Description
Location ID: FOX-SS10685-20250218
Valid: Subject to prior sale without notice. This is only for end users. Applicate your time.
| 1 | Adixen | APR4300 Wafer Decontamination Tool | Wafer Decontamination | 300 |
| 2 | Adixen | APR4300 Wafer Decontamination Tool | Wafer Decontamination | 300 |
| 3 | ADIXEN | APR4300 Wafer Decontamination Tool | Wafer Decontamination | 300 |
| 4 | ADVANTEST | 93K PS800 | ATC93K_93000_Precio | 300 |
| 5 | Advantest | 93000 Hybrid Test (Functional / Parallel Parametic Test (pA/CMEAS)) Cell | Tester | 300 |
| 6 | Advantest | 93000 Hybrid Test (Functional / Parallel Parametic Test (pA/CMEAS)) Cell | Tester | 300 |
| 7 | Advantest | 93000 Hybrid Test (Functional / Parallel Parametic Test (pA/CMEAS)) Cell | Tester | 300 |
| 8 | Advantest | 93000 Hybrid Test (Functional / Parallel Parametic Test (pA/CMEAS)) Cell | Tester | 300 |
| 9 | Advantest | 93000 Hybrid Test (Functional / Parallel Parametic Test (pA/CMEAS)) Cell | Tester | 300 |
| 10 | Advantest | 93000 | Tester | 300 |
| 11 | Advantest | 93000 | Tester | 300 |
| 12 | Aleris | Rudolph | TFM_THK_JV | 300 |
| 13 | AMAT | AMAT CENTURA – 1 Carina CHM | FinCut | 300 |
| 14 | AMAT | PRODUCER SE | TEOS CU | 300 |
| 15 | AMAT | PRODUCER SE | SICOH ultra-low-k | 300 |
| 16 | AMAT | P5000 | ILD SABPSG | 200 |
| 17 | AMAT | ENDURA E5500 | COHTI | 200 |
| 18 | AMAT | CENTURA DXZ | PASSIVATION | 200 |
| 19 | AMAT | CENTURA MCVD SYS5200T | na | 200 |
| 20 | AMAT | CENTURA DPS | na | 200 |
| 21 | AMAT | CENTURA DPS | na | 200 |
| 22 | AMAT | Uvision 5 | CFM_Brightfield Inspection | 300 |
| 23 | AMAT | CENTURA EPI ACP 300MM RPS | EPI SiGe | 300 |
| 24 | AMAT | CENTURA ENABLER | ILD ETCH SICOH | 300 |
| 25 | AMAT | RAIDER ECD310 | NI PLATE | 300 |
| 26 | AMAT | RAIDER ECD310 | COPPER SN AG PLATE | 300 |
| 27 | AMAT | RAIDER ECD310 | NI PLATE | 300 |
| 28 | AMAT | ACMS | PLATE ACMS | 300 |
| 29 | AMAT | ACMS | PLATE ACMS | 300 |
| 30 | AMAT | CENTURA | Centura TSG | 300 |
| 31 | AMAT | CENTURA | AMAT EPI | 300 |
| 32 | AMAT | CENTURA | AMAT EPI | 300 |
| 33 | AMAT | Quantum Leap II | HIGH CURRENT / LOW ENERGY IMPLANT | 200 |
| 34 | AMAT | Frontier FRONTIER etch for Junctions – CHA-SiCoNi, CHC-Frontier | CVD12x_SIN POLY ISO REMOVE | 300 |
| 35 | AMAT | PRODUCER GT PECVD —- 3ch – CHA-SiN, CHB-SiN, CHC-SiN | TFM_Etch Stop Stress Nitride | 300 |
| 36 | AMAT | PRODUCER GT — 3ch – CHA-SiCoNi, CHB-SiCoNi, CHC -SiCoNi(NST) | TFM_SICONI Etch | 300 |
| 37 | AMAT | Producer GT Twin Chamber FCVD Oxide/low k for STI Gapfill – Fab1 DEP and CURE chambers transfer -Eterna II- CHA-FCVD, CHB-Corona Cure, CHC-Corona Cure | CVD49x_FCVD | 300 |
| 38 | AMAT | AMAT MESA (3+1) | ETX41x_FinCut | 300 |
| 39 | AMAT | SPECTRUM 300[Polyimid Rework Sink](SNK930) | SNK90x_PolyimideRwk | 300 |
| 40 | AMAT | AME P5000 | NA | 200 |
| 41 | AMAT | Uvision 6 | BFIUV6_Brightfield_AMAT | 300 |
| 42 | AMAT | ULTIMA-X | HDP21x_STIFillCap | 300 |
| 43 | AMAT | PRODUCER SE | SICOH ultra-low-k | 300 |
| 44 | AMAT | CENTURA ENABLER | ILD ETCH SICOH | 300 |
| 45 | AMAT | PRODUCER SE | UV CURE | 300 |
| 46 | AMAT | RAIDER CFD | na | 300 |
| 47 | AMAT | RAIDER ECD310 | na | 300 |
| 48 | AMAT | NANO SEM | CD SEM | 300 |
| 49 | AMAT | PRODUCER SE | BPSG_SACVD_SE | 300 |
| 50 | AMAT | VERITY SEM | CDSEM | 300 |
| 51 | AMAT | UVC | na | 300 |
| 52 | AMAT | SEM VISION G3 | SEM REVIEW | 300 |
| 53 | AMAT | VERITY 2 | CDSEM | 300 |
| 54 | AMAT | CENTURA 5200 | RTX | 200 |
| 55 | AMAT | VARIAN E220 | IMPLANT | 200 |
| 56 | AMAT | VARIAN E220 | IMPLANT | 200 |
| 57 | AMAT | VARIAN E220 | IMPLANT | 200 |
| 58 | AMAT | AMAT PRODUCER GT – 1 Nblok chm | CVD93x_BLoKDep | 300 |
| 59 | AMAT | ENDURA2 RMG Metal Dep (2x CVD Co – CH 2, CH 3) | MDX45x_MetalDep | 300 |
| 60 | AMAT | SEMVISION CX | CFM | 200 |
| 61 | AMAT | ENDURA 5500 | METALS | 200 |
| 62 | AMAT | Uvision 5 (Eval) | BFIUV6_Brightfield_AMAT | 300 |
| 63 | AMAT | CENTURA | SiGe Epitaxy | 300 |
