Description
Equipment Auction. If you are interested in these equipment, let’s know before the close of the auction.
Location: SS10588-S-2
Valid: Subject to prior sale without notice. This is only for end users. Applicate your time.
Condition: Used.
| NO. | Description | Supplier | Model | Process |
| 1 | STRIP GRINDING MACHINE | SUHWOO | SAMG+101 | R&D LAB Project |
| 2 | MANUAL MOLD SYSTEM | BESI | MMS-LM75-102 | R&D LAB Project |
| 3 | WIRE BONDER | KNS | ICONN | K5 OCABGA WIRE BOND |
| 4 | WIRE BONDER | KNS | ICONN LA | K5 OCABGA WIRE BOND |
| 5 | WIRE BONDER | KNS | ICONN LA | K5 OCABGA WIRE BOND |
| 6 | LASER MARKING MACHINE | EO TECH | CSM3002 | K5 FCBGA A_L/MARKING |
| 7 | OVEN | DUOCOM | HS-3640 | K5 DPS BSC CURE |
| 8 | REFLOW M/C | HELLER | 1809EXL | K5 FCBGA A_S/BALL ATTA |
| 9 | DIE BONDER | SHINKAWA | SPA-400 | R&D LAB Project |
| 10 | WAFER SAW | TSK | A-WD-300TX | K5 DPS SAW CLEAN |
| 11 | DIE BONDER | ASM | AD8312 | R&D LAB Project |
| 12 | PICK AND PLACE | BESI | 2200EVO | K5 COW_PICK AND PLACE |
| 13 | DIE SORTER | STI | ISORT MAXX | K5 DPS PICK&PLACE |
| 14 | DIE SORTER | STI | ISORT MAXX | K5 DPS PICK&PLACE |
| 15 | FLUX CLEANER | YANG HUCA | YF-05SOLVENT | K5 FCBGA A_S/BALL ATTA |
| 16 | SOLDER BALL ATTACH M | SSP | WBPS-2000 | R&D LAB Project |
| 17 | LOADER | KOVIS | WH-3010L | Advanced Engineering Project |
| 18 | OFF-LOADER | KOVIS | WH-3010U | Advanced Engineering Project |
| 19 | LOADER | HAUTO | MSP-GEN-LD-001-R00 | R&D LAB Project |
| 20 | OFF-LOADER | HAUTO | MSP-GEN-UD-001-R00 | R&D LAB Project |
| 21 | LOADER | KOVIS | WH-3010L | R&D LAB Project |
| 22 | OFF-LOADER | KOVIS | WH-3010U | R&D LAB Project |
| 23 | TEST OTHERS | KOVIS | WH-3010LUP | Advanced Engineering Project |
| 24 | BUMP COAT&DEVELOPER | SUSS | ACS300GEN2 | K5 Prod BUMP |
| 25 | Auto loader/wafer insfaction | K5 SIPlet_E SLT | ||
| 26 | WAFER SAW | TSK | A-WD-300TX | K5 DPS SAW/CLEAN |
| 27 | WAFER SAW | TSK | A-WD-300TX | K5 DPS SAW/CLEAN |
| 28 | WAFER SAW | TSK | A-WD-300TX | K5 DPS SAW/CLEAN |
| 29 | OVEN | DUOCOM | HS-3640 | E UNDERFILL CU |
| 30 | SCOPE | OLYMPUS | MX61L-F | S/BALL ATTACH2 |
| 31 | LOADER | SS OTRON | SSO-DLS-100 | FCHIP ATTACH |
| 32 | CHIP MOUNTER | PANASONIC | CM602-L | FCBGA FCHIP ATTACH |
| 33 | CHIP MOUNTER | PANASONIC | CM602-L | FCBGA FCHIP ATTACH |
| 34 | CHIP MOUNTER | PROTEC | PRO-6020 | R&D LAB Project |
| 35 | PICK AND PLACE | STI | ISORT MAXX | FC CSP PICK&PLACE |
| 36 | TEST OTHERS | FAMECS | FRNB-800AA-10PE | FCHIP ATTACH |
| 37 | WAFER SAW | TSK | A-WD-300TX | K5 DPS SAW/CLEAN |
| 38 | LASER M/K M/C | EM TECH | BSM1224G | R&D LAB Project |
| 39 | O/S TESTER | NEX SCIEN | YIT-4210 | O/S TEST |
| 40 | BALL SHEAR TESTER | DAGE | BT-4000TPXY | WIRE BOND |
| 41 | PICK AND PLACE | SAMSUNG OTRON | SSO-JIS-027 | S.MOUNT DEVIC |
| 42 | LASER M/K M/C | FAMECS | FLM-1000APE | S.MOUNT DEVIC |
| 43 | OVEN | DUOCOM | HS-3640 | K5 DPS BSC CURE |
