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AMAT Endura 5500

Description

Applied Materials Endura 5500
This item is only for end users. It is subject to prior sale without notice. Appreciate your time. We offer completely refurbished Applied Materials® RTP (Rapid Thermal Process), DCVD (Dielectric CVD), WCVD (Tungsten CVD), Tungsten Etch Back and Dielectric Etch  at a significant savings over the cost of a new unit, without sacrificing quality. All of our refurbished systems are guaranteed to meet or exceed the original published manufactured specifications. All of these systems include installation and warranty.

We can supply many configurations of the Endura 5500, Centura 5200 / 5300 and P5000. System mainframe types are: RTP (Rapid Thermal Process), DCVD (Dielectric CVD), WCVD (Tungsten CVD), Tungsten Etch Back and Dielectric Etch. This also includes configuring your system to your specific wafer size with a variety of options

  • Endura PVD Processes

    • Standard Aluminum (Al)
    • Planarized Hot Aluminum
    • (HTHU)
    • Standard Titanium (Ti)
    • Coherent Titanium (Coh Ti)
    • Dedicated Titanium Nitride (TiN)
    • Titanium / Titanium Nitride (TTN)
    • Coherent Titanium / Titanium Nitride (Coh TTN)
    • Titanium Tungsten (TiW)
    • Tungsten (W)
  • Endura Chambers

    • Standard Body Chamber
    • Wide Body PVD Chamber
    • Water Cooled PVD Chamber
    • Paste Chamber (Ch-5)
    • Preclean I / II chamber
    • Orienter / Degas Chamber
    • PVD Degas Chamber
    • Vectra IMP
  • Endura System Option

    • Specific Wafer Size Configuration
    • Wide or Narrow Body Load Locks
    • HP Motorized Lifts
    • Single or Dual Orienter / Degas Chambers
    • HP, HP+ or VHP Robots
    • Fast Wafer Mapping
    • Buffer / Transfer Lid Hoist
    • 3Phase or Enhanced Cryopumps
    • Through-the-Wall or Ballroom Style Installation

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The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers