Description
Please contact us for the availability of the used semiconductor equipment . The items are subject to prior sale without notice. This items are only for end users.
- 2 SET FICO AMS-11-MR MOLDING
- 2 set of inline tester
- Shinkawa ACB35
- Aixtron G4 SPARE PARTS
- Applied Materials Compass Pro 300
- Applied Materials Compass Pro 300
- Orbotech Ultra Discovery VM
- SELA EM2
- Aviza Technology Ltd Aviza Celsior mainframe for 12″ / 300 mm
- Aviza Technology Ltd Aviza Pantheon Mainframe for 12″ / 300 mm
- Dainippon Screen SC-W60A-AV
- Infineon Bruchless Motor bench
- Canon FPA-1550 M4-W
- Oxford Instruments CMI 950
- IPEC Westech IPEC472
- Sikama International M:Falcon 8500
- Cyberscan CT350T Dual non-contact double-sided optical profilometer
- Dainippon Screen SCW-60A-AV
- Dainippon Screen SDW-60A-AVP
- Dainippon Screen SCW-60A-AV
- Dainippon Screen SDW-60A-AVP
- Kynergy No
- Dainippon Screen SDW-60-AVP
- Dainippon Screen SDW60 AVP
- Mühlbauer DB200 WTX-1
- Aixtron Aixtron AIX2800G4
- ESEC ESEC3088
- EVG820 Dry Film Lamination System
- EVG820 Dry Film Lamination System
- FinnSonic Versa+ 80/VI HDD TD35
- LTX PPS
- LTX PPS
- Heraeus Oven & Oven Table
- Hitzinger DDUPS component –Kinetic Energy Module (Choke/KIN)
- DBS Strumenti Scient PGH2-100
- INGERSOLL RAND heat reactivated regenerative air dryers
- Kaeser Compressor
- ESI Model 9350
- Lauffer Mold Press
- Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine
- LTX Fusion HT
- LTX Fusion HT
- LTX Synchro II Tester
- Hitachi VP-1500
- Multitest MT8502
- Nabertherm Furnance
- NexGen Technologies Nexgen Prober 2013 Model
- Nitto Denko Nitto MSA840
- Nonproductive SI-Wafer at Infineon
- OGP Messtechnik GmbH Smart Scope CNC 500
- Over Head Transport System (OHT) SRC320 / SRC300 / LIM
- Diener Diener Tetra 30-LF-PC
- Process Photonics LaserDrilling/Cutting Tool
- PPI Systems Inc. FP-C2
- Rasco SO2000
- PILL Export 250
- Hitachi S-5200
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- Shinkawa ACB35
- SHINKAWA ACB35 Wire Bond
- Shinkawa ACB35
- Shinkawa ACB400
- SIENMENS Backside Laser Machine
- Hanmi Semiconductor Sawing & Placement 3800LD
- Stencil Cleaner
- Sumitomo Heavy Indus SWA-90GD
- LTX PVI
- LTX PVI
- KLA -Tencor CI-T1X0 Rev3
- Teradyne J971-61 SML 256CH1TH
- Multitest MT2168
- THA Germany
- THA Germany
- TOSOK DBD3310 3280 DIE BOND
- tosok 3310
- Ultratech, Inc. 1500
- Vision Inspection Machine 2 sets
- Lintec LTD-2500F/12
- Wafer shipping boxes
- DDS Development
- Yamato NDB-4 CO2 Bubbler
- Yes Ofen PB-6-8P
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