| 64 | AMAT | ENDURA E5500 | SLAB | 200 |
| 65 | AMAT | Frontier FRONTIER etch for Junctions – CHA-SiCoNi, CHB-Frontier, CHC-Frontier | CHA-SiCoNi, CHB-Frontier, CHC- | 300 |
| 66 | AMAT | PRODUCER SE | SICOH ultra-low-k | 300 |
| 67 | AMAT | CENTURA | SiGe Epitaxy | 300 |
| 68 | AMAT | PRODUCER GT PECVD —- 3ch – CHA-PETEOS, CHB-PETEOS, CHC-PETEOS | PE-TEOS | 300 |
| 69 | AMAT | CENTURA 5200 WXZ | WPLUG | 200 |
| 70 | AMAT | Producer GT – CHA-UVCure, CHB-Co, CHC-NBlok, CHD-LLAPC | CVD93x_BLoKDep | 300 |
| 71 | AMAT | Producer GT – CHA-Co, CHB-Co, CHC-NBlok, CHD-LLAPC | CVD93x_BLoKDep | 300 |
| 72 | AMAT | PRODUCER GT SACVD —- 3ch – CHA-SACVD, CHB-SACVD, CHC-SACVD | TFM_Low Dep Rate SACVD | 300 |
| 73 | AMAT | CENTURA | SiGe Epitaxy | 300 |
| 74 | AMAT | ENDURA2 | MDX89x_BarSeed_CO | 300 |
| 75 | AMAT | Olympia SiN_LowK | SWD_PE_SiN_LowK | 300 |
| 76 | AMAT | PRODUCER SE PECVD —- 3ch – CHA-BCHD, CHB-BCHD, CHC-BCHD | TFM_U-LowK Dielectric | 300 |
| 77 | AMAT | ENDURA2 RMG Metal Dep (C – ALD TiN, D – RF PVD TiAl, E – DMD, F – DMD, 1- HP Al, 2 – CVD Co, 3 – CVD Al, 4 – PVD Ti, 5 – PVD Al) | MDX43x_TiC_METALDEP | 300 |
| 78 | AMAT | PRODUCER SE PECVD —- 3ch – CHA-BCHD, CHB-BCHD, CHC-BCHD | TFM_U-LowK Dielectric | 300 |
| 79 | AMAT | PRODUCER SE PECVD —- 3ch – CHA-BCHD, CHB-BCHD, CHC-BCHD | TFM_U-LowK Dielectric | 300 |
| 80 | AMAT | – CENTURA – (2+1+1)CH (Eval) – | OBAN_GateEtch | 300 |
| 81 | AMAT | CENTURA ULTIMA+ | HDP STI | 200 |
| 82 | AMAT | QUANTUM LEAP II | Low Energy Implanter | 200 |
| 83 | AMAT | ENDURA E5500 | IMPTIN | 200 |
| 84 | AMAT | QUANTUM LEAP | LOW ENERGY IMPLANT | 200 |
| 85 | AMAT | QUANTUM LEAP | LOW ENERGY IMPLANT | 200 |
| 86 | AMAT | ENDURA E5500 | IMPTIN | 200 |
| 87 | AMAT | QUANTUM LEAP | LOW ENERGY IMPLANT | 200 |
| 88 | AMAT | CENTURA DPS | METAL ETCH | 200 |
| 89 | AMAT | CENTURA DPS | METAL ETCH | 200 |
| 90 | AMAT | CENTURA EMXP+ | OP/BP ETCH | 200 |
| 91 | AMAT | ENDURA E5500 | MCAP | 200 |
| 92 | AMAT | ENDURA E5500 | COSI2 | 200 |
| 93 | AMAT | ENDURA E5500 | MCAP | 200 |
| 94 | AMAT | CENTURA DPS | METAL ETCH | 200 |
| 95 | AMAT | ENDURA E5500 | SLAB | 200 |
| 96 | AMAT | CENTURA DXZ | PASSIVATION | 200 |
| 97 | AMAT | QUANTUM LEAP | LOW ENERGY IMPLANT | 200 |
| 98 | AME | 5000_5000_MXP | FEOL RIE | 200 |
| 99 | AME | 5200_IPS_* | BEOL RIE | 200 |
| 100 | AME | 5200_5200_IPS | FEOL RIE | 200 |
| 101 | AME | 5200_IPS_* | BEOL RIE | 200 |
| 102 | AME | 5200_IPS_* | BEOL RIE | 200 |
| 103 | AME | 5200_5200_IPS | FEOL RIE | 200 |
| 104 | AME | 5200_5200_IPS | FEOL RIE | 200 |
| 105 | AME | AME_P5000_* | CVD AME | 200 |
| 106 | AME | AME P5000 | CVD AME | 200 |
| 107 | AME | 5000 * | FEOL RIE | 200 |
| 108 | AME | AME P5000 | CVD AME | 200 |
| 109 | AME | 5000 5000 | FEOL RIE | 200 |
| 110 | Arcadia Engineering | AG-112A | CONTACT ANGLE | 300 |
| 111 | ASM | E3200 | RP and Selective EPI | 300 |
| 112 | ASM | E3200 | RP and Selective EPI | 300 |
| 113 | ASM | EagleXP/Pulsar – PM1 – XP4 HFOx | DIF_RTA_GateOx_HK | 300 |
| 114 | ASM | MIR3000 – PM1, PM2 – PE_ALD Oxide | RTA43x_PE_ALD Oxide | 300 |
| 115 | ASM | MIR3000 – PM1, PM2 – PE_ALD Oxide | RTA43x_PE_ALD Oxide | 300 |
| 116 | ASML | NXT:1950i | 193NM ARF IMMERSION SCANNER | 300 |
| 117 | ASML | XT1400 | 193NM ARF SCANNER | 300 |
| 118 | ASML | AT860 | 248NM KRF SCANNER | 300 |
| 119 | ASML | AT850 | 248NM KRF SCANNER | 300 |
| 120 | ASML | AT860 | 248NM KRF SCANNER | 300 |
| 121 | ASML | AT850 | 248NM KRF SCANNER | 300 |
| 122 | ASML | AT850 | 248NM KRF SCANNER | 300 |
| 123 | ASML | AT860 | 248NM KRF SCANNER | 300 |
| 124 | ASML | AT850 | 248NM KRF SCANNER | 300 |
| 125 | ASML | AT400 | ILINE SCANNER | 300 |
| 126 | ASML | AT400 | ILINE SCANNER | 300 |
| 127 | ASML | AT400 | ILINE SCANNER | 300 |
| 128 | ASML | 275 | ILINE STEPPER | 200 |
| 129 | ASML | XT1900 | 193NM ARF IMMERSION SCANNER | 300 |
| 130 | ASML | YIELDSTAR S-200B | LIT MEASUREMENT | 300 |