| 44 | TEST OTHERS | SALON TEKNOPAJA | PWB LEVEL DROP TEST | Advanced Engineering Project |
| 45 | UNDERFILL M/C | PROTEC | FDS-1000MJ | R&D LAB Project |
| 46 | WAFER BACKGRINDER | DISCO | DFG850 | R&D LAB Project |
| 47 | DIE SORTER | STI | ISORT MAXX | K5 DPS PICK&PLACE |
| 48 | DIE SORTER | STI | ISORT MAXX | K5 DPS PICK&PLACE |
| 49 | LAMINATOR | TOOL & DIE | DIE NAMICS PRESS | R&D LAB Project |
| 50 | MEASURING M/C | NIKON | MM-800/L | K5 QA-Rellab |
| 51 | TEST OTHERS | SUHWOO | SAML+203(DIVERTER) | R&D LAB Project |
| 52 | LASER ABLATION | EO TECH | BMC502W | R&D LAB Project |
| 53 | COATING M/C | ASYMTEK | C-740 | R&D LAB Project |
| 54 | WAFER BACKGRINDER | DISCO | DFS8910 | R&D LAB Project |
| 55 | LOADER | SUHWOO | SAML+101(ONLOADER) | R&D LAB Project |
| 56 | OVEN | DUOCOM | HS-3654 | SBGA ENCAP CURE |
| 57 | OVEN | DUOCOM | HS-3654 | SBGA ENCAP CURE |
| 58 | OFF-LOADER | SUHWOO | SAML+102 | S/BALL ATTACH |
| 59 | OFF-LOADER | SS OTRON | SSO-JSS-05 | 3RD INSPECTION2 |
| 60 | DIE BONDER | ASM | AD8912SD-A | DIE ATTACH |
| 61 | DIE BONDER | ASM | AD8912SD-A | DIE ATTACH |
| 62 | DIE BONDER | ASM | AD8912SD-A | DIE ATTACH |
| 63 | FLUX CLEANER | GST | GFC-1210A | S.MOUNT DEVIC |
| 64 | PICK AND PLACE | SS OTRON | SSO-JIS-027 | FCHIP ATTACH |
| 65 | FLUX CLEANER | SSP | FPS-7200 | K4 OVERHAUL2 |
| 66 | OVEN | VISION SEMICON | VSWCO-2CM | K4 R&D |
| 67 | OVEN | DUOCOM | HS-3640 | FCBGA BAKEFORDRYPACK |
| 68 | SCOPE | NIKON | OPTIPHOT-200 | K5 3/OPT INSP |
| 69 | SCOPE | NIKON | OPTIPHOT-300D | K5 3/OPT INSP |
| 70 | SCOPE | NIKON | ECLIPSE-L200 | K5 3/OPT INSP |
| 71 | TEST OTHERS | AND | GR-200 | K5 3/OPT INSP |
| 72 | LAMINATOR | DYNATECH | DT-ASM4030 | FC MLF PKG SAW |
| 73 | LASER STEALTH SAW | ACCRETECH | ML300 | 1399_LASER CUT SAW |
| 74 | OFF LOADER | SUHWOO | SAML+310(OFFLOADER) | E SIP S/BALL ATTACH |
| 75 | DRY PACKING MACHINE/SP-750D | HAN WOO MUL | K3_(DRY)PACKING | |
| 76 | OVEN | DUOCOM | HS-2900A | K5_BAKE |
| 77 | CHIP MOUNTER | ASM | SIPLACE SX4 | FCBGA FCHIP ATTACH |
| 78 | MOLD M/C | SEMISYS | ERMSB-4P | MOLD |
| 79 | SOLDER BALL ATTACH M | SSP | BPS-7200AA | K5 OCABGA S/BALL ATTACH |
| 80 | LOADER | AMKOR | CIS-001 | K5 OCABGA DIE ATTACH |
| 81 | OFF-LOADER | AMKOR | CIS-002 | K5 OCABGA DIE ATTACH |
| 82 | BUMP FVI | CAMTEK | FALCON 830 PLUS | FCBGA WFR INCOM INSP |
| 83 | BUMP FVI | CAMTEK | FALCON 830 PLUS | AOI 12” |
| 84 | SCOPE | ECLIPSE-L200 | K4 OVERHAUL1 | |
| 85 | MEASURING M/C | VIEW ENGINEERING | BENCHMARK 250 | A Line PKGSAW |
| 86 | SPUTTER SYSTEM | OERLIKON | CLN200 II | UBM SPUTTERING |
| 87 | WAFER MOUNTER | SEMISYS | SEWM100 | FC POP WAFER MOUNT |
| 88 | TEMP CYCLE CHAMBER | DESPATCH / RANSCO | RTS 7168-2 | QA 2nd team 3Pt |
| 89 | HAST CHAMBER | HIRAYAMA | PC422R7 | QA 2nd team 3Pt |
| 90 | X-RAY INSPECTION MACHINE | DAGE | XD7600NT | FCHIP ATTACH |
| 91 | SOLUTION ANALYZER | ANCOSYS | P11-016 | FCBGA PLASMA CLEAN3 |
