Description
The Semiconductor Equipment /parts are subject to prior sale without notice. These items are only for end users. The items are subject to prior sale without notice.
| 1 | Accretech TSK | MHF300L | Test head manipulators |
| 2 | Accretech TSK | MHF300L | Test head manipulators |
| 3 | Accretech TSK | MHF300L | Test head manipulators |
| 4 | Accretech TSK | MHF300L | Test head manipulators |
| 5 | Accretech TSK | MHF300L | Test head manipulators |
| 6 | Accretech TSK | MHF300L | Test head manipulators |
| 7 | Accretech TSK | MHF300L | Test head manipulators |
| 8 | ADE | Episcan 1000 | FT-IR Spectromter for measurement of Epitaxial films |
| 9 | ADVANCED ENERGY | MDX | Magnetron Drive p/n 2011-000-D |
| 10 | Advantest | Hifix for PQFP80 (14 x 20) | Hi-fix for Advantest T5371 package type PQFP80 (14 x 20) |
| 11 | Advantest | T5371 | Test system (With a single test head ) |
| 12 | ADVANTEST | T5771ES | Automated Test Equipment |
| 13 | ADVANTEST | T5375 | Automated Test Equipment |
| 14 | AG ASSOCIATES | 610 | Benchtop RTP System, for up to 6″ Wafers |
| 15 | AG Associates | Heatpulse 210M | Rapid Thermal Annealing System |
| 16 | Agilent | 41501B | SMU and PGU 2 units |
| 17 | AIR SYSTEM INTL | SVB-E8EXP | Electric Blower, Explosion Proof |
| 18 | AKRION | V2-HL.2000 | Acid Wet Bench |
| 19 | AKRION | V2-SA.3200 | Wet Process Station Including Tanks |
| 20 | Alcan Tech/Canon | MAS-8000 | Microwave Ashing System |
| 21 | ALCATEL | 5150CP | Turbo Molecular Vacuum Pump |
| 22 | Alessi | REL 5000 | Semi-Automatic Prober |
| 23 | ALESSI | REL-4500 | Analytical Wafer Prober with 6″ (dia.) Gold Plated Chuck |
| 24 | ALPHASEM | Swissline 9006 (Spares) | Automatic Epoxy Die Bonder, Parts Tool Only |
| 25 | ANGELANTONI | T600 TU5 | Large Clean Room Oven |
| 26 | Angelantoni | T600 TUS | Large Clean Room Oven |
| 27 | AP & S | TwinStep-B H3P04 | Semi-Automatic H3PO4 2 stage Megasonic QDR |
| 28 | Applied Materials | 0020-0323 REV H | Heat Exchanger |
| 29 | Applied Materials | 0290-09018 Rev F | Heat Exchanger |
| 30 | Applied Materials | Centura 5200 EPI HTF | EPI Deposition, 3 CH ATM |
| 31 | Applied Materials | Centura RTP | RTP system with 1 X Polygen Chamber SiN Process |
| 32 | Applied Materials | Opal 7830i Enhanced | CD-SEM |
| 33 | Applied Materials | P5000 | 3 chamber CVD, Universal SiN process |
| 34 | Applied Materials | P5000 | 4 CH system with 2 x SiN CVD, 2 x Etch |
| 35 | Applied Materials | P5000 | 4 Chamber CVD, 2 CH etch, 2 ch TEOS |
| 36 | Applied Materials | P5000 | CVD 4 CH dxZ – SiN process |
| 37 | Applied Materials | P5000 | CVD System, 2 Chamber TEOS Oxide CVD |
| 38 | Applied Materials | P5000 | CVD with 2 CH etch, 2 CH CVD TEOS |
| 39 | Applied Materials | P5000 | CVD, 3 x Universal CVD Ch, SIN process |
| 40 | Applied Materials | P5000 SACVD | 4 CH system with 2 xTEOS CVD, 2 x Etch |
| 41 | ASM | Epsilon 3200 | GaAs Epitaxial Deposition |
| 42 | ASM | Epsilon 3200 | GaAs Epitaxial Deposition |
| 43 | Axcelis | Fusion PS3 | UV Cure System 2 CH UV Bake |
| 44 | Axcelis | NV GSD 200E | Medium Current Ion Implanter, 180 KV |
