Description
Alcatel AMS 4200 Plasma DRIE Etch Equipment, Deep Silicon Etch, EndPoint
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MFG Date: 2008
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Deep Silicon Etch Alcatel AMS 4200
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Brooks Platform
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Dual Loadlocks
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Magnatron 7
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Alcatel ACT 600M TMP Turbo
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User Interface PC
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Transfer PC Process Chamber: AMS X200
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Alcatel ACT 1300M TMP Turbo
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Process Gases:
– SF6 1000sccm
– C4F8 400sccm
– O2 100sccm
– O2 800sccm
– Ar 200sccm
– N2 1000sccm
– Ar
– CHF3 EDM
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200/208VAC, 3 Phase, 50/60Hz Alcatel AMS X200
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CE Marked
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Qty 2 – SEMCO HV52000C – SEREN L301 RF
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Advanced Energy Dressler Cesar RF – ENI Spectrum B-3013 RF
Location: CA USA, SS6305W
Valid: Subject to prior sale without notice. This is only for end users. Applicate your time.
Condition: Used.
The trademarks of the equipment and parts contained in this page belonged to the Original Equipment Manufacturers.
