Description
StratoSPHERE™ Plasma System
OEM: Nordson MARCH
Condition:Used.
Photos and configuration: Contact us for detail. StratoSPHERE Plasma System
Designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Its three-axis symmetrical chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results.
- Software controlled change-over minimizes transition from 200mm to 300mm wafers
- Production-ready wafer handling supports backside or edge-grip transfer of wafer
- Modular design allows single- or dual-chamber system configuration
- Load ports support 200mm open cassettes or 300mm FOUP
- Unique end-effector design can transfer a variety of wafer thicknesses and weights
- Chamber kits isolate plasma distribution directly above the wafer, maximizing uniformity and throughput
The items are subject to prior sale without notice. These items are only for end users.
SS7486