| 45 | Axcelis | NV-GSD-200E2 | Medium Current Ion Implanter |
| 46 | Baccini | 35MW Solar Cell Line | Solar Cell Print line for Mono or Poly Crystalline Solar Cells |
| 47 | Baccini | Cell electrical tester | Electrical Cell tester |
| 48 | Baccini | CHIP AND CRACK CAMERA | Chip and Crack camera |
| 49 | Baccini | Dryer 1 | Dryer 1 |
| 50 | Baccini | Dryer 2 | Dryer 1 |
| 51 | Baccini | Screen Printer 2 | screen printer |
| 52 | Baccini | Screen Printer 3 | screen printer |
| 53 | Bio-Rad | Q5 (Upgrade to a Q6) | Overlay Registration Tool |
| 54 | Bio-Rad | Q7/Q8 | Overlay metrology Tool |
| 55 | Bio-Rad | Q8 | Overlay Metrology |
| 56 | Bio-Rad | QS-1200 | FT-IR Spectrometer |
| 57 | Bio-Rad | QS-300 | FT-IR Spectrometer for measurement of EPI films |
| 58 | Bio-Rad | QS-408M | Manual FT-IR Spectrometer |
| 59 | BIORAD | Q5 | Overlay Metrology Tool |
| 60 | BIORAD | QS-300 | FT-IR Spectrometer for up to 200mm Wafers |
| 61 | BIORAD | QS-408M | Manual FT-IR Spectrometer for Epi, SiN, BPSG Measurement & More, up to 200mm Wafers, 2ea Available |
| 62 | Bruker | D8 Fabline | X-ray Diffractometer |
| 63 | Canon | FPA 5000 ES2+ | 248 nm lithography exposure system |
| 64 | Centrotherm | Centronic E2000 | Horizontal diffusion furnace for POCl3 doping |
| 65 | CentroTherm | DO 12.000-200-FF-HTO-CAN-NT4.0 | Fast Firing Funace with Dryer |
| 66 | COLUSSI | UG 50 E | AUTOCLAVE FOR STERILIZATION |
| 67 | Contamination Control | Desiccator boxes, 10ea Available | |
| 68 | Convac | M2000 | Photoresist coater |
| 69 | CR TECHNOLOGY | UF160-0 | Xray System |
| 70 | Credence | Duo SX (Spare Parts) | SPARE PARTS FROM AUTOMATED TEST SYSTEM |
| 71 | Credence | Personal Kalos I | Test system |
| 72 | Cyberscan | CT350T | Dual non-contact double-sided optical profilometer |
| 73 | Dage | 2400PC | Wire Pull Tester with die shear load cell |
| 74 | Dage | BT23 | Die Shear Tester |
| 75 | Dage | MCT 22 | Wire Bond Pull Tester |
| 76 | DAGE | 2400PC | Wire pull tester |
| 77 | DAGE | BT23-PC | Die Shear Tester with LC200 Die Shear Load Cell |
| 78 | DAGE | BT23PC | Die Shear Tester with LC200 Die Shear Load Cell, 2ea Available |
| 79 | DAGE | BT24 | Ball/Bump Shear Tester |
| 80 | Digital Analysis | PH10 Adjustment system | PH Adjustment system |
| 81 | Disco | EAD 6750 with Hanmi 3800LD | Package Singulation Saw with Cleaner |
| 82 | Ebara | 305W | Turbo pump controller |
| 83 | Ebara | 305W | Turbo pump controller |
| 84 | Ebara | 305W | Turbo pump controller |
| 85 | Ebara | 306W | Turbo pump controller |
| 86 | Ebara | 306W | Turbo pump controller |
| 87 | Ebara | A30W | Vacuum Pump |
| 88 | Ebara | A30W | Vacuum Pump |
| 89 | Ebara | ET300WS | Turbo pump |
| 90 | Ebara | ET300WS | Turbo pump |
| 91 | Ebara | ET300WS | Turbo pump |
| 92 | Ebara | ET300WS | Turbo pump |
| 93 | Ebara | ET300WS | Turbo pump |
| 94 | Ebara | ET300WS | Turbo pump |
| 95 | Ebara | ET300WS | Turbo pump |
| 96 | Edwards | D150 | Dual GRC unit |
| 97 | Edwards | D150 | Dual GRC unit |
| 98 | Edwards | E2M40 FSPX | Rotary Vacuum Pump with oil filter |