| 131 | ASML | XT1900 | 193NM ARF IMMERSION SCANNER | 300 |
| 132 | ASML | NXT:1950i | LIT_ArF_Immersion | 300 |
| 133 | ASML | NXT:1950i | LIT_ArF_Immersion | 300 |
| 134 | ASML | 700B NAM | DUV SCANNER | 200 |
| 135 | ASYST | WMS 2200 | WAFER MANAGEMENT SYSTEM | 200 |
| 136 | ASYST | WMS 2200 | YDD WMS | 200 |
| 137 | ASYST | WMS 2200 | WAFER MANAGEMENT SYSTEM | 200 |
| 138 | ASYST | WMS 2200 | WAFER MANAGEMENT SYSTEM | 200 |
| 139 | ASYST | WMS 2200 | WAFER MANAGEMENT SYSTEM | 200 |
| 140 | AXCELIS | FUSION 200PCU | UV BAKE | 200 |
| 141 | AXCELIS | FUSION 200PCU | UV BAKE | 200 |
| 142 | AXCELIS | FUSION 200PCU | UV BAKE | 200 |
| 143 | AXCELIS | FUSION 200PCU | UV BAKE | 200 |
| 144 | AXCELIS | FUSION 200PCU | UV BAKE | 200 |
| 145 | AXCELIS | OPTIMA MD | MED CURRENT | 300 |
| 146 | AXCELIS | OPTIMA MD | MED CURRENT | 300 |
| 147 | AXCELIS | COMPACT II FURNACE | H2 reflow oven | 300 |
| 148 | AXCELIS | FUSION 200 ACU | STRIP | 200 |
| 149 | AXCELIS | FUSION 200 ACU | STRIP | 200 |
| 150 | AXCELIS | FUSION 200 ACU | STRIP | 200 |
| 151 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 152 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 153 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 154 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 155 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 156 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 157 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 158 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 159 | AXCELIS | FUSION 200 MCU | STRIP | 200 |
| 160 | AXCELIS | GSD HE | HIGH ENERGY IMPLANT | 200 |
| 161 | AXCELIS | INTEGRA ES | PLSM STRIP O2-FREE | 300 |
| 162 | AXCELIS | FUSION 200PCU | UV BAKE | 200 |
| 163 | AXCELIS | GSD 200E | HIGH CURRENT IMPLANT | 200 |
| 164 | BLUE M | KOYO_BLUE_M_* | MUV_POLY_CURE | 200 |
| 165 | BROOKS | EUV Reticle Stocker | EUV_Reticlestocker | 300 |
| 166 | Bruker | D8 FABLINE | XRD_Bruker | 300 |
| 167 | BRUKER | D8 FABLINE | XRAY DEFRACTION | 300 |
| 168 | BRUKER | AXS TXS | Material Analysis | 300 |
| 169 | BRUKER | D8-GADDS microfocus | Material Analysis | 300 |
| 170 | BRUKER | AXS D8 Discover | Material Analysis | 300 |
| 171 | BRUKER | AFM-D500 | Material Analysis | 300 |
| 172 | CAMECA | 4000X Si std | Material Analysis | 300 |
| 173 | CAMECA | Cameca APT Flex TAP – Fab10 Transfer | Material Analysis | 300 |
| 174 | CANON | ANELVA – PMB, PMC, PMD, PME | TFM_MetalGate_Canon Anelva | 300 |
| 175 | CDE | RESMAP 273 FOUP DUAL | RESISTIVITY MEASUREMENT NON METAL | 300 |
| 176 | CDE ResMap | CDE RESMAP 463 | SHEET RESISTANCE FEOL | 300 |
| 177 | CFM | FullFlow 1/99 8100 | SURFACE PREP | 200 |
| 178 | CFM | FullFlow 1/99 8100 | SURFACE PREP | 200 |
| 179 | CFM | CFM HP 8050 | CFM HP | 200 |
| 180 | CFM | FULL FLOW_8100_* | CFM HP | 200 |
| 181 | CFM | FULL FLOW 8100 | SURFACE PREP | 200 |
| 182 | CONCEPT PART SOLUTIONS | PEP-4800DL | HIO | 200 |
| 183 | DAIFUKU | F Model | Server | 300 |
| 184 | DAIFUKU | F Model | Server | 300 |
| 185 | DAINAN TECH (S) PTE LTD | 9039 | OVEN BAKE | 200 |
| 186 | DESPATCH | PWC-48X38X64-3E – Drying Oven | Drying Oven | 300 |
| 187 | DESPATCH | PWC-48X38X64-3E – Drying Oven | Drying Oven | 300 |
| 188 | DESPATCH | PWC-48X38X64-3E – Drying Oven | Drying Oven | 300 |
| 189 | DESPATCH | PWC-48X38X64-3E – Drying Oven | TBD | 300 |
| 190 | DISCO | DGP8761 | BackSideGrinding | 300 |
| 191 | DISCO | DGP8761 | BackSideGrinding | 300 |
| 192 | DISCO | DFG840 | BACKGRIND | 200 |
| 193 | DNS | SSW80AAR | SCRUBBER | 200 |
| 194 | DNS | SS-3100 | Mainframe | 300 |
| 195 | DNS | SS-3100 | Mainframe | 300 |
| 196 | DNS | SU-3200 | Single Wafer Acid Processor | 300 |
| 197 | DNS | SU-3200 | Single Wafer Acid Processor | 300 |
| 198 | DNS | SU-3200 | Single Wafer Acid Processor | 300 |
| 199 | DNS | FC3100 | MOL CLEAN | 300 |
| 200 | DNS | SPW 813AS | CMP | 200 |
| 201 | DNS | SSW80AAR | SCRUBBER | 200 |
| 202 | DNS | WS820L | RCA | 200 |
