Description
MesoSPHERE™ Plasma System
OEM: Nordson MARCH
Condition:Used.
Photos and configuration: Contact us for detail. MesoSPHERE Plasma System
Whether it is fan-in, fan-out, wafer-level or panel-level, the MesoSPHERE™ system is ideal for very high-throughput processing of wafers or substrates up to 480mm. It includes field-proven plasma chambers along with an innovative handling system that can transfer round or square substrates and frame or bonded carriers. Built upon the patented F3 symmetrical chamber design, all areas of the substrate are treated equally, ensuring excellent within wafer and wafer-to-wafer uniformity.
- Modular design allows capacity increase on a per plasma chamber basis
- EFEM integration supports from 1 to 4 plasma chambers
- Pocket chuck design ensures accurate substrate placement and centering, maximizing process repeatability
- Configurable for wafer, wafer-on-frame, and round/square substrates up to 480mm
- Plasma confinement technology isolates plasma distribution directly above the wafer, minimizing undesired secondary reactions
The items are subject to prior sale without notice. These items are only for end users.
SS7486