Description
We can supply many configurations of the Endura 5500, Centura 5200 / 5300 and P5000. System mainframe types are: RTP (Rapid Thermal Process), DCVD (Dielectric CVD), WCVD (Tungsten CVD), Tungsten Etch Back and Dielectric Etch. This also includes configuring your system to your specific wafer size with a variety of options
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Endura PVD Processes
- Standard Aluminum (Al)
- Planarized Hot Aluminum
- (HTHU)
- Standard Titanium (Ti)
- Coherent Titanium (Coh Ti)
- Dedicated Titanium Nitride (TiN)
- Titanium / Titanium Nitride (TTN)
- Coherent Titanium / Titanium Nitride (Coh TTN)
- Titanium Tungsten (TiW)
- Tungsten (W)
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Endura Chambers
- Standard Body Chamber
- Wide Body PVD Chamber
- Water Cooled PVD Chamber
- Paste Chamber (Ch-5)
- Preclean I / II chamber
- Orienter / Degas Chamber
- PVD Degas Chamber
- Vectra IMP
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Endura System Option
- Specific Wafer Size Configuration
- Wide or Narrow Body Load Locks
- HP Motorized Lifts
- Single or Dual Orienter / Degas Chambers
- HP, HP+ or VHP Robots
- Fast Wafer Mapping
- Buffer / Transfer Lid Hoist
- 3Phase or Enhanced Cryopumps
- Through-the-Wall or Ballroom Style Installation
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SS6688W