Description
- 12″ Bell Jar / Cylindrical 10″ SS / Cubical 14″ SS chamber
- Up to 7″x7″ plates and 200mm wafers
- Two evaporation sources
- Water cooled feedthrus
- Solid state switching for sequential evaporation
- SCR circuitry for accurate control
- Individual source and substrate shutters
- Cross contamination shields
- Quartz crystal thickness sensor
- Twist lock mechanism for easy substrate holder load/unload
- Substrate rotation
- Closed loop evaporation control
- Fully automated PC based, recipe driven
- LabVIEW user interface
- EMO protection and safety interlocks
Options
- Substrate heating up to 800°C or chilled wafer cooling
- Glancing Angle Deposition (GLAD) with rotation
- Planetary substrate holder
- Additional power module for co-evaporation
- Additional evaporation sources up to six
- RF/DC bias
- Ion source for substrate cleaning
- Magnetron source for sputtering
- MFCs for reactive sputtering/evaporation
- Automatic load/unload
- Various pumping options including cryo pumping stations
Applications:
- Metallization in IC interconnects
- Metal contact layer in CIGS Applications
- Organics Field Effect Transistors
- Perovskite solar cells applications
- OLED
The trademarks of the equipment and parts contained on this page belong to the Original Equipment Manufacturers.
Nano-Master Main Equipment: Thin Film | Etch | Cleaning | Space Simulation | Hybrid
SS10840
