Description
NANO-MASTER Megasonic Single Wafer and Mask Cleaners provide reproducible, uniform and state-of-art megasonic cleaning. We incorporate patented damage free megasonic cleaning, chemical cleaning, brush cleaning and drying in one process step. To achieve maximum cleaning optimization without substrate damage, the megasonic energy density must be kept slightly below the damage threshold at any point on the sample. NANO-MASTER’s patented technology assures uniform distribution of the acoustic energy across the entire surface of the substrate allowing ideal cleaning by maximizing the distributed energy while staying below the sample’s damage threshold. Depending on the application, certain options will further enhance the tool’s ability to remove unwanted particles and residues.
NANO-MASTER’s Single Wafer Cleaners (SWC) focus on providing the best possible cleaning capability while maintaining affordability. A standard system features a megasonic nozzle for DI water, independent chemical dispenses, ad drying performed by high speed spinning, an IR lamp, and blowing nitrogen. Our systems move the dispense arm using a patented motion which ensures that the megasonic energy and chemicals are evenly dispersed across the substrate. Depending on the application, further options such as a PVA brush, CO2 injection, or nitrogen ionization can be added to further enhance the tool’s cleaning capability.
NANO-MASTERS’s Single Wafer Cleaners (SWC) focus on providing the best possible cleaning capability while maintaining affordability. A standard system is configured with clean, chemical clean, brush clean, high RPM spin dry with IR heating and N2 flow. Patented megasonic nozzle movement assures uniform delivery of megasonic energy; therefore, at any point on the surface, energy delivered can be kept below damage threshold.
SWC-3000 | SWC-4000 | SWC-5000 |
SWC-3000 Features | SWC-4000 Features | SWC-5000 Features |
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SWC-3000 Options | SWC-4000 Options | SWC-5000 Options |
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Single Wafer Cleaners (SWC) Applications
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Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid
SS10840