Description
The owner is currently releasing a brand new Raith EBPG5150 electron beam lithography system, ready for immediate shipment. In addition, several other advanced tools are available from their facility, including items below.
Location: SS5615-2025
Valid: Subject to prior sale without notice. This is only for end users. Applicate your time.
The trademarks of the equipment and parts contained in this page belonged to the Original Equipment Manufacturers.
Semiconductor Toolset
The full semiconductor manufacturing line includes the following notable tools to be fitted in a 550m2 CR facility:
Photolithography
▪ Electron beam lithography (Raith EBPG5150 Plus)
▪ Stepper/contact lithography
Dry etch
▪ Silicon DRIE, dielectric, III-V, and metal
Wet etch
▪ Si, SiO2
, II-VI, III-V, metal
Metal and dielectric deposition
▪ E-beam evaporation and sputter
▪ PECVD and Thermal LPCVD
Back-End Processes
▪ Dicing and grinding
▪ Plating
Test
▪ Metrology equipment
▪ RF and DC probe stations
NAME | MAKE | MODEL | NOTES |
AGAR-SPUTTER/1 | AGAR SCIENTIFIC LTD | 108A SPUTTER COATER | |
AGIL-POWER.SUPPLY/1 | AGILENT | E3640A DC POWER SUPPLY UNIT | |
AND-BALANCE/1 | AND | HR200 BALANCE | |
ANDER-OVEN/1 | ANDERMAN | OVEN | |
APOG-ULTRASONIC.BATH/1 | APOGENT DISCOVERIES | XB2 BIO ULTRASONIC BATH | |
AUTOMATED INSPECTION TOOL | INEX | ||
BAL-EVAPORATOR/1 | BALZERS | 550 EVAPORATOR | |
BETT-CHILLER/1 | BETTATECH | CU500 CHILLER | |
BETT-CHILLER/1 | BETTATECH | CU500 CHILLER | |
BRSL-DAVID.CD.MEASURE/1 | BRIAN REECE SCIENTIFIC LTD | CD MEASUREMENT SYSTEM | |
CAM-DIE.BONDER/1 | CAMMAX | DB600 DIE BONDER | |
CARTON-MICROSCOPE/1 | CARTON | ASZ144 ZOOM MICROSCOPE | |
DAGE-BOND.TEST/1 | DAGE PRECISION INDUSTRIES | 4000 BOND TESTER | |
DAT-MICRO.MILLER/1 | DATRON ELECTRONIC GMBH | M9 MICRO MILLER | |
DESP-OVEN/1 | DESPATCH | LLD1-16N-3 OVEN | |
ECO.CHEM-COATER/1 | ECO CHEMIE BV | AUTOLAB BV SPIN COATER | |
EMS-HOTPLATE/1 | ELECTRONIC MICRO SYSTEMS | 1000-1 HOTPLATE | |
EMS-HOTPLATE/2 | ELECTRONIC MICRO SYSTEMS | 1000-1 HOTPLATE | |
EVG-ALIGNER/1 | E V GROUP | 620 CONTACT ALIGNER | Hg exposure lamp |
EVG-ALIGNER/1 | E V GROUP | 620 CONTACT ALIGNER | LED exposure lamp |
EVG-CLEANER/1 | E V GROUP | 301 SUBSTRATE CLEANER | |
EVG-COATER/1 | E V GROUP | 101 C SPIN COATER SYSTEM | |
EVG-DEVELOPER/1 | E V GROUP | 101 D SPIN DEVELOPER SYSTEM | |
EVG-WAFER.BONDER/1 | E V GROUP | 501 WAFER BONDER | |
FILMETRICS-F20/1 | FILMETRICS | 205-0020 FILM MEASUREMENT | |
GOLDENWALL ELECTRONIC BALANCE | GOLDENWALL | HZ50002 | |
GUY-BEAD.BLASTER/1 | GUYSON | EUROBLAST 6 BEADBLASTER | |
INTELL-ENDPOINT.DETECTOR/1 | INTELLEMETRICS | LEP300 END POINT DETECTOR | |
JAN-4.POINT.PROBE/1 | JANDEL | 4 POINT PROBE | |
JEL-OZONE.CLEANER/1 | JELIGHT | 144AX-220 UVO CLEANER | |
JEN-OVEN/1 | JENCONS SCIENTIFIC LTD | OVEN | |
JENWAY-HOTPLATE.STIR/1 | JENWAY | 1203 HOTPLATE & STIRRER | |
JENWAY-HOTPLATE.STIR/2 | JENWAY | 1203 HOTPLATE & STIRRER | |
JEOL-SEM/1 | JEOL | 6060 SCAN ELECT MICROSCOPE | |
JUL-BATH/1 | JULABO | TW20 WATER BATH | |
K&S-WIRE.BOND/1 | KULICKE & SOFFA | 4129 WIRE BALL BONDER | |
K&S-WIRE.BOND/2 | KULICKE & SOFFA | 4523 WIRE WEDGE BONDER | |
LABLINE-OVEN/1 | LAB-LINE | CLEANROOM OVEN | |
LOADPOINT-SAW/1 | LOADPOINT | SERIES 3 MICROACE SAW | |
LOADPOINT-SAW/2 | LOADPOINT | SERIES 3 MICROACE SAW | |
