KLA / TENCOR Candela CS20V Surface measurement system-SS5487

Description

KLA / TENCOR Candela CS20V Surface measurement system is only for end users and is subject to prior sale without notice. Appreciate your time.

KLA / TENCOR Candela CS20V Surface measurement system

Fully automated with cassette-to-cassette wafer handling
OSATM (Optical surface analyzer): Non-destructive
Laser-based inspection & surface metrology
Semiconductor & related optoelectronic materials
Dual cassette configuration with pass / Fail binning
Robotic wafer handler, 2" 
Diameter wafers, 8"
Flat panel monitor, 19"
Workstation with Windows XP operating system
Internal class 10 cleanroom environment
Installation / Site preparation document
Standard CAS document

Includes:
Si / GaAs sub, GaAs-on-GaAs (O)
Ge, GaAs-on-Ge (O)
Ge Substrate >150μm
Wafer thickness, 300μm
Porous chuck, 2"
HW Wafer flat pre-aligner dual
EZ Controller rings, 2" (Auto)
(3) Adjustable cassettes loc assy
Min substrate thickness: >300μm
SW, Offline CS series
ID Chuck, 2"
ID Chuck, 4"
Porous chuck, 4"
Porous chuck, 6"
EZ Controller rings, 2" (Auto)
EZ Controller rings, 4" (Auto)
EZ Controller rings, 6" (Auto)

Power: 230 VAC 50/60 Hz.