| 203 | EBARA | EPO222 | POLH OXIDE | 200 |
| 204 | EBARA | EPO222 | POLH OXIDE | 200 |
| 205 | EBARA | EPO222 | POLH OXIDE | 200 |
| 206 | EBARA | EPO222H | POLH OXIDE | 200 |
| 207 | EBARA | EPO222H | POLH OXIDE | 200 |
| 208 | EBARA | EPO222H | POLH WCMP | 200 |
| 209 | EBARA | EPO222 | POLH WCMP | 200 |
| 210 | EBARA | EPO222 | POLH STI | 200 |
| 211 | ENTEGRIS FLUOROWARE | HTC8030 | BOX WASH / CASETTE CLEANER | 200 |
| 212 | ENTEGRIS FLUOROWARE | HTC8030 | BOX WASH / CASETTE CLEANER | 200 |
| 213 | ESEC | MICRON2 | ALI | 300 |
| 214 | FEI | ExSolve CLM WTP | PFA | 300 |
| 215 | FEI | ExSolve WTP | PFA | 300 |
| 216 | FEI | TEM Titan G2 60-300 (image Cs corrector,multi-loaded) | PFA | 300 |
| 217 | FILMETRICS | F50 | THICKNESS MEASUREMENT | 300 |
| 218 | FSI | POLAR | PHOTO | 200 |
| 219 | FSI | POLAR | PHOTO | 200 |
| 220 | FSI | POLAR | PHOTO | 200 |
| 221 | FSI | POLAR * | PHOTO | 200 |
| 222 | GASONICS | PEP3510A | RESIST STRIP | 200 |
| 223 | GASONICS | PEP3510A | RESIST STRIP | 200 |
| 224 | GASONICS | PEP IRIDIA DL | RESIST STRIP | 200 |
| 225 | GASONICS | PEP3510A | RESIST STRIP | 200 |
| 226 | GTI Technologies | ATM | na | 300 |
| 227 | GTI Technologies | ATRM | na | 300 |
| 228 | Hitachi | CD-N | CD MEASUREMENT | 300 |
| 229 | HITACHI | CG5000 | CDS50x_CDSEM_HITACHI | 300 |
| 230 | HITACHI | CG4000 (consignment tool, to be replaced by CG5000) | CDS50x_CDSEM_HITACHI | 300 |
| 231 | HITACHI | M8000 – M8190XT | SpacerEtch | 300 |
| 232 | HITACHI | S-8840 | SEM | 200 |
| 233 | HITACHI KOKUSAI | DJ-1236VN-DF – BOAT1, BOAT2 TiN_ALD | TiN_ALD | 300 |
| 234 | HITACHI KOKUSAI | DJ-1236VN-DF – BOAT1, BOAT2 TiN_ALD | FVX48x_TiN_ALD | 300 |
| 235 | HITACHI KOKUSAI | DD1223V – BOAT1 – Harp Anneal | Harp_Anneal | 300 |
| 236 | HITACHI KOKUSAI | DJ1236VN – BOAT1 – LowK SiN | FVX39x_LowK_ALDSIN | 300 |
| 237 | HITACHI KOKUSAI | DJ-1236VN-DF – BOAT1, BOAT2 TiN_ALD | FVX39x_LowK_ALDSIN | 300 |
| 238 | HITACHI KOKUSAI | DJ-1236VN-DF – BOAT1, BOAT2 TiN_ALD | FVX39x_LowK_ALDSIN | 300 |
| 239 | HMI | ESCAN 380 | EBEAM | 300 |
| 240 | HMI | eScan 500 | EBeamInspection_HMI | 300 |
| 241 | HSEB | MMT 300 | MACRO INSPECTION | 300 |
| 242 | HSEB | MMT 300 | MACRO INSPECTION | 300 |
| 243 | HSEB | AXIOSPECT 301 | Optical Review | 300 |
| 244 | JORDAN VALLEY | JVX 7300 — XRR/XRD/XRF system XRay Film Metrology (Eval) | TFM_THK_JV | 300 |
| 245 | JUSUNG | Eureka 2000 | CVD NOV | 200 |
| 246 | JUSUNG | JUSUNG EUREKA2000 | NA | 200 |
| 247 | KEITHLEY | K255 KEITHLEY TESTER 973/1 Col. E23 (MT) 20F8161ZB | TEST | 200 |
| 248 | KEITHLEY | S450 | TEST | 200 |
| 249 | KEITHLEY | S450 | TEST | 200 |
| 250 | KEITHLEY | S450 | TEST | 200 |
| 251 | KEITHLEY | S450 | TEST | 200 |
| 252 | KEITHLEY | S475 | TEST | 200 |
| 253 | KEITHLEY | S450 | TEST | 200 |
| 254 | KEITHLEY | S450 | TEST | 200 |
| 255 | KEITHLEY | S630 | TEST | 200 |
| 256 | KEITHLEY | S630 | TEST | 200 |
| 257 | KEITHLEY | KEITHLEY S600 | TEST | 200 |
| 258 | KEITHLEY | S450 | TEST | 200 |
| 259 | KEYSIGHT TECHNOLOGIES | HP 4062UX | ELECTRICAL TESTING | 200 |
| 260 | KEYSIGHT TECHNOLOGIES | HP 4062UX | ELECTRICAL TESTING | 200 |
| 261 | KEYSIGHT TECHNOLOGIES | HP 4062UX | ELECTRICAL TESTING | 200 |
| 262 | KEYSIGHT TECHNOLOGIES | HP 4062UX | ELECTRICAL TESTING | 200 |
| 263 | KLA | 2600DUV | FILM THICKNESS | 200 |
| 264 | KLA | 5240 | FILM THICKNESS | 200 |
| 265 | KLA | 3260 | FILM THICKNESS | 200 |
| 266 | KLA | TERON650 | ReticleInspect | 300 |
| 267 | KLA | 2835 | BF2835_Brightfield_KLA | 300 |
| 268 | KLA | Tencor Spectrashape 10K | LIT_MET_Scatterometry_FinFET | 300 |
| 269 | KLA | FM 6200 | NA | 200 |
| 270 | KLA | ARCHER —- 500 | OVL20x_Overlay | 300 |
| 271 | KLA | ARCHER —- 500 | OVL20x_Overlay | 300 |
| 272 | KLA | ARCHER —- 500 | OVL20x_Overlay | 300 |
| 273 | KLA | LD10 Stripped | THK20x_Spectrafilm_KLA | 300 |
| 274 | KLA | LD10 Stripped Stripped | THK20x_Spectrafilm_KLA | 300 |
