Description
Semiconductor Equipment Parts
Valid: Subject to prior sale without notice. This is only for end users. Applicate your time.
The trademarks of the equipment and parts contained in this page belonged to the Original Equipment Manufacturers.
| No | Model and Description | Location | Remark |
| 1 | ULVAC Ei-7K a high-performance, batch-type, high-vacuum evaporation system | FOX-SS8032 | Asia |
| 2 | Plasma Therm SLR 770 ICP Etching, Inductively Coupled Plasma Etching | FOX-SS8032 | Asia |
| 3 | Axitron G10 MOCVD, GaAs / Inp configured, 8 sets | FOX-10553 | USA |
| 4 | AccuThermo AW610 Rapid Thermal Processor, 6 inch. Moved from HP in Silicon Valley. Contact us for photos. We sell it at complete, working, functional test | SS5729-4-1-1 | USA |
| 5 | Temescal 4800 ,E-Beam evaporator, 2 sets | SS11068-S-1 | USA |
| 6 | Plasmatherm Shuttleline ICP Etcher 6″ | SS5816-FOX | USA |
| 7 | ASML XT1060K, Vintage: 2022, Wafer Size: 300mm,ASML KrF Twinscan | SS5533-FOX | USA |
| 8 | Available Inventory.Brand new, unused 200mm wafer shippers and carriers available from USA.MW200-N-C Wafer Shippers and or NW-200-N1-B Wafer Carriers | SS11072 | |
| 9 | Philips Analytical X-ray
Sigma Koki Microscope GST-100 Scribe and Breaker nSpec Station Hitachi Mircroscope Logitech Wafer Bonding Machine Testequity ID: 2019 Testequity ID: 2020 AD 819-30 Eutectic Die Bonder in TX,USA |
SS2483-S-1 | |
| 10 |
TPS Diffusion Furnace Model: TPS-PD55L , mfd in 04/2012. Never used after installation.
Diffusion Furnace: TP Solar Diffusion Furnace is used as a heat source with partial vacuum during the process of doping a silicon wafer for manufacturing solar photovoltaic cells. The doping process creates the vital p-n junction that is fundamental for the functioning of a solar cell. The furnace also precisely controls temperature, gas flow, and diffusion time to ensure accurate and uniform doping, which directly impacts the high efficiency and performance of the final cell. 33” Wide Conveyor, Max. Temp. is 1000*C , Variable Speed Belt.
0-350 FPM Overall Dimensions: 67” W x 240” L x 85” H
A gas inlet mechanism is used to introduce dopant gas into the furnace. Common dopants include boron, phosphorus and arsenic, depending on the desired electrical properties of the final semiconductor product. A control system regulates the flow of dopant gas, maintaining precise control over the diffusion process.
Diffusion furnaces are widely used in the semiconductor industry. They are used in the doping process that creates pn junctions in transistors and diodes. Diffusion furnaces also play a vital role in the fabrication of integrated circuits, where multiple layers of different semiconductors are stacked and interconnected.
Furthermore, diffusion furnaces are essential for the fabrication of advanced semiconductor devices such as power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and Insulated Gate Bipolar Transistors (IGBTs). These devices are so crucial in power electronics and renewable energy technology that diffusion furnaces are integral to their production.
Diffusion furnaces are critical tools in semiconductor manufacturing, allowing the controlled introduction of dopants into semiconductor wafers. These furnaces are an integral part of the production of various semiconductor devices such as transistors, diodes and integrated circuits. As technology advances, the capabilities of diffusion furnaces continue to increase, allowing for more precise and reliable manufacturing processes. The semiconductor industry relies heavily on these furnaces to meet the growing demand for advanced electronic equipment.
|
SS11078-S-1 | |
| 11 |
TPS UV Water Pre-Oxidizer , Model: TPS-UVSP42 , Mfd. 04/2012. Never used after installation.