| 99 | Edwards | iQDP40 | Dry Mechanical Pump |
| 100 | Edwards | iQDP80 / QMB1200 | Dry Vacuum Pump combo |
| 101 | Edwards | iQDP80 / QMB1200 | Dry Vacuum Pump combo |
| 102 | Edwards | iQDP80 / QMB1200 | Dry Vacuum Pump combo |
| 103 | Edwards | QDP80 | Dry Vacuum Pump |
| 104 | Edwards | QDP80 + QMB 250F | Dry Vacuum Pump combo |
| 105 | Edwards | QDP80 + QMB 250F | Dry Vacuum Pump combo |
| 106 | EKRA | X5 | Solder Paste Printer |
| 107 | EKRA | E4 | Solder Paste Printer |
| 108 | Electroglas | Horizon 4085X | Fully Automatic Prober with an inker |
| 109 | ELES | ART 200 | Burn In Board testing system |
| 110 | ELES | ART200 | Debug Station for Reliability Test System |
| 111 | Entegris | RSPX-EUV-036 | EUV Reticle stocker |
| 112 | ESEC | ESEC 2007 SSI | DIE BONDER |
| 113 | ESEC | ESEC 3006 | Wire Bonder |
| 114 | ESEC | ESEC 3006 | Wire Bonder |
| 115 | ESEC | ESEC 3006 | Wire Bonder |
| 116 | ESEC | ESEC3088 | Wire Bonder |
| 117 | ESI | 44 | LASER TRIMMER SPARE PARTS |
| 118 | EVG | 820 | Dry Film Lamination System |
| 119 | Extraction Systems | TMB 150 | Photoresist Contamination Monitor System / Total Amine Analyzer |
| 120 | Fairchild Convac | Falcon | Polyimide developer track 2D |
| 121 | FAITH TECHNOLOGY | RapiTran 2 | Wafer Transfer Station |
| 122 | FEI | Quanta Inspect fp | Tungsten filament SEM |
| 123 | FICO | AMS-11-MR | Molding |
| 124 | FICO | AMS-11-MR | Molding |
| 125 | FICO | AMS-11-MR | Molding |
| 126 | FICO | AMS-11-MR2 | Multiplunger |
| 127 | FICO | AMS-11-MR | Molding |
| 128 | Fico Besi | AMS-11-MR | Mold System |
| 129 | Fico Besi | AMS-11-MR | Mold System |
| 130 | FORTREND | F6000QS | 6 INCH WAFER TRANSFER |
| 131 | Fortrend | F6000QS | 6 INCH WAFER TRANSFER |
| 132 | FSI | Polaris 3500 (Spares) | Spares for DUV photoresist coater / developer track |
| 133 | Fusion | M150PC | UV Bake (For spares Use) |
| 134 | GCA/Tropel | 9000 | Wafer Flatness Analyzer |
| 135 | Gigi Molina Brevetti Plastici SpA | Custom | Manual wet bench |
| 136 | Gigi Molina Brevetti Plastici SpA | Custom | Manual wet hood |
| 137 | Gigi Molina Brevetti Plastici SpA | Custom | Manual wet hood |
| 138 | GL Automation | IDSCOPE | Wafer bar code reader |
| 139 | GL Automation | IDSCOPE | Wafer bar code reader |
| 140 | GL Automation | IDSCOPE | Wafer bar code reader |
| 141 | GL Automation | IDSCOPE | Wafer bar code reader |
| 142 | GL Automation | IDSCOPE | Wafer bar code reader |
| 143 | Hamamatsu | C7103 | PC Controlled IC Back-side Lapping and Wafer Grinding System |
| 144 | HITACHI | S-9300 | SEM – CD (CRITICAL DIMENSION) |
| 145 | HITACHI | S7000 | CD SEM |
| 146 | HP | 16500B | Logic Analyzer |
| 147 | HP / Agilent | 54601A | Oscilloscope, 4 Channel 100 MHz |
| 148 | Innolas | ILS 700P | Laser Edge Isolation |
| 149 | Jonas and Redmann | Q2 WHD A | Loader for Centrotherm E2000 furnace |
| 150 | K AND S | 982-10 Plus | Dicing Saw |
| 151 | K Tech Engineering | BK04A | Blister tape applicator for microelectronic components |
| 152 | K&S | 1471 | Automatic wedge bonder |
| 153 | K&S | 1488 Plus | Automatic Gold Ball Bonder |
