AG Associates Heatpulse 2146 Rapid Thermal Annealing

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AG Associates Heatpulse 4100, 4108, 8108, 8800 RTP; STS / Plasma-Therm / Oxford PlasmaLab RIE, ICP, DRIE, PECVD; Temescal / TES / CPA Evaporator, Sputter; Perkin-Elmer / MRC / TES Sputter; Lam Research / Tegal / Matrix / Branson/IPC / Gasonics Plasma Asher, Plasma Etcher etc.

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GmbH SemiTEq JSC Prevac EIKO ENGINEERING，LTD Epiquest SKY TECHNOLOGY GC inno Fermi ACME (Beijing) Technology Co., Ltd CETC48 Pengcheng Semiconductor Technology Anhui Epitaxy Technology Co,.Ltd Shanghai Shilu; Microscope-based Film Thickness Measurement Instrument: Holmarc HORIBA ZEISS KLA Corporation Lasertec Corporation Bruker Otsuka Electronics Nanometrics Incorporated Ellipso Technology Filmetrics JA Woollam Angstrom Sun Technologies Semilab JASCO Inc Park Systems GmbH Avantes StellarNet Inc. Scientific Computing International. KaPatek Sentech Optosky; Epi Wafer: Visual Photonics Epitaxy GlobalWafers Applied Materials Nichia Showa Denko Century Epitech Desert Silicon Intelligent Epitaxy Technology IQE Jenoptik MOSPEC Semiconductor Norstel OMMIC Roditi Silicon Valley Microelectronics SVT Associates University Wafers Wafer Works Xiamen Powerway Advanced Material; Wafer Tape UV IrradiatorWafer Tape UV Irradiator: Nitto Denko ADT LINTEC Corporation Teikoku Taping System Semiconductor Equipment Corporation CUON Solution OHMIYA IND.CO.,LTD. Henan General Intelligent Equipment N-TEC Corp Shenzhen Sankun Technology Futans Electronic Technology Shenzhen Height-LED Technology;Solid-State Cooling : AMS Technologies AG Antylia Scientific EVERREDtronics Ferrotec Holdings Corp. Hi Z Technology II VI Inc. Komatsu Ltd. Kryotherm Laird Thermal Systems Inc. Merit Technology Group P and N Technology Xiamen Co. Ltd. Phononic RMT Ltd. Solid State Cooling Systems Spectra Lab Instruments Pvt. Ltd. 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Ulvac Inc; Transfer Machinery: Sinfonia Gnutti Transfer AGME Riello Sistemi KesTECH Hinterkopf Rototrans Zobbio PICCHI Hirata Spada Transfer Technology Howa SLEE Medical JCE BIOTECHNOLOGY Buffoli Industries Innovative Automation Kaufman TCA Technologies Yield Engineering Systems Advance Lifts; Maglev Turbo Pumps (STP): Leybold Pfeiffer Osaka Vacuum Edwards Vacuum Shimadz Agilent Technologies ULVAC EBARA Beijing Zhongke Instrument Zhongke Jiuwei Technology; Metal Furnace: Cremer CARBOLITE GERO ECM GROUP Seco/Warwick BMI Fours Industriels TAV The Furnace Source PVA TISOMA CM Furnaces Elnik Systems, LLC. Materials Research Furnaces AVS, Inc Ningbo Hiper Vacuum Technology Co.,Ltd Sinterzone LINGQI Haoyue Jutatech Meige; Tape for Dicing: Nitto Denko Corp Mitsui Chemicals Inc. Sumitomo Bakelite Co. Ltd. AI Technology LINTEC Corporation Denka Company Limited Ultron Systems Inc. Pantech Tape Co. Ltd. QES GROUP BERHAD Nippon Pulse Motor Loadpoint Limited Daest Coating India Pvt. Ltd. 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Woollam Co.