Hesse Bondjet 820

Standard x/y table with high accuracy bearings and working area 305 mm x 410 mm

Axis repeatability 1 micron at 3 sigma

2″ wire-spool, motorised wire feeding

Wire diameter currently 17,5 μm to 60 μm

Lost wire detection and wire consumption detection system

4 Axes (X, Y, Z, Theta)

4 linear motors, 1 rotational brushless synchron-servo motor

Mini-CCD-camera incl. optical unit

BONDJET pattern recognition system

Microscope lamp

BONDJET-controller

Interface 32 bit digital I/O, isolated, 24 V

BONDJET BJ820 Keyboard and trackball

Standard BONDJET BJ820 software version 3.7 with detailed user operating manual with this sale

BONDJET BJ820 bond quality control

PLC program editor

Vacuum connection/compressed air connection

Holder for microscope

Stereo-microscope, magnification from 7- to 43-times (with recommended working distance of 311 mm)

Safety housing

230 Volt, 50-60 kHz +8%, -10%

-Piezo bondhead 45° for BJ820 with frictionless joints and bearings; incl. 98 kHz-transducer

Accessories box for bond-head 04 for BJ820

Swivel arm with microscope holding mechanism for microscope incl. lighting, transportation-box and stereo-microscope, magnification from 7- to 43-times (with recommended working distance of 311 mm)

Adapter vacuum and air pressure (3/8″ to tube 6mm ID)

TFT Monitor

TBD

-Heated indexing system.

-Full size pre-heat, bonding and post bonding stations

-Adjustable rail width capability

-Includes single input and single output magazine elevator lift systems

Assembly kit for E-Box (complete)

Bondhead calibration system BJ820 consisting of: CCD camera 1/3″

LED 40 ringlight, red

Mirror assembly, hinged

Optical system

Recognition sensor

Mechanical mounting bracket

Cables

Software integrated setup mode for wedge and wire clamp & OEM specific Manual