| 275 | KLA | SL536 | RETICLE DEFECT INSPECTION | 300 |
| 276 | KLA | PROFILER_P2_* | ALPHA STEP | 200 |
| 277 | KLA | PROFILER_P1_* | ALPHA STEP | 200 |
| 278 | KLA | OVERLAY_5200XP_* | KLA OVERLAY | 200 |
| 279 | KLA | DEFECT INS_AIT2_ | CMP AIT2 | 200 |
| 280 | KLA | DEFECT INS 2139 | CFM | 200 |
| 281 | KLA | OVERLAY 5200XP | METROLOGY | 200 |
| 282 | KLA | VIPER PDI 2401 | CFM | 200 |
| 283 | KLA | UV1280SE | FILM THICKNESS | 200 |
| 284 | KLA | LD10 Stripped Stripped | THK20x_Spectrafilm_KLA | 300 |
| 285 | KLA | 6220 | D0 MEASUREMENT | 200 |
| 286 | KLA | UV1280SE | FILM THICKNESS | 200 |
| 287 | KLA | UV1280SE | FILM THICKNESS | 200 |
| 288 | KLA | UV1280SE | FILM THICKNESS | 200 |
| 289 | KLA-TENCOR | EDR5200 | SEM REVIEW | 300 |
| 290 | KLA-TENCOR | EDR5200 | SEM REVIEW | 300 |
| 291 | KLA-TENCOR | EDR5200 | SEM REVIEW | 300 |
| 292 | KLA-TENCOR | EDR5200 | SEM REVIEW | 300 |
| 293 | KLA-TENCOR | SCD-XT | OXIDE THICKNESS | 300 |
| 294 | KLA-TENCOR | SCD-XT | OXIDE THICKNESS | 300 |
| 295 | KLA-TENCOR | SCD-XT | OXIDE THICKNESS | 300 |
| 296 | KLA-TENCOR | VIPER | MACRO INSPECTION | 300 |
| 297 | KLA-TENCOR | AIT XUV | DARK FIELD | 300 |
| 298 | KLA-TENCOR | AIT XUV | DARK FIELD | 300 |
| 299 | KLA-TENCOR | AIT | DARK FIELD | 300 |
| 300 | KLA-TENCOR | AIT | DARK FIELD | 300 |
| 301 | KLA-TENCOR | AIT | DARK FIELD | 300 |
| 302 | KOBELCO | KOBELCO V500 Fab10 Transfer | Material Analysis | 300 |
| 303 | KOKUSAI | DJ1236VN | FVX39x_LowK_ALDSIN | 300 |
| 304 | Lam | NOVELLUS C2 | CVD NOV | 200 |
| 305 | LAM | Inova, CH1 – HCM Cu ALP (2%Mn), CH2 – RPM, CH3 – HCM Ta IONX, CH4 – Cool station, CH5 – HCM Ta IONX, CH7 – HCM Cu AS | TFM_Cu Barrier Seed_Novellus | 300 |
| 306 | LAM | Inova, CH1 – HCM Cu ALP (2%Mn), CH3 – HCM Ta IONX, CH4 – Cool station, CH5 – HCM Ta IONX, CH7 – HCM Cu AS (2%Mn)) | TFM_Cu Barrier Seed_Novellus | 300 |
| 307 | LAM | Inova | TFM_TiN-HM Dep_Novellus | 300 |
| 308 | LAM | C3 | STI/STI | 300 |
| 309 | LAM | C3 | HDP STI / HDP STI | 300 |
| 310 | Lam | METAL M | ETX93x_TFHM DPT ETCH | 300 |
| 311 | LAM | SOLA Dual Wavelength | UVC51x_UVCure | 300 |
| 312 | LAM | 2300 Exelan Flex | Oxide Etch | 300 |
| 313 | LAM | 9600 BRME | WAC WIRING | 200 |
| 314 | LAM | E4-Coronus | BevelStrip | 300 |
| 315 | Lam | 4520XL SA | BEOL RIE | 200 |
| 316 | Lam | 4520XL SA | BEOL RIE | 200 |
| 317 | Lam | 4520XL SA | BEOL RIE | 200 |
| 318 | Lam | 4520XL SA | BEOL RIE | 200 |
| 319 | Lam | 4520XL SA | BEOL RIE | 200 |
| 320 | Lam | NOVELLUS C2 | CVD NOV | 200 |
| 321 | Lam | NOVELLUS C2 | CVD NOV | 200 |
| 322 | Lam | 4520XL SA | BEOL RIE | 200 |
| 323 | Lam | NOVELLUS C2 | CVD NOV | 200 |
| 324 | Lam | NOVELLUS C2 | CVD NOV | 200 |
| 325 | Lam | NOVELLUS C2 | CVD NOV | 200 |
| 326 | LAM | VECTOR Excel – CHA-NST, CHB-AlN, CHC-NDC/ODC | CVD96x_NH3 Plasma + SiC NDC | 300 |
| 327 | Lam | E5 – Kiyo Metal HP – (2+2) | ETX91x_Al Pad Etch | 300 |
| 328 | Lam | – E5 – Kiyo EX – (3+2) CH – PM 1-5 | ETX31x_Spacer Etch | 300 |
| 329 | LAM | E5 – Kiyo FX – (3+1) CH (Fab1 PO Reroute:ETX4101) – PM 1-4 | SiRecessEtch | 300 |
| 330 | LAM | Inova, CH1 – HCM Cu ALP (2%Mn), CH2 – RPM, CH3 – HCM Ta IONX, CH4 – Cool station, CH5 – HCM Ta IONX, CH6 – HCM Ta IONX2, CH7 – HCM Cu AS | TFM_Cu Barrier Seed_Novellus | 300 |
| 331 | LAM | – E5 – Kiyo EX – (3+2) CH – PM 1-5 | ETX25x_RIESOH | 300 |
| 332 | LAM (NOVELLUS) | C2 TRIPLE SPEED | HDP USG | 200 |
| 333 | LAM (NOVELLUS) | C2 TRIPLE SPEED | HDP USG | 200 |
| 334 | LAM (NOVELLUS) | C2 TRIPLE SPEED | HDP USG | 200 |
| 335 | LAM (NOVELLUS) | C2 TRIPLE SPEED | HDP USG | 200 |
| 336 | Lasertec | EUV Reticle Back Side Inspection | EUV_BacksideInspect | 300 |
| 337 | LEICA | LEICA INS1000 | CFM | 200 |
| 338 | LINTECH | RAD3510F/12 | Lamination (BackSideGrinding) | 300 |
| 339 | LINTECH | RAD3010F/12 | Peeling (BackSideGrinding) | 300 |
| 340 | MATTSON | ASPEN2 ICP | RESIST STRIP | 200 |
| 341 | MATTSON | MILLIOS HVM – PM1 | HVM – PM1 | 300 |