| 92 | SPUTTER SYSTEM | OERLIKON | CLN200 II | UBM SPUTTERING |
| 93 | BUMP ALIGNER | SUSS | DSC300 | K4 OVERHAUL2 |
| 94 | POLISHING MACHINE | BUEHLER | 49-3300T | QA 2nd team 3Pt |
| 95 | WIRE BONDER | KNS | MAXUM ULTRA | WIRE BOND |
| 96 | WIRE BONDER | KNS | MAXUM ULTRA | WIRE BOND |
| 97 | WIRE BONDER | KNS | MAXUM ULTRA | WIRE BOND |
| 98 | ON LOADER | SUHWOO | SAML+101(ONLOADER) | FLUX CLEAN |
| 99 | CHIP MOUNTER | PANASONIC | CM602-L | FCBGA CHIP MOUNT |
| 100 | SAT | SONIX | ECHO LS | FCBGA HEAT SPREADER |
| 101 | LASER GROOVING MACHINE | DISCO | DFL7160 | FCBGA LASER GROOVE |
| 102 | LASER ABLATION | HANMI | LASER ABLATION-3000 | R&D LAB Project |
| 103 | FLUX CLEANER | GST | GFC-1210A | R&D LAB Project |
| 104 | MEASURING M/C | TAMAR | 300MM WAFER SCAN | K5 DIMENSION INSP |
| 105 | BUMP COAT&DEVELOPER | SUSS | ACS300GEN2 | K5 HDFO COAT&DEVELOP |
| 106 | LID ATTACH | PROTEC | PRO-2020NT | K5 FCBGA A_H/S/A |
| 107 | BUMP ETCH(PR STRIP) | INNO MAX | TRAUM310LS | K5 ETCH_BATH |
| 108 | BUMP ETCH(PR STRIP) | SCIENTECH | POLAR | K5 ETCH_SSAT |
| 109 | LASER STEALTH SAW | TSK | ML300FH | K5 BUMP LASER CUT SAW |
| 110 | DRYER | MUJIN | PSM-304-G3 | K5 SRD |
| 111 | LASER GROOVING | DISCO | DFL7160 | K4 LASER GROOVE |
| 112 | BUMP MARK | EO TECH | CSM2000 | K5 DPS LASER MARK |
| 113 | BUMP MARK | EO TECH | CSM2000E | K5 DPS LASER MARK |
| 114 | INK M/K M/C | DOMINO | AX350I | FCBGA FCHIP ATTACH |
| 115 | INK M/K M/C | DOMINO | AX350I | FCBGA FCHIP ATTACH |
| 116 | SINGULATION M/C | APM | AP-120N | PBGA SINGULATION |
| 117 | MOLD M/C | TOWA | Y-1 | PBGA MOLD |
| 118 | INK M/K M/C | DOMINO | A420I | FCBGA FCHIP ATTACH |
| 119 | INK M/K M/C | DOMINO | A420I | FCBGA FCHIP ATTACH |
| 120 | INK M/K M/C | DOMINO | A420I | FC POP WAFER MOUNT |
| 121 | PRINTER / INK JET Ax350i/DOMINO | DOMINO | A420I | FC POP WAFER MOUNT |
| 122 | PRINTER / INK JET Ax350i/DOMINO | DOMINO | A420I | FC POP WAFER MOUNT |
| 123 | INK JET MARK MACHINE | DOMINO | A420I | FCBGA FLUX CLEANING |
| 124 | LID ATTACH | PROTEC | PRO-2020NDD+ | FCBGA HEAT SPREADER |
| 125 | LASER M/K M/C | EM TECH | BSM4364 | A Line LASER MARK |
| 126 | UNDERFILL M/C | PROTEC | INNOVATION DL+ | FCBGA UNDERFILL |
| 127 | THICKNESS M/C | FISCHER | XDV-U | FCBGA STIFFNER ATTCH |
| 128 | PKG SAW CONVERSION KIT / 4.4X6 (95MM) | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 129 | PKG SAW CONVERSION KIT / 2.5X2.7 (95MM) | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 130 | PKG SAW CONVERSION KIT / 6X4.2 (95MM) | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 131 | PKG SAW CONVERSION KIT / 4.15X4.05 (95MM) | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 132 | O/S TEST KIT | K4 FC MLF_OS TEST | ||
| 133 | O/S TEST KIT | K4 FC MLF_OS TEST | ||
| 134 | O/S TEST KIT | K4 FC MLF_OS TEST | ||