(US) Horiba(Japan) Gaertner Scientific Corporation(US) Semilab(Hungary) Sentech(Germany) Holmarc Opto-Mechatronics(India) Ellitop-Products(China) Accurion(Germany) Angstrom Sun Technologies(US) Film Sense(US); Building Integrated Photovoltaics (BIPV) : First Solar Sharp Yingli Solar Solar Frontier SunPower Solarcentury Hanwha Solar REC Group Panasonic Kyocera Canadian Solar Suntech Trina Solar Meyer Burger AGC Solar Harsha Abakus Solar Sapa Group ISSOL SolarWorld AG Jinko Solar; SiC Thermal Process Equipment: JTEKT Thermo Systems Centrotherm Tystar Corporation Toyoko Kagaku CETC-48 AMAT NAURA Shenzhen S.C New Energy Technology Shandong Leguan LAPLACE-SEMI Qingdao Huaqi Technology Sunred Electronic Equipment Hunan Exwell Semiconductor Mattson (Beijing E-Town) ULVAC Sumitomo Heavy Industries Annealsys Chengdu LasTop Technology Larcomse Equipment (Shanghai) Kokusai Electric Wuxi Yiwen Electronic Technology; Mercury Test Contactor: Cohu, FUJITSU, MDI, OMRON, Hermann Pilz, PANNASONIC, TYCO, AEC, ALEPH, Shenzhen Haotai Technology, AndianTech, Juren Automation Technology, Misensor Single In-line Dual In-line Communication Automotive Electronic ; Graphite Cathode Block: Tokai COBEX Carbone Savoie SEC Carbon Ukrainsky Grafit ENERGOPROM GROUP Elkem Chalco Wanji Holding Group Graphite Product Guangxi Qiangqiang Carbon Jiangsu Inter-China Group; Global Desktop Mask Alignment Lithography Machine: SUSS MicroTec, RotaLab Scientific Instruments, EV Group, KLOE, Neutronix Quintel, Yaco Chenxu Technology, Advanced Biological and Chemical Microscopy, Karl Suss, OAI Advanced Microengineering, MIDAS Systems, MJB, NIL Technology Contact Exposure Non-contact Exposure Microelectronics Manufacturing IC Production Scientific Research Teaching; Capacitance Manometer Vacuum Gauges: Inficon MKS Instruments Agilent Setra Systems Pfeiffer Vacuum Canon Anelva Atlas Copco (Leybold and Edwards) Brooks Instrument ULVAC Kurt J. 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Jenoptik LIMO GmbH (Focuslight Technologies Inc.) Ingeneric GmbH Sumita Optical Glass, Inc. Axetris AG VIAVI Solutions Inc. Isuzu Glass Ltd. Power Photonic NIL Technology Aspherical Micro-Lens Arrays Spherical Micro-Lens Arrays Telecommunications and IT Automotive Medical; Semiconductor Dry Vacuum Pump: Atlas Copco (Edwards Vacuum), Ebara Corporation, Pfeiffer Vacuum GmbH, Kashiyama Industries, Beijing Grand Hitek, SKY Technology Development, Ningbo Baosi Energy Equipment, LOTVACUUM, Taiko Kikai Industries, Busch Vacuum, EVP Vacuum Technology, Scroll Laboratories, Inc, ULVAC, Inc, Highvac Corporation, Osaka Vacuum, Ltd Screw Vacuum Pump Scroll Vacuum Pump Claw Vacuum Pump CVD&PVD Lithography&Etching ; Semiconductor Dry Etching Equipment: Allwin21 Corp. SemiStar Corp. Lam Research TEL Applied Materials Hitachi High-Technologies Oxford Instruments ULVAC SPTS Technologies GigaLane Plasma-Therm SAMCO AMEC NAURA; Plasma Asher, Plasma Clean Inductively Coupled Plasma (ICP) Capacitive Coupled Plasma (CCP) Reactive Ion Etching (RIE) Deep Reactive Ion Etching (DRIE) Logic and Memory MEMS Power Device; SiC Ion Implanters : SiC Power Device 150 mm SiC Ion Implanters 200 mm SiC Ion Implanters Axcelis, ULVAC, AMAT, CETC-48, Nissin Ion Equipment Co., Ltd, IBS, Shanghai Kingstone Semiconductor Corp, Foshan Jihua, Qingdao Sifang Sri Intellectual Technology; Peltier Module Components : Ferrotec KELK Ltd.(Komatsu) Coherent Corp (formerly II-VI Incorporated) Laird Thermal Systems Z-MAX KJLP Thermion Company Phononic Guangdong Fuxin Technology KYOCERA Thermonamic Electronics TE Technology Same Sky (formerly CUI Devices) Kryotherm Industries Crystal Ltd Merit Technology Group Wakefield Thermal Pelonis Technologies Zhejiang Wangu Semiconductor P&N Technology JiangXi Arctic Industrial Henan Hongchang Electronic Wei County Zhongtian Electron Stock Cooperative Beijing Xinyu Kaimeng Electronic Technology Beijing Huimao Refrigeration Equipment Hangzhou Aurin Cooling Device Consumer Electronics Communication Medical Automotive Industrial Aerospace Defense; Wafer Expander: Dynatex International TECHNOVISION OHMIYA IND.CO.,LTD. Semiconductor Equipment Corporation Ultron Systems TOYO Adtec IHT CO Powatec Shanghai Angview Industrial Neontech Shanghai Prosrun ; Sputter Coaters: SemiStar Corp, Allwin21 Corp. ULVAC Quorum Technologies Buhler Cressington Scientific Instruments Hitachi High-Technologies Corporation Oxford Instruments Semicore Equipment Plassys Bestek PVD Products Denton Vacuum Veeco Instruments Kolzer SPI Supplies Hind High Vacuum Company (HHV) KDF Electronic & Vacuum Services FHR Anlagenbau Angstrom Engineering Soleras Advanced Coatings Milman Thin Film Systems Plasma Process Group Mustang Vacuum Systems Kenosistec Scientific Vacuum Systems AJA International Electron Microscopy Sciences; Solder Paste Inspection (SPI) System: Koh Young Test Research, Inc (TRI) Sinic-Tek Vision Technology CKD Corporation Nordson Corporation SAKI Corporation Shenzhen JT Automation Equipment Viscom AG Mycronic (Vi TECHNOLOGY) MIRTEC CO., LTD. PARMI Corp Shenzhen ZhenHuaXing Pemtron ASC International ViTrox JUTZE Intelligence Technology Jet Technology Caltex Scientific MEK Marantz Electronics Shenzhen Chonvo Intelligence; Wafer Wand: Fluoro Mechanic JEL CORPORATION H-Square Corp Ted Pella, Inc Recif Technologies Dou Yee Enterprises GERMONIC TECHNOLOGY Suzhou VIRTUAL Shen-Yueh Technology Co., Ltd KeiWa Technology; Used Semiconductor Equipment: SemiStar Corp. Used Semiconductor Equipment; Substrates for Semiconductor Test Probe Card: Kyocera SEMCNS Co., Ltd Niterra (NTK) Serim Tech Inc. IM-TECHPLUS LTCC Materials FINE CERATECH INC. Shanghai Zenfocus Semi-Tech; Cryo Vacuum Pump: Atlas Copco SHI Cryogenics Group ULVAC cryo PHPK Technologies Vacree Pengli Zhejiang Bokai Bama-supercon; Dual-Axis Positioning Stage: NBK America LLC ALIO Industries, LLC PI (Physik Instrumente) L.P. Optimal Engineering Systems, Inc. (OES) Reid Supply CHUO PRECISION INDUSTRIAL THK Tokyo Seimitsu Sumitomo Heavy Industries, Ltd. (SHI) NSK Ltd. Optics Focus MIRUC OPTICAL Sinto V-Cerax Ltd. igus GmbH; Plasma Flame Treatment Machines: Automation Ideas Elsisan Systematic Automation Proco Machinery Miller Process Coating Dubuit Far East Ska Fabricating RLS DYNATEC SYSTEMS Plasma Etch Cox & Plant Tantec Arcotec Novasys Vastex International EXERON InduPlasma Houn Jien HongYu Automation Technology; Wet Etching Equipment: 45th Institute of CETC SILEX Chemcut Felcon Modutek Kzone Equipment Technology RENA Singulus Technologies Tzoyo Ultech Co Siemens; Cadmium Sulphide Sputtering Target: Kurt J. Lesker American Elements Stanford Advanced Materials Advanced Engineering Materials Limited Edgetech Industries ALB Materials EVOCHEM Advanced Materials InnovaDeposition Able Target Limited; Silicon Crystal Growing Furnace: Linton Crystal PVA TePla AG Ferrotec Cyberstar Gigamat Mitsubishi Jingsheng NAURA Jinyuntong Jiangsu Huasheng Tianlong Photoelectric Czochralski(CZ) Method Furnace Floating Zone(FZ) Method Furnace; Wafer UV Film and Non-UV Film (Blue Film): Mitsui Chemicals Tohcello LINTEC Denka