 6″ or 8″ diameter with excellent uniformity characteristics.
Valid time: Subject to prior sale without notice.
Contact us (sales@semistarcorp.com) for the availability and more info pls. Appreciate your time.
ID-SS1184