| 154 | K&S | 6495 | Semi-Automatic Epoxy Die Bonder with PRS |
| 155 | K&S | 6495 | Semiautomatic Epoxy Die Bonder |
| 156 | K&S | 6496 | Semi-Automatic Die Attacher |
| 157 | K&S | 6497 | Semiautomatic Flip Chip Die Bonder |
| 158 | K&S | 9388 Laser Pro | Automatic Ball Attach System |
| 159 | K&S | Powerfusion | Alu Wedge Bonder |
| 160 | KARL SUSS | MA 150 | Mask Aligner (For spares use) |
| 161 | KARL SUSS | MA56 | Mask Aligner |
| 162 | KARL SUSS | MA6 | Mask Aligner |
| 163 | KARL SUSS | MJB-3 | Mask Aligner |
| 164 | KARL SUSS | PM 8 | Prober |
| 165 | KLA-TENCOR | 2122 | WAFER DEFECT INSPECTION |
| 166 | KLA-TENCOR | 2132 | bright-field WAFER INSPECTION |
| 167 | KLA-Tencor | AIT 1 | Patterned Wafer Defect Inspection Tool |
| 168 | KLA-TENCOR | AIT UV | Dark field wafer particle inspection system |
| 169 | KLA-Tencor | RS-55TCA | Resisitivity Measurement |
| 170 | KOKUSAI | DD-853V | Vertical Diffusion Furnace, Phosphor Anneal Process |
| 171 | KOKUSAI | DD-853V | Vertical Diffusion Furnace, POCl3 and Phosphor Anneal Process |
| 172 | KOKUSAI | DJ-835V | Vertical Diffusion Furnace, D-Poly Si Process, PH3 doping |
| 173 | LABCONCO | Protector | Laboratory Fume Hood and Cabinet with Sink |
| 174 | Lam | 4520 (spares) | REMOTE CART |
| 175 | Lam | 4520 (spares) | REMOTE CART |
| 176 | LAMBDA PHYSIK | Novaline K2005 | EXCIMER LASER |
| 177 | LEATHERWOOD | LPD333.FR4.FT | Semi-Auto Automated 6′ Acid Wet Bench, for up to 6″ Wafers, Excellent Condition |
| 178 | LEATHERWOOD | LPJ333.SS.ADFTX | Semi-Auto 6′ Solvent Wet Bench, for up to 6″ Wafers, Excellent Condition |
| 179 | Liebherr | FKV 3610 | Fridge for photoresist |
| 180 | MACTRONIX | UKA-650 | Wafer Transfer Tool – Eureka III Sr. for 150mm Wafers |
| 181 | MACTRONIX | UKA-825 | Wafer Transfer Tool for 200mm Wafers |
| 182 | Mazzali | Climatest C320G5 | Temperature and humidity testing chamber |
| 183 | Mazzali | Climatest C320G5 | Temperature and humidity testing chamber |
| 184 | MDA Scientific | System 16 | Toxic Gas Monitor |
| 185 | MDC | 986G | Automatic CV Plotter |
| 186 | MDC | CSM | Automatic CV Plotter with RM-1600 Computer |
| 187 | MDC | CSM/16 | Automatic CV Plotter with RM-1600 Computer |
| 188 | MDC (Materials Development Corp.) | DUO CHUCK CSM16 | CV Measurement system |
| 189 | Micro Automation | 2066 | Mask and wafer cleaner |
| 190 | Microcontrol | MWE Plus | UV Wafer Eraser with cassette loading |
| 191 | MKS | PAS-4U1HG | Residual Gas Analyzer |
| 192 | MOSAID | MS4155 | Memory Test System |
| 193 | MPM | SP200 | Screen Printer |
| 194 | MRL | Black Max | Black max heater element, 850 celcius |
| 195 | MRL INDUSTRIES | 1024 | 3-Tube Horizontal Diffusion Furnace |
| 196 | Multitest | MT2168 | Test Handler |
| 197 | Multitest | MT8502 | TriTemp gravity Handler |
| 198 | Multitest | MT8589 | Test Handler |
| 199 | Multitest | MT8589 | Test Handler |
| 200 | Muratec | SRC320 / LIM | Over Head Transport System (OHT) |
| 201 | Nanofocus | Micro-sprint | 3d inspection system with handler |
| 202 | Neslab | HX-2000 | 75 KW Recirculating Chiller |