| 342 | MATTSON | ASPEN2 ICP | RESIST STRIP | 200 |
| 343 | MATTSON | ASPEN2 ICP | RESIST STRIP | 200 |
| 344 | MATTSON | ASPEN2 ICP | RESIST STRIP | 200 |
| 345 | MEI | STEAG REFURBISH | SURFACE PREP | 200 |
| 346 | METRYX | MENTOR DF3 | MET800 | 300 |
| 347 | METRYX | MENTOR DF3 | MET800 | 300 |
| 348 | MSP CORP | 2300-NPT-2 | PARTICLE DEPOSITION | 300 |
| 349 | NA | P8XL Prober | Tester | 200 |
| 350 | NA | P8XL | Tester | 200 |
| 351 | NA | P8XL | Tester | 200 |
| 352 | NANOMETRICS | Unifire 7900 Interferometer – 20nm TSV Placeholder (Eval) | Profilometry | 300 |
| 353 | Nexx Systems | Sputter 3D | SPUTTER Sputter 3D | 300 |
| 354 | NI | PXIE RTS TESTER | ETEST RTS TESTER | 300 |
| 355 | NICOLET | ECO8S * | NA | 200 |
| 356 | NIKON | S208D | DUV | 300 |
| 357 | NIKON | S208D | DUV | 300 |
| 358 | NIKON | S208 | 248NM KRF SCANNER – NON CRITCAL LAYER | 300 |
| 359 | NIKON | S208 | 248NM KRF SCANNER – NON CRITCAL LAYER | 300 |
| 360 | NIKON | NSR-2205 EX14C | Stepper | 200 |
| 361 | NIKON | NSR-2205 EX14C | Stepper | 200 |
| 362 | NIKON | EX14 | DUV STEPPER | 200 |
| 363 | NIKON | I12 | ILINE STEPPER | 200 |
| 364 | NIKON | I12 | ILINE STEPPER | 200 |
| 365 | NIKON | I12 | ILINE STEPPER | 200 |
| 366 | NITTO | DETAPER | Tester | 300 |
| 367 | NOVA | T500 | Profile Measurement | 300 |
| 368 | Novellus | VECTOR EXPRESS SYSTEM | PECVD VECTOR EXPRESS SYSTEM | 300 |
| 369 | NOVELLUS | Sabre Classic | VIAFORM PLATING | 200 |
| 370 | NOVELLUS | C2 DUAL SEQUEL | NIT MIM | 200 |
| 371 | OEM GROUP | HEATPULSE 8108 | RTX | 200 |
| 372 | OEM GROUP | HEATPULSE 8108 | RTX | 200 |
| 373 | OEM GROUP | HEATPULSE 8108 | RTX | 200 |
| 374 | OEM GROUP | HEATPULSE 8108 | RTX | 200 |
| 375 | OXFORD INSTRUMENTS | OpAL RPT ALD for Hafnium | PFA | 300 |
| 376 | Park System | NX HiVac | Material Analysis | 300 |
| 377 | PHOENIX | MICROMEX SE 160T | XRAY | 300 |
| 378 | POONGSAN | GENI | High Pressure Anneal | 300 |
| 379 | RCS | 300PS-M100 | PAD SHAVE | 300 |
| 380 | RECIF | RSC122 | FEOL MANUAL | 300 |
| 381 | RECIF | RSC142 | BEOL AUTO | 300 |
| 382 | RICOR | CRYOGENIC AND VACUUM SYSTEM | N2 PURGE | 300 |
| 383 | Rorze | EUV Reticle Handling | EUV_ReticleHandler | 300 |
| 384 | RUDOLPH | S3000S | TFM_THK_Rudolph | 300 |
| 385 | RUDOLPH | S3000S | TFM_THK_Rudolph | 300 |
| 386 | RVSI | WS-3800 | WAFER INSPECTION SYS 300M | 200 |
| 387 | RVSI | WS-3800 | WAFER INSPECTION SYS 300M | 200 |
| 388 | RVSI | ws-3000hs | PPF | 200 |
| 389 | SANKYO | SWH80 | RCA | 200 |
| 390 | SANKYO | SWH80 | RCA | 200 |
| 391 | SARTORIUS | LA310S | ALI | 300 |
| 392 | SCREEN | SU3000 | BEOL SW-Clean DHF | 300 |
| 393 | Screen | SU3100 – MPC3,MPC4 Nitric | HiK backside cleans with HF and HF/HNO3, Frontside SPM post ash, trench hardmask removal with HF/H2SO4 | 300 |
| 394 | Screen | SU3100 – 8ch – MPC 1-8 – SC1, Ammonia, Peroxide, HF, IPA | SNK45x_M_SWC | 300 |
| 395 | Screen | SU3100 —- 8ch – MPC 1-8 – TMAH | TMAH 25%/2.5% – TJ Cavity Etch | 300 |
| 396 | Screen | SU3100 – 8ch – MPC 1-8 – SC1, Ammonia, Peroxide, HF, IPA | Hot Ultra-DHF Confguration | 300 |
| 397 | SEMES | BLEUICE PRIME – CH 1-8 – SC1, Ammonia, Peroxide, Sulfuric, IPA | SNK65x_DSP STRIP | 300 |
| 398 | SEMES | BLEUICE PRIME – CH 1-8 – SC1, Ammonia, Peroxide, Sulfuric, IPA | SNK65x_DSP STRIP | 300 |
| 399 | SEMES | LOZIX | ALT80x_SOHCoat | 300 |
| 400 | SEMES | LOZIX | ALT80x_SOHCoat | 300 |
| 401 | SEMES | LOZIX 4 Cup + 12 UHP + 8 CP 4 Cup + 12 UHP + 8 CP | ALT80x_SOHCoat | 300 |
| 402 | SEMES | LOZIX 4 Cup + 12 UHP + 8 CP 4 Cup + 12 UHP + 8 CP | ALT80x_SOHCoat | 300 |
| 403 | SEMIgear | GENEVA | REFLOW GENEVA | 300 |
| 404 | SEMIgear, Inc. | GENEVA STP300 | REFLOW/REOXIDE | 300 |
| 405 | SEMI-PROBE | PS4L SA12 | Prober | 300 |
| 406 | SEMITOOL | MAGNUM | ALEG380 CLEAN | 200 |
| 407 | SEMITOOL | MAGNUM | ALEG380 CLEAN | 200 |
| 408 | SEZ | 203 | BACKSIDE CLEAN | 200 |
| 409 | SEZ | 223 | POST METAL CLEAN | 200 |