TP Solar UV Wafer Pre-Oxidizer: The TP Solar Ultraviolet (UV) Wafer Pre-Oxidizer is a machine used to remove organic contaminants from semiconductor wafers through exposure to UV light. The pre-oxidizer is used prior to bonding to increase the strength of the bonds between wafers. Benefits of using a pre-oxidizer in comparison to other wafer treatments is that pre-oxidation can be performed on more materials than only silicon, radiation effects of intense plasma exposure are minimized, and wet chemistry is eliminated.
Overall dimensions: 66” W x 178” L x 81” H
|
SS11078-S-1 | |
| 12 |
2019 vintage KLA / SPTS PRIMAXX MONARCH 25 Vapor Hydrogen Fluoride etch system. The tool is complete and was fully operational before being recently professionally de-installed.
|
SS7464-20260109 | |
| 13 |
OXFORD PLASMALAB 400 |
SS7464-20260109 | |
| 14 |
SAMCO RIE-200iP Inductively Coupled ICP RIE Fluorine Reactive Ion Etcher
|
SS380EB | |
| 15 |
PLASMATHERM 790+ RIE Gas Configuration:-CF4;-CHF3;-Ar;-O2;-N2 |
SS7464-FOX | |
| 16 |
MATTSON / STEAG / AST 2800 |
SS7464-FOX | |
| 17 |
HITACHI NB5000 FIB‑SEM dual beam system |
SS7464-FOX | |
| 18 |
|
SS6950-FOX | |
| 19 |
Applied Materials Centura 5200 MxP+
|
SS7381-FOX | |
| 20 |
Tools set for sale in Europe: IPEC IPEC/PLANAR 676 , Semitest SCA-2500 , Rudolph NSX95 , Semitest SCA-2500 , NEXGEN GEN2 , Electroglas 2001CX , Gasonics AURA 3010 , Ulvac Enviro II , Semitool SRD 470 , R2D Comet , DEK HORIZON O2i , Electroglass 4090 , NEXGEN GEN2
|
SS6060-FOX | |
| 21 |
8 inch Equipment in Silicon Valley Warehouse, BRAND NEW, STILL IN ORIGINAL CRATES. Quick Sale: (1) SUSS MICROTEC MA8Gen5S Microtech Compact Aligner ; (2) Tystar Tytan 8300 Oxidation Furnace ; (3) SAMCO RIE Plasma Etching System RIE-200C
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OEM-SAMCO-5 | |
| 22 |
CHA Mark 40 C Evaporator:
– Process Chamber Dimensions: 26” x 26”
– CHA SR-10 E-Beam Power Supply (10kW) – CHA T271-4-1 Electron Beam Source – Crucible: 4 pockets, 15cc each – CHA Beam Sweep Controller – CHA Auto Tech-2 Pump Cycle Controller – Blade Position Controller – Fixture Control and Shutter Controller – E.B. Gun Rotation Controller – RGA Valve Control – Substrate Heat – 10kW Heater Power Supply (CHA HPS-671-10) – Sycon STC-200/SQ Deposition Rate Controller – Granville Philips 307 Vacuum Gauge Control – MKS Type 250 Pressure/Flow Controller – Neslab CFT-150 Chillers, Qty 2 – CTI-Cryogenics 8500 Compressor – Edwards E2M40 2-Stage Vacuum Pump – Liquid Nitrogen Level Control – Ion Gauge Tube: IG-100N – Convectron Tube: 275-071 |
SS5816-FOX | |
| 23 |
STS MACS AOE plasma etcher, Clamp,3″-8″: O2 10sccm, Ar 150sccm, H2 50sccm, O2 100sccm, C4F8 50sccm, C2F6 200sccm, Cf4 100sccm, He 200sccm. Vintage 2000
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SS11089-S-1, OEM-42 | |
| 24 |
STS MACS ASE plasma etcher, ESC, 3″-8″: SF6 50sccm, He 300sccm, Ar 100sccm, O2 100sccm, SF6 600sccm, C4F8 400sccm. Vintage 2001
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SS11089-S-1,OEM-42 |