| 203 | NESLAB | HX-75 | Recirculating Water Chiller w/Digital Temp Ctlr, Water Cooled |
| 204 | NESLAB | HX-75 | Recirculating Water Chiller, Air Cooled |
| 205 | NESLAB | HX-750 | Air Cooled Recirculating Water Chiller, Damaged Compressor |
| 206 | NexGen Technologies | Nexgen Prober 2013 Model | semi-automatic prober with hot chuck |
| 207 | NEXTEST | MAVERICK PT I | Automated Test Equipment |
| 208 | NEXTEST | MAVERICK PT II | Automated Test Equipment |
| 209 | NEXTEST | MAVERICK PT II | Automated Test Equipment |
| 210 | NEXTEST | MAVERICK PT II | Automated Test Equipment |
| 211 | NEXTEST | MAGNUM I EV | Automated Test Equipment |
| 212 | NEXTEST | MAVERICK PT II | Automated Test Equipment |
| 213 | NICOLET | Magna 550 | FT-IR Spectrophotometer |
| 214 | Nikon | EpiPhot 200 | Inspection Microscope |
| 215 | Nikon | Optiphot | Microscope |
| 216 | Nikon | Optiphot 150 | Wafer Inspection Microscope |
| 217 | NIKON | Optiphot 150 | Wafer Inspection Microscope, 10X, 20X, 50X & 150X Objs., 150mm XY Stage |
| 218 | NIKON | Optiphot 200 (For spares use) | Wafer Inspection Microscope (Parts Tool Only) |
| 219 | NIKON | Optiphot 88 | Wafer Inspection Microscope |
| 220 | Nikon | Optistation 3 | Microscope Wafer Inspection Satation with cassette to cassette handling |
| 221 | Nikon | Optistation 3 | Microscope Wafer Inspection Station with cassette to cassette handling |
| 222 | Nikon | Optistation 3 | Wafer Inspection System |
| 223 | Nikon | Optistation 3A | Automatic Wafer Inspection Station |
| 224 | NIKON | V-12 | Optical Comparator |
| 225 | Nordson | Matrix X3 | High Speed XRay System f. Tray Handling |
| 226 | OLYMPUS | BH-BHM | Wafer Inspection Microscope |
| 227 | Orbotech | Ultra Discovery VM | Automatic Optical Inspection |
| 228 | Orthodyne | M360C | Heavy Wire Bonder |
| 229 | Orthodyne | M360C | Heavy Wire Bonder |
| 230 | Orthodyne | M360C | Heavy Wire Bonder |
| 231 | Orthodyne | M360C | Heavy Wire Bonder |
| 232 | Orthodyne | M360C | Heavy Wire Bonder |
| 233 | Orthodyne | M360C | Heavy Wire Bonder |
| 234 | Orthodyne | M360C | Heavy Wire Bonder |
| 235 | Orthodyne | M360C | Heavy Wire Bonder |
| 236 | Oxford | CMI 950 | Xray fluorescence spectrometer |
| 237 | Oxford | Flex AL-II | ALD system |
| 238 | Oxford | Micro-dep 300 | PE CVD system (For spares use) |
| 239 | Oxford | Micro-etch 300 | Dry Etcher |
| 240 | Oxford Plasma Technology | DP80 | PE CVD |
| 241 | PlasmaTherm | SLR 740 | Dual Chamber RIE |
| 242 | Plasmos | SD 2004 | Multi-Wavelength Ellipsometer |
| 243 | PLASMOS | SD2000 | Automatic Ellipsometer |
| 244 | PMS | Liquitrack 776200 | Non volatile residual Monitor |
| 245 | Poly Design Inc. | Custom | Heated Quartz Boat storage / drying system |
| 246 | Rasco | BCU-750 | Brine Chiller |
| 247 | RECIF | IDLW8R | Wafer ID Reader – Tabletop for 200mm Wafers |
| 248 | RECIF | SPP8 | Wafer Transfer for 200mm Wafers |
| 249 | Rena | Etcher | In-Line Etching System |
| 250 | RIGAKU | 3630 (For spares use) | Xray Fluorescence Wafer/Disk Analyzer, Missing Xray Tube |
| 251 | Rigaku | 3640 | X-ray fluoresence wafer / disk analyzer |
