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Single Wafer Cleaners

Description

Nano-Master Main Equipment: Thin FilmEtch | Cleaning | Space Simulation | Hybrid

Single Wafer Cleaners -SWC-3000 Desktop, SWC-4000 Stand Alone, SWC-5000 Robot load/unload (Download Cleaning Equipment brochure)

NANO-MASTER Megasonic Single Wafer and Mask Cleaners provide reproducible, uniform and state-of-art megasonic cleaning. We incorporate patented damage free megasonic cleaning, chemical cleaning, brush cleaning and drying in one process step. To achieve maximum cleaning optimization without substrate damage, the megasonic energy density must be kept slightly below the damage threshold at any point on the sample. NANO-MASTER’s patented technology assures uniform distribution of the acoustic energy across the entire surface of the substrate allowing ideal cleaning by maximizing the distributed energy while staying below the sample’s damage threshold. Depending on the application, certain options will further enhance the tool’s ability to remove unwanted particles and residues.

NANO-MASTER’s Single Wafer Cleaners (SWC) focus on providing the best possible cleaning capability while maintaining affordability. A standard system features a megasonic nozzle for DI water, independent chemical dispenses, ad drying performed by high speed spinning, an IR lamp, and blowing nitrogen. Our systems move the dispense arm using a patented motion which ensures that the megasonic energy and chemicals are evenly dispersed across the substrate. Depending on the application, further options such as a PVA brush, CO2 injection, or nitrogen ionization can be added to further enhance the tool’s cleaning capability.

NANO-MASTERS’s Single Wafer Cleaners (SWC) focus on providing the best possible cleaning capability while maintaining affordability. A standard system is configured with clean, chemical clean, brush clean, high RPM spin dry with IR heating and N2 flow. Patented megasonic nozzle movement assures uniform delivery of megasonic energy; therefore, at any point on the surface, energy delivered can be kept below damage threshold.

SWC-3000 SWC-4000 SWC-5000
SWC-3000 Features SWC-4000 Features SWC-5000 Features
  • 12″ OD, 7″ x 7″ substrates
  • Table top unit
  • Venturi powered vacuum
  • Damage free megasonic
  • Independent chemical dispenses
  • Spin dry with heated N2
  • Microprocessor controlled
  • Chemical dispense unit
  • Safety interlocks
  • 19”x26” footprint
  • Four 3.8L HDPE canisters
  • Stand alone unit
  • Dual drain for acids and solvents
  • Suck back valves to prevent drips
  • Four 3.8L HDPE canisters
  • Stand alone unit
  • Dual drain for acids and solvents
  • Suck back valves to prevent drips
  • Robot load/unload
SWC-3000 Options SWC-4000 Options SWC-5000 Options
  • PVA brush cleaning (100 RPM)
  • Post CMP brush cleaning (up to 400 RPM)
  • Nitrogen ionizer
  • CO2 inject with DIW resistivity monitor
  • FM4910 Materials
  • Back side DIW clean and dry
  • In-line heaters for DIW or chemicals
  • Fill sensors for chemical or DIW leaks
  • TBD
Single Wafer Cleaners (SWC) Applications
  • Patterned and unpatterned masks and wafers
  • Ge, GaAs and InP wafer cleaning
  • Post CMP wafer cleaning
  • Cleaning of diced chips on wafer frame
  • Cleaning after plasma etch or photoresist stripping
  • Mask blanks or contact mask cleaning
  • Cleaning of X-ray and EUV masks
  • Optical lens cleaning
  • Cleaning of ITO coated display panels
  • Megasonic assisted lift-off process

The trademarks of the equipment and parts contained on this page belong to the Original Equipment Manufacturers.

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Nano-Master Main Equipment: Thin FilmEtch | Cleaning | Space Simulation | Hybrid

SS10840

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers