Description
Semiconductor Equipment Parts
Location: Europe-SS5329-S-1-1-1
Valid: Subject to prior sale without notice. This is only for end users. Applicate your time.
The trademarks of the equipment and parts contained in this page belonged to the Original Equipment Manufacturers.
- OXFORD INSTRUMENTS Ionfab 300Plus
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Ion Beam Etching (IBE) system, 8″
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Model Type : ION BEAM 300+
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Cell type: CdTe, ZnS, SiO2
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Gas line : Ar line 1 / 50 sccm, Ar line 2 / 20 sccm, O2 line 3 / 20 sccm, Xe line 4 / 50 sccm, Xe line 5 / 50 sccm, Xe line 6 / 20 sccm
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- VEECO Dektak 6M
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Programmable Surface Profiler Measuring System in the nanometer range.
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This Profilometer is an electromechanical instrument designed to measure surface topography and roughness with high precision.
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High Resolution: Features nanometer vertical resolution and horizontal resolution as small as twenty nanometers.
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Sample Viewing: Includes mechanical and optical components for sample placement and scanning, along with a high-resolution color video camera.
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- OXFORD INSTRUMENTS Plasmalab 80 Plus
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Reactive Ion Etcher RIE/ICP
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ATP400 HPC Pump
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RFX600A Generator
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Gasbox
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PC4500 software update
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Wafer size : pieces up to 8″/200mm wafers in RIE mode, 2″ max in ICP mode
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Vintage : 2003
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Upgraded to X20 PLC planned for 2026
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- PLASSYS Dielectric sputtering system MP300
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Model: Plassys MP300
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Configuration: Single-Target machine.
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Target Size: 3-inch target.
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Substrate Capacity: Designed to process wafers up to 2 inches.
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Pumping sytem : Alcatel 5400 serie Turbopump
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Load-Lock chamber
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Advanced Feature: Capable of running deposition processes with Substrate Bias (polarization of the substrate holder).
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