| 252 | RIGAKU | 3700H | TXRF Wafer Analyzer |
| 253 | Roth & Rau | Chiller | Chiller |
| 254 | Roth & Rau | SiNA Plus | PECVD – Deposition of Silicon Nitride |
| 255 | Rucker & Kolls | 680A | SEMI-AUTOMATIC PROBER |
| 256 | Salon Teknopaja OY | PWB | Printed Wire Board Level Drop Tester with Solder Joint Reliability tester |
| 257 | Sankei Giken | TCW-12000 CV | Process Module Chiller |
| 258 | SDI | FAaST-330 | Dielectric Characterization Tool with COCOS & Epi-t for up to 300mm Wafers |
| 259 | SDI | SPV-300 | Surface Photo Voltage Tester for up to 300mm Wafers |
| 260 | SEIKO SEIKI | STP 1000C | TURBO PUMP TMP 100C 250 ISO-K/KF40 |
| 261 | SEKISUI | VANTEC SIGMA 200 K1 | Antistatic 200 MM Wafer shipping box |
| 262 | Seminet | Infinity SACS 251216-120-CE | Semi-Automatic Carousel Boxed Reticle Stocker |
| 263 | Semitool | ST-240 | Spin Rinse Dryer |
| 264 | Semitool | ST-921R-AA | Spin Rinse Dryer |
| 265 | Shinkawa | ACB35 | Wire Bonder |
| 266 | Shinkawa | ACB35 | Wire Bonder |
| 267 | Shinkawa | ACB35 | Wire Bonder Machine |
| 268 | Shinkawa | ACB35 | Wire Bonder Machine |
| 269 | Shinkawa | ACB35 | Wire Bonder Machine |
| 270 | Shinkawa | ACB35 | Wire Bonder Machine |
| 271 | Shinkawa | ACB35 | Wire Bonder |
| 272 | Shinkawa | ACB400 | Wire Bonder |
| 273 | Shinkawa | ACB400 | Wire Bonder |
| 274 | Shinkawa | UTC 3000 | Wire Bonder |
| 275 | Shinkawa | UTC1000 | Wire Bonder |
| 276 | Shinkawa | UTC1000 | Wire Bonder |
| 277 | Shinkawa | UTC1000 | Wire Bonder |
| 278 | Shinkawa | UTC1000 | Wire Bonder |
| 279 | Shinkawa | UTC1000 | Wire Bonder |
| 280 | Shinkawa | UTC1000 | Wire Bonder |
| 281 | Shinkawa | UTC1000 | Wire Bonder |
| 282 | Shinkawa | UTC1000 | Wire Bonder |
| 283 | Shinkawa | UTC1000 | Wire Bonder |
| 284 | Shinkawa | UTC1000 | Wire Bonder |
| 285 | Shinkawa | UTC1000 | Wire Bonder |
| 286 | Shinkawa | UTC1000 | Wire Bonder |
| 287 | Siemens | Siplace F4 | pick and place mounter |
| 288 | Siemens | Siplace HS 50 | pick and place mounter |
| 289 | SMC | INR-341-59A | DUAL CHILLER |
| 290 | SMC | INR-341-61A | Triple Loop Chiller |
| 291 | Solitec | 5110 | Spin Coater |
| 292 | ST Automation | MT 32 SX | Fully Automated Memory Test System for BIST and NAND Memories |
| 293 | ST Automation | MT32 | Flash Memory Test System |
| 294 | ST Automation | PTM1 | Flash Memory Tester |
| 295 | ST Automation | QT200 | Automated Tester System with monitor |
| 296 | ST Automation | QT200 | Automated Tester System with monitor |
| 297 | ST Automation | QT200 | Automated Tester System with monitor |
| 298 | ST Automation | QT200 | Automated Tester System with monitor |
| 299 | ST Automation | QT200 | Automated Tester System with monitor |
| 300 | ST Automation | QT200 | Automated Tester System with monitor |
| 301 | ST Automation | QT200 | Automated Tester System with monitor |
| 302 | ST Automation | QT200 | Automated Tester System with monitor |
| 303 | ST Automation | QT200 | Test System |
| 304 | ST Automation | QT200 | Tester System with monitor |
| 305 | ST Automation | QT200 (spares) | boards from qt 200 test system – see attached list |
