Description
Typical NANOTECHNOLOGY Lab Fab Equipment
Please contact us for our Main Refurbished Equipment. Appreciate your time.
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
| 1 | Keysight PNA Network Analyzer N5127B DC-67 GHz |
| 2 | 1st Nano low pressure chemical vapor deposition [1stNANO-SINW] |
| 3 | 4-point probe [CDE-4pp] |
| 4 | AccuSputter AW4450 Sputtering Deposition Equipment |
| 5 | AccuThermo AW610M rapid Thermal Processor |
| 6 | Airco FC-1800 |
| 7 | Angstrom Engineering DC/RF Sputtering System |
| 8 | Angstrom low pressure chemical vapor deposition [ANGSTROM-LPCVD] |
| 9 | AnnealSys AS-One |
| 10 | assembly station [AssemblyStation1] |
| 11 | assembly station [AssemblyStation2] |
| 12 | AST Barrel Asher |
| 13 | AW-105R Plasma Asher Descum |
| 14 | AW-B3000 Plasma Asher Descum |
| 15 | Branson/IPC 3000 |
| 16 | Branson/IPC L3200 |
| 17 | BRUKER-ESR |
| 18 | Bungard Dry Film Laminator |
| 19 | Cascade Microtech Model 9000 Manual RF Probe Station |
| 20 | Cascade PS-21 |
| 21 | CHA Evaporator |
| 22 | CHA Mark 50 |
| 23 | Cincinnati Sub-Zero MicroClimate Temperature Chamber |
| 24 | CPA S-Gun -Sputter |
| 25 | D8-Venture-XRD |
| 26 | Electroglas EG 1034 |
| 27 | Electroglas EG 2001 |
| 28 | Electroglas EG 4090u+ |
| 29 | Electroglas EG 4090X |
| 30 | Emscope SC-650 |
| 31 | environmental chamber [TESTEQUITY-TChamber] |
| 32 | F.E.I.Quanta 200 |
| 33 | fiber splicer [VYTRAN-splicer] |
| 34 | Gaertner L117 |
| 35 | Gasonics Aura 1000 |
| 36 | Gasonics Aura 2000 |
| 37 | Gasonics Aura 3000 |
| 38 | Gasonics Aura 3010 |
| 39 | Gasonics L3510 |
| 40 | Heatpulse 210 |
| 41 | Heatpulse 310 |
| 42 | Heatpulse 410 |
| 43 | Heatpulse 4100 |
| 44 | Heatpulse 4100S |
| 45 | Heatpulse 4108 |
| 46 | Heatpulse 610 |
| 47 | Heatpulse 610I |
| 48 | Heatpulse 8108 |
| 49 | Heatpulse 8800 |
| 50 | HEWLETT PACKARD,Agilent HP 4062UX |
| 51 | HITACHI S-4700 |
| 52 | hood: hydrofluoric (HF) acids only [WB-HFACID] |
| 53 | hood: non-HF acids and bases [WB-ACIDBASEnonHF] |
| 54 | hood: solvent processing [WB-SOLVENT] |
| 55 | Intlvac Nanochrome Deposition System |
| 56 | Intlvac Nanoquest Pico Ion-Milling System |
| 57 | Ion mill [AJA-ionmill] |
| 58 | JANIS-12T |
| 59 | JETFIRST 100 -RTP |
| 60 | JETFIRST 150 -RTP |
| 61 | JETFIRST 200 RTP |
| 62 | JFP Microtechnic Flip Chip Bonder |
| 63 | Jipelec Jetfirst 200 |
| 64 | KLA Tencor P6 |
| 65 | KLA Tencor P-7 |
| 66 | Lakeshore CPX Cryogenic Probe Station |
| 67 | Lakeshore VSM |
| 68 | Lam AutoEtch 490 |
| 69 | Lam AutoEtch 590 |
| 70 | Lam Rainbow 4420 |
| 71 | lapper [Lapper] |
| 72 | laser welder: [ROFIN-welder] |
| 73 | Lindberg/Blue High Temperature Furnace |
| 74 | Logitech Chemical Delayering & Planarization (CDP) System |
| 75 | March PX-250 |
| 76 | Matrix 105 |
| 77 | Matrix 205 |
| 78 | Matrix 209S |
| 79 | Matrix 303 |
| 80 | Matrix 403 |
| 81 | microscope [EVOVISION-scope] |
| 82 | microscope [LEITZ-scope] |
| 83 | microscope [MITUTOYO-scope] |
| 84 | Microscope AFX-II |
| 85 | MPT RTP-3000 |
| 86 | MRC 603 693 TES |
| 87 | MRC 603 Sputter |
| 88 | MRC 643 -Sputter |
| 89 | MRC 8671 Sputtering |
| 90 | O2/Ar plasma cleaner [PLASMAETCH-plasmaclean] |
| 91 | Omicron-ARPES |