| 410 | SEZ | 203 | BACKSIDE CLEAN | 200 |
| 411 | SEZ | 223 | POST METAL CLEAN | 200 |
| 412 | SOLVISION | PRECIS 3D | C4B INSP | 300 |
| 413 | SOLVISION | PRECIS 3D | C4B INSP | 300 |
| 414 | SOLVISION | PRECIS 3D | na | 300 |
| 415 | STEAG | AWP AWP | SURFACE PREP | 200 |
| 416 | STEAG | AWP AWP | SURFACE PREP | 200 |
| 417 | Suss | ACS300 | ACS300 | 300 |
| 418 | Suss | Laser Ablation | Laser Ablation | 300 |
| 419 | SVG | SVG VTR7000 | FURNACES | 200 |
| 420 | SVG | SVG VTR7000 | FURNACES | 200 |
| 421 | SVG | SVG VTR7000 | FURNACES | 200 |
| 422 | SVG | TR700 VTR7000 | FURNACES | 200 |
| 423 | SVG | SVG VTR7000 | FURNACES | 200 |
| 424 | SVG | SVG VTR7000 | FURNACES | 200 |
| 425 | SVG | SVG VTR7000 | FURNACES | 200 |
| 426 | SVG | SVG VTR7000 | FURNACES | 200 |
| 427 | SVG | SVG VTR7000 | FURNACES | 200 |
| 428 | SVG | VTR7000 | TEOS | 200 |
| 429 | SVG | VTR7000 | TEOS | 200 |
| 430 | TBD | TIM & LID ADHESIVE DISPENSER | ALI | 300 |
| 431 | TEL | LITHIUS PRO-V (Fab1 PO reroute: TRK4361) | LIT_ArF_Immersion | 300 |
| 432 | TEL | LITHIUS PRO-i | ARFIM | 300 |
| 433 | TEL | LITHIUS PRO-V 6-ADH + 4-BCT + 4-BST + 2 PIR + 4 CHHA + 20-CGRA + 8-CPRPP + 4-COT + 8-CSWP +8-DEV + 2-RCPL + 4-TCT + 2-RSM + 12-SCPL + 1-WEE + 1-BWEE | LIT_ArF_Immersion | 300 |
| 434 | TEL | LITHIUS PRO-V 6-ADH + 4-BCT + 4-BST + 2 PIR + 4 CHHA + 20-CGRA + 8-CPRPP + 4-COT + 8-CSWP +8-DEV + 2-RCPL + 4-TCT + 2-RSM + 12-SCPL + 1-WEE + 1-BWEE | LIT_ArF_Immersion | 300 |
| 435 | TEL | LITHIUS PRO-V 6-ADH + 4-BCT + 4-BST + 2 PIR + 4 CHHA + 20-CGRA + 8-CPRPP + 4-COT + 8-CSWP +8-DEV + 2-RCPL + 4-TCT + 2-RSM + 12-SCPL + 1-WEE + 1-BWEE | LIT_ArF_Immersion | 300 |
| 436 | TEL | LITHIUS PRO-V 6-ADH + 4-BCT + 4-BST + 2 PIR + 4 CHHA + 20-CGRA + 8-CPRPP + 4-COT + 8-CSWP +8-DEV + 2-RCPL + 4-TCT + 2-RSM + 12-SCPL + 1-WEE + 1-BWEE | LIT_ArF_Immersion | 300 |
| 437 | TEL | TEL TACTRAS VIGUS ATCC – 4 LK3 chm | ETX86x_ILDEtch_LK3 | 300 |
| 438 | TEL | LITHIUS ARF | 248NM KRF TRACK | 300 |
| 439 | TEL | LITHIUS ARF | 248NM KRF TRACK | 300 |
| 440 | TEL | LITHIUS 2BLK | ILINE SCANNER TRACK | 300 |
| 441 | TEL | LITHIUS 2BLK | ILINE SCANNER TRACK | 300 |
| 442 | TEL | Prober – Precio | ATCWET_4082_Precio | 300 |
| 443 | TEL | Precio —- Clean&Cold V93K Interface | ATC93K_93000_Precio | 300 |
| 444 | TEL | Precio —- Clean&Cold V93K Interface | Tester | 300 |
| 445 | TEL | LITHIUS ARF | 248NM KRF TRACK | 300 |
| 446 | TEL | Indy IRAD | Furnace | 300 |
| 447 | TEL | TRIAS e+ TiN | MDX47x_MG_ALD TIN | 300 |
| 448 | TEL | ALPHA 8S | DENSIFICATION | 200 |
| 449 | TEL | ALPHA 8S | GATE OX | 200 |
| 450 | TEL | ALPHA 8S | GATE OX | 200 |
| 451 | TEL | ALPHA 8S | GATE OX | 200 |
| 452 | TEL | ALPHA 8S | GATE OX | 200 |
| 453 | TEL | ALPHA 8S | LPCVD NITRIDE | 200 |
| 454 | TEL | ALPHA 8S | LPCVD NITRIDE | 200 |
| 455 | TEL | ALPHA 8S | LPCVD NITRIDE | 200 |
| 456 | TEL | ALPHA 8S | LPCVD NITRIDE | 200 |
| 457 | TEL | P8 | ELECTRICAL TESTING | 200 |
| 458 | TEL | P8 | ELECTRICAL TESTING | 200 |
| 459 | TEL | P8 | ELECTRICAL TESTING | 200 |
| 460 | TEL | P8 | ELECTRICAL TESTING | 200 |
| 461 | TEL | ACT8 3C3D | ILINE TRACK | 200 |
| 462 | TEL | ALPHA 8S | WELL DRIVE | 200 |
| 463 | TEL | ALPHA 8S | WELL DRIVE | 200 |
| 464 | TEL | LITHIUS 3BLK | 193NM ARF IMMERSION SCANNER | 300 |
| 465 | TEL | TACTRAS | CONTACT ETCH 12FDX | 300 |
| 466 | TEL | P12XL | PARAMETRIC TESTER | 300 |
| 467 | TEL | P12XL | PARAMETRIC TESTER | 300 |
| 468 | TEL | Alpha-303i | High temp oxide | 300 |
| 469 | TEL | Indy IRAD | Furnace | 300 |
| 470 | TEL | TELIUS | Poly FEOL Etch | 300 |
| 471 | TEL | Wafer Bond | Wafer Bond | 300 |
| 472 | TEL | ACT 12 | 248NM KRF TRACK | 300 |
| 473 | TEL | ACT 12 | 248NM KRF TRACK | 300 |
| 474 | TEL | LITHIUS 2BLK | 248NM KRF TRACK | 300 |
| 475 | TEL | LITHIUS 2BLK | 248NM KRF TRACK | 300 |
| 476 | TEL | LITHIUS 3BLK | 193NM ARF SCANNER | 300 |
| 477 | TEL | INDY-PLUS – BOAT1, BOAT2 ALD_Ox | FVX41x_Mid_Temp_ALD_Ox | 300 |