| 306 | ST Automation | R.S.V. | ST Memory Test System Electronic Automation |
| 307 | ST Automation | test head | test head for Eprom U 1835 |
| 308 | STS | 320 PC | Reactive Ion Etcher |
| 309 | SYNAX | SX3100 | Handler |
| 310 | SYNAX | SX3100 | Handler Ambient/Hot |
| 311 | System General | T9600 | Universal Device Programmer |
| 312 | Sytrama | MTM 32 V01 | ST Test Head Manipulator QT 124 |
| 313 | Sytrama | MTM 32 V01 | ST Test Head Manipulator QT 124 |
| 314 | TAKATORI | ATM-1100E | Automatic Wafer Taper |
| 315 | TAKATORI | ATM-2100 | Automatic Wafer Detaper |
| 316 | TAKATORI | ATRM-2100D | Automatic Wafer Detaper |
| 317 | Tektronix | 11801C | Digital Sampling Oscilloscope |
| 318 | Tektronix | 2432A | Digital Oscilloscope, 2 channel, with GPIB |
| 319 | TEKTRONIX | 7704 | Oscilloscope |
| 320 | Tektronix | TDS 544A | Color 4 channel digitizing oscilloscope |
| 321 | Tektronix | TDS694C | Digital 3 GHz real-time oscilloscope |
| 322 | TEL TOKYO ELECTRON | MB2 730 HT HT | CVD SYSTEM, 2 CHAMBER WSi Process |
| 323 | TEL TOKYO ELECTRON | MB2 730HT | CVD SYSTEM, 3 CHAMBER WSi Process |
| 324 | TEL TOKYO ELECTRON | P8 | Wafer Prober |
| 325 | TEL TOKYO ELECTRON | P8XL | Fully Automatic Wafer Prober (Gold Chuck) |
| 326 | TEL TOKYO ELECTRON | TE 5480 | Nitride Plasma Reactive Ion Etch |
| 327 | Teradyne | Catalyst | Automated Test System |
| 328 | Teradyne | J971 | TEST SYSTEM |
| 329 | Teradyne | J971SP (Spares) | Boards from VLSI test system |
| 330 | Teradyne | J994 | Memory Tester |
| 331 | TERRA UNIVERSAL | 8 Tank | Stainless Steel Sink with 8ea 14″ X 14″ X 12″ (d) Tanks |
| 332 | TOSOK | DBD3310 | Die Bonder |
| 333 | Towa | CC-S | Injection Molding Press |
| 334 | TOWA | CC-S | Injection Molding Press, 2ea Available |
| 335 | ULTRA-T | SWC111 | Sawed Wafer Cleaner for up to 200mm Wafers |
| 336 | UNITEK MIYACHI | 1-124-05 | Parallel Gap Welder with 2-152-02 Weld Head & 9-001-01 XFMR |
| 337 | Varian | 350D (Spares) | Implanter (Spare Parts) |
| 338 | VARIAN | 936-70 SP | Helium Leak Detector |
| 339 | VARIAN | SD331 | Mechanical Vacuum Pump, 2ea Available |
| 340 | Varian | Turbo-V 250 MacroTorr | Turbo Pump DN ISO 100 Type |
| 341 | Varian | Turbo-V 250 MacroTorr | Turbo Pump DN ISO 100 Type |
| 342 | VEECO | MS-35T | Turbopumped Leak Detector |
| 343 | VERIGY | V4000 | Automated Test Equipment |
| 344 | VERIGY | V4000 | Automated Test Equipment |
| 345 | VERIGY | V4000 | Automated Test Equipment |
| 346 | VERIGY | V6000 | Automated Test Equipment |
| 347 | Verigy / Agilent | V6000e | Test system |
| 348 | VERTEQ | FLUOROCARBON RD4500 CLASSIC | SRD |
| 349 | Vision Engineering | Dynascope | Inspection Microscope |
| 350 | VISION ENGINEERING | Dynascope | Projection Micrsoscope |
| 351 | Weiss | TS130 | Thermal shock testing chamber |
| 352 | Wentworth Labs | 0-023-0021 | 6″ PROBE STATION/ WAFER PROBER MITUTOYO MICROSCOPE |
| 353 | WENTWORTH LABS | MP-2300 | Analytical Wafer Prober, for up to 200mm Wafers |
| 354 | Wentworth Labs | MP900 | Die Probe Station |
| 355 | WEST-BOND | 7200A | Manual Epoxy Die Bonder |
SS5303