LOG-WAX.BONDER/1 | LOGITECH | 1WBS7 WAX BONDER | |
MER-HOVER.PROBE/1 | MERCER | 121 HOVER PROBE | |
METRI-PRISM.COUPLER/1 | METRICON | 2010/M PRISM COUPLER | |
MRC-SPUTTER/1 | MATERIALS RESEARCH CORP | 943 SPUTTER | |
MUETEC-CD.MEASURE/1 | OLYMPUS | MX50T-F MICROSCOPE | |
NORD-SPUTTER/1 | NORDIKO | NS2500 SPUTTER | |
OX.INST-PECVD/1 | OXFORD INSTRUMENTS | PLASMALAB 80+ PECVD | |
SEMITOOL-SRD/1 | SEMITOOL | 870S SPIN RINSE DRYER | |
SEMITOOL-SRD/2 | SEMITOOL | 870S SPIN RINSE DRYER | |
SEMITOOL-SRD/3 | SEMITOOL | 470S SPIN RINSE DRYER | |
SEMITOOL-SRD/4 | SEMITOOL | 870S SPIN RINSE DRYER | |
SEMITOOL-SRD/5 | SEMITOOL | 870S SPIN RINSE DRYER | |
SIS-ANALYSIS.SCOPE/1 | SOFT IMAGING SYSTEMS | ANALYSIS MICROSCOPE | |
SSEC-SOLVENT.BENCH/1 | SSEC | 203 SOLVENT PROCESS SYSTEM | |
STS-AOE/1 | STS | ADVANCED OXIDE ETCH | |
STS-ASE/1 | STS | ADVANCED SILICON ETCH | |
STS-CLUSTER/1 | STS | ASSET ICP CLUSTER V1.3 | |
STS-PECVD/1 | STS | CHEMICAL VAPOUR DEPOSITION | |
STU-HOTPLATE/1 | STUART EQUIPMENT | CR300 HOTPLATE | |
TEGAL-ETCHER/1 | TEGAL | 901E ETCH SYSTEM | |
TEMP-FURN.TUBE/1 | TEMPRESS | OXIDATION TUBE | |
TEMP-FURN.TUBE/3 | TEMPRESS | POLY TUBE | |
TEMP-FURNACE/1 | TEMPRESS | TS 6 FURNACE | Includes oxidation and poly tubes above |
TEPLA-ASHER/1 | TEPLA | 300 ASHER | |
UTECH-STEPPER/1 | ULTRATECH | 1500 STEPPER | |
VAR-LEAK.DETECTOR/1 | VARIAN | 979 LEAK DETECTOR | |
VEECO-DEKTAK/1 | VEECO | 6M DEKTAK PROFILOMETER | |
VEECO-NANOSCOPE/1 | VEECO | NS4-1 NANOSCOPE IV | |
VWR-ULTRASONIC.BATH/1 | VWR | USC1700D ULTRASONIC BATH | |
WENT-PROBER/1 | WENTWORTH | AWP 2000 PROBE STATION | |
WENT-PROBER/2 | WENTWORTH | AWP 1000 PROBE STATION | |
YES-OVEN/1 | YES | 310 OVEN | |
RTA | Jipelec | JETFIRST 200 | RTA |
Disco | DAG 810 | GaN wafer grinding | |
Cascade Microtech | 11000 Probe Station | RF Probe Station | |
Raith | 6” tool EBPG5150 Plus | E-beam lith tool | |
Agilent Network Analyser | E8361A PNA | PNA, need repair |
An opportunity to purchase know-how, toolset and existing customer base for the development and manufacture of:
• RF and Power Gallium Nitride (GaN)
• Quantum Vapour Cells
• Photonic Semiconductor devices
Technology and know-how
Fully documented and qualified process know-how and an expert team for developing and manufacturing the following technologies:
RF GaN MMICs
Applications include Satcoms, Radar, Commercial Communications (5G/6G)
• Fabrication & process expertise : (1) High-performance matching European and Asian devices; (2) Advanced design architecture with epitaxy/e-beam.
• 0.25µm Process Design Kit (PDK) released to tier 1 customers
• Qualified RF GAN on SiC technology demonstrating strong durability
Power GaN
• Prototype GaN 650v (MIS)HEMTs and test data
• PDK
Quantum Vapour Cells
Applications include Frequency References, Atomic Clocks, Magnetic Sensing, Gyroscopes and Gravity Gradiometers
• Novel vapour cell technology delivering volume manufacture capability, low SWaP-C, repeatable quality and integration
Photonic and MEMS Device Development and Manufacture
Applications include gas sensing, LiDAR, inertial sensors and optical communications.
• Full end-to-end semiconductor and MEMS development and manufacturing capabilities
• For customer product fabrication from concept to volume manufacture