| 135 | PKG SAW CONVERSION KIT / 8.8×11.3 (95MM) | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 136 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 137 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 138 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 139 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 140 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 141 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 142 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 143 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 144 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 145 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 146 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 147 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 148 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 149 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 150 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 151 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 152 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 153 | PKG SAW CONVERSION KIT | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 154 | PKG SAW CONVERSION KIT_15.6×14.6(74mm) | K4 FC MLF PCB/SUBST/PKGSAW | ||
| 155 | OVEN | DUOCOM | HS-3640 | POST CURE |
| 156 | OFF LOADER (BOAT) | FAMECS | FSBU-1000SLAE | FCHIP ATTACH |
| 157 | BANDING MACHINE | STRAPACK | D-53 | Logistics Pt K3 |
| 158 | LAMINATOR | HANMI | STRIP MOUNT 2000 | S/BALL ATTACH2 |
| 159 | OVEN | DUOCOM | HS-2954-9 | MEP MOLD |
| 160 | BANDING M/C | SANG WON | SS-85M | R&D LAB Project |
| 161 | FLIPCHIP BONDER | DATACON | 2200EVO | R&D LAB Project |
| 162 | FLIPCHIP BONDER | DATACON | 2200EVO | R&D LAB Project |
| 163 | FLIPCHIP BONDER | BESI | 2200EVO | R&D LAB Project |
| 164 | MEASURING M/C | UNION | DH-II | A Line W/B |
| 165 | LASER GROOVING | DISCO | DFL7160 | FC CSP Laser groover |
| 166 | DIE BONDER | ASM | AD8912SD-A | A Line D/A |
| 167 | DIE BONDER | ASM | AD8912SD-A | A Line D/A |
| 168 | HEAT SLUG ATTACH M/C | PROTEC | PRO-2020NDD | FCBGA HEAT SPREADER |
| 169 | BUMP MARK | EO TECH | CSM3002 | DPS LASER MARK |
| 170 | WAFER MOUNTER | SEMISYS | SEWM100 | FCBGA WAFER MOUNT |
| 171 | SCOPE | NIKON | OPTIPHOT-200 | K5 FCBGA SAW/CLEAN |
| 172 | OFF-LOADER | SUHWOO | SAML+305(OFFLOADER) | K5 OVERHAUL |
| 173 | LASER GROOVING | DISCO | DFL7160 | K5 LASER GROOVING |
| 174 | LASER GROOVING | DISCO | DFL7160 | K5 LASER GROOVING |
| 175 | DIE BONDER | ESEC | 2008 HS3 PLUS | SCSP DIE ATTACH |
| 176 | DIE BONDER | ESEC | 2008 HS3 PLUS | SCSP DIE ATTACH |
| 177 | DIE BONDER | ESEC | 2008 HS3 PLUS | SCSP DIE ATTACH |
| 178 | LEAD INSPECTION M/C | STI | HEXA MAXX | K4 SMLF F.V.I-100% |
| 179 | INSPECT M/C | WOOSHIN | HNS-0011 | MLF 3RD INSPECTION |
| 180 | INSPECT M/C | WOOSHIN | HNS-0011 | MLF 3RD INSPECTION |
| 181 | INSPECT M/C | WOOSHIN | HNS-0011 | MLF 3RD INSPECTION |
| 182 | INSPECT M/C | WOOSHIN | HNS-0011 | MLF 3RD INSPECTION |
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