| 478 | TEL | Indyplus | FVX99x_OBSOLETE | 300 |
| 479 | TEL | CERTAS WING | DCL10x_ChemOxRemoval | 300 |
| 480 | TEL | TACTRAS VIGUS ATCC LK3 | ContactEtch | 300 |
| 481 | TEL | TRIAS e+ TiN | MDX47x_MG_ALD TIN | 300 |
| 482 | TEL | INDYPLUS | FVX99x_OBSOLETE | 300 |
| 483 | TEL | INDYPLUS | FVX99x_OBSOLETE | 300 |
| 484 | TEL | INDYPLUS iRAD_OXIDE – BOAT1 – IRAD Oxide | FVX44x_HTOX | 300 |
| 485 | TEL | INDYPLUS iRAD_OXIDE – BOAT1 – IRAD Oxide | FVX44x_HTOX | 300 |
| 486 | TEL | LITHIUS 2BLK | 248NM KRF SCANNER – NON CRITCAL LAYER | 300 |
| 487 | TEL | Alpha-303i | P-Doped Poly | 300 |
| 488 | Tel | P12XL | Inline test prober | 300 |
| 489 | TEL | Precio NANO | Tester | 300 |
| 490 | TEL | Precio Nano | Tester | 300 |
| 491 | TEL | P12XL | PPF | 200 |
| 492 | TEL | P12XL | PPF | 200 |
| 493 | TEL | P8XL | PPF | 200 |
| 494 | TEL | P8XL | PPF | 200 |
| 495 | TEL | P8XL Prober | PPF | 200 |
| 496 | TEL | P8XL | PPF | 200 |
| 497 | TEL | P8XL Prober | PPF | 200 |
| 498 | TEL | UNITY2E 85DD | AB ETCH | 200 |
| 499 | TEL | INDYPLUS-A | [Gate_Poly] | 300 |
| 500 | TEL | LITHIUS Pro-Z | ALT66x_B | 300 |
| 501 | TEL | LITHIUS Pro-Z | ALT66x_B | 300 |
| 502 | TEL | ALPHA 8S | LPCVD POLY | 200 |
| 503 | TEL | TACTRAS VIGUS ATCC – 6ch – ContactEtch_HK 6CH – PM 1-6 LK2 BSP w/ 200mm exhaust | ILDEtch_HM | 300 |
| 504 | TEL | INDYPLUS | FVX43x_MSHTO | 300 |
| 505 | TEL | INDYPLUS – BOAT1, BOAT2 HK POLY | FVX43x_MSHTO | 300 |
| 506 | TEL | TACTRUS VIGUS ATCC | ILDEtch_HM | 300 |
| 507 | TEL | TACTRAS VIGUS ATCC – 6ch – ILDEtch_HM 6CH – PM1,2,5,6 – LK2 BSP w/ 200mm exhaust, PM3,4 – LK3 QRE + ALE Rev1 ESC | ILDEtch_HM | 300 |
| 508 | TEL | TACTRAS NCCP (IBM Paid Tool) 4ch (Original Config) | GatePatterning | 300 |
| 509 | TEL | TACTRUS VIGUS ATCC | ILDEtch_HM | 300 |
| 510 | TEL | TACTRAS VIGUS ATCC – 6ch – ILDEtch_HM 6CH – | ETX86x_ILDEtch_LK3 | 300 |
| 511 | TEL | ACT8 | ILINE TRACK | 200 |
| 512 | TEL | ACT8 | ILINE TRACK | 200 |
| 513 | TEL | MARK8 | DUV TRACK | 200 |
| 514 | TEL | ACT8 2C2D | ILINE TRACK | 200 |
| 515 | TEL | UNITY2E 85DD | VIA ETCH | 200 |
| 516 | TEL | UNITY2E 85DD | VIA ETCH | 200 |
| 517 | TEL | ACT8 4C4D | DUV TRACK | 200 |
| 518 | TEL | MARK8 2C | BARC COAT | 200 |
| 519 | TEL | ALPHA 8S | LPCVD POLY | 200 |
| 520 | TEL | ALPHA 8S | LPCVD NITRIDE | 200 |
| 521 | TEL | UNITY2E 85DD | VIA ETCH | 200 |
| 522 | TEL | UNITY2E 85DD | VIA ETCH | 200 |
| 523 | TEL | UNITY2E 85DD | CONTACT ETCH | 200 |
| 524 | TEL | UNITY2E 85DD | VIA ETCH | 200 |
| 525 | TEL (FSI) | ZETA | SALICIDE STRIP – COSI2 | 200 |
| 526 | TENCOR | AIT II | AIT 2 | 200 |
| 527 | TENCOR | DEFECT INS_AIT2_ | AIT 2 | 200 |
| 528 | TENCOR | AIT1 | CMP AIT2 | 200 |
| 529 | TENCOR | TENCOR_DEFECT INS_AIT1 | CFM | 200 |
| 530 | TORR International | MSS3G2 | Material Analysis | 300 |
| 531 | ULTRON SYSTEM, INC | UH104-8 | UV CURE | 200 |
| 532 | UNAXIS | CLUSTERLINE300 | UBM DEP | 300 |
| 533 | UNIVERSAL PLASTICS | Semi-Auto Wet Bench | IPASA | 200 |
| 534 | VARIAN | EHP500 | MEDIUM CURRENT IMPLANT | 200 |
| 535 | VARIAN | EHP500 | MEDIUM CURRENT IMPLANT | 200 |
| 536 | VWR | VWR SHELDON Oven 1601 | Oven | 300 |
| 537 | WESTECH | 372 M | CMP | 200 |
| 538 | WESTECH | 372 M | CMP | 200 |
| 539 | WESTECH | 372 M | CMP | 200 |
| 540 | WESTECH | 372 M | CMP | 200 |
| 541 | WESTECH | 372 M | CMP | 200 |
| 542 | WESTECH | 372 M | CMP | 200 |
| 543 | WESTECH | 372 M | CMP | 200 |
| 544 | WESTECH | 372 M | CMP | 200 |
| 545 | WESTECH | 372 M | CMP | 200 |
| 546 | WESTECH | 372 M | CMP | 200 |
| 547 | WESTECH | 372 M | CMP | 200 |
| 548 | WESTECH | 372 M | CMP | 200 |
| 549 | WESTECH | 372 M | CMP | 200 |
| 550 | WONIK IPS | MAHA MP – PMA-SiON, PMB-SiON, PMC-SiON | CVD76x_ARL | 300 |
| 551 | WONIK IPS | MAHA MP – PMA-SiON, PMB-SiON, PMC-SiON | TBD | 300 |
| 552 | Zeiss | NanoFab | FAL LAB | 200 |
| 553 | ZEISS | AXIOTRON | SCOPE | 200 |
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