Nitto Denko Furukawa Electric Sumitomo Bakelite D&X AI Technology ULTRON SYSTEM Maxell Resonac Henkel Adhesives LG Chem Suzhou BoYan Jingjin Photoelectric WISE new material Vistaic NDS KGK Chemical NEXTECK; Plasma Cleaners: Allwin21 Corp. Nordson MARCH Plasmatreat Bdtronic Panasonic PVA TePla Diener Electronic Vision Semicon SemiStar Corp. Samco Inc. Tantec SCI Automation PINK GmbH Thermosysteme Plasma Etch Semiconductor Automotive Electronics Tabletop Type Large Chamber Type; Semiconductor Mass Flow Controller: HORIBA Fujikin MKS Instruments Sevenstar Hitachi Metals, Ltd Pivotal Systems MKP AZBIL Bronkhorst Lintec Kofloc Brooks Sensirion ACCU Sierra Instruments; PVD (Physical Vapor Deposition) Coaters : Allwin21 Corp Applied Materials ULVAC Optorun Buhler Leybold Optics Shincron Von Ardenne Evatec Veeco Instruments Hanil Vacuum BOBST Satisloh IHI Hongda Vacuum Platit Lung Pine Vacuum Beijing Power Tech SKY Technology Impact Coatings HCVAC Denton Vacuum ZHEN HUA Mustang Vacuum Systems KYZK SemiStar Corp.; Semiconductor Dry Vacuum Pump: Atlas Copco (Edwards Vacuum) Ebara Corporation Pfeiffer Vacuum GmbH Kashiyama Industries Beijing Grand Hitek SKY Technology Development Ningbo Baosi Energy Equipment LOTVACUUM Taiko Kikai Industries Busch Vacuum EVP Vacuum Technology Scroll Laboratories Inc ULVAC Inc Highvac Corporation Osaka Vacuum Ltd; Wafer Plasma Dicing System: KLA Plasma-Therm Samco Panasonic Single Chamber Cluster Chamber Power Device RF Device LED MEMS; RF Probe Card: FormFactor Nidec SV Probe Feinmetall TIPS Messtechnik GmbH Probe Test Solutions Limited T Plus Co. Ltd. International Contact Technologies Inc. Wentworth Laboratories Yokowo Cohu Inc. Translarity STAr Technologies Inc. Shanghai YR Semiconductor Test; Capacitance Diaphragm Gauges: Inficon MKS Agilent Setra Pferffer Canon Anelva Leybold GmbH ULVAC Nor-Cal Brooks Kurt J. Lesker Thyracont InstruTech Azbil Horiba Atovac 0.01-10 Torr 10-100 Torr 100-1000 Torr More than 1000 Torr Semiconductor Equipment Thin-film Deposition Processes Medical Equipment Food Industry ; Semiconductor Probe Station: Tokyo Seimitsu Tokyo Electron Semics Fittech Shen Zhen Sidea FormFactor Semishare MPI Micronics Japan Lake Shore Cryotronics Everbeing Int’l MarTek (Electroglas) Micromanipulator Signatone HiSOL KeyFactor Systems Wentworth Laboratories APOLLOWAVE SemiProbe MicroXact KeithLink Technology Ecopia Shenzhen Cindbest Technology ESDEMC Technology; Plasma Etcher: Allwin21 Corp. Samco Oxford Instruments Tantec CORIAL Akrion Technologies Plasma Etch SENTECH Instruments 2M Strumenti SPTS Technologies NAURA Technology Group AMEC Beijing Jinsheng Weina Technology SemiStar Corp.; Ceramic Electro Static Chuck: SHINKO TOTO Creative Technology Corporation Kyocera NGK Insulators, Ltd. NTK CERATEC Tsukuba Seiko Applied Materials II-VI M Cubed Fountyl Beijing U-PRECISION TECH CO., LTD. CALITECH SEMCO Technologies Fraunhofer IOF Entegris TOMOEGAWA; 0.7μm RF Probe Holder: GGB Industries FormFactor MPI Corporation Wentworth Laboratories KeyFactor Systems Signatone Everbeing Int'l Corp. CETC Uotest SEMISHARE Suzhou Eoulu System Integration CHPUIST Cindbest PL OPTICS WuHan Yuxin Technology; Film Plating Machine: Allwin21 Buhler Leybold Optics KDF AIXTRON Veeco Instruments, Inc. Edwards BCI HONGDA ZHEN HUA Beijing BeiYi Rankuum Machinery HUNAN YUFONE NMC HCVAC Jusung Engineering SemiStar