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Plasma Enhanced CVD System (PECVD System)

Description

Please contact us for the availability of the following used Plasma Enhanced CVD System (PECVD System) semiconductor equipment 

Info from OEM for your reference only.

PECVD processing is used for substrates that have a lower thermal budget requirement. A plasma of the reacting gases is formed in an electric field (DC or RF) to allow reactions to occur and layers to deposit at a lower temperature.

The PECVD systems are designed and manufactured for industrial applications. The OEM also offers EasyTube® PECVD systems through our FirstNano® brand of R&D products. The EasyTube® 2000 is a small footprint PECVD system for wafer sizes up to 4″, while the EasyTube® 3000 can process up to a 6″ wafer.

The item is only for end user. The item is subject to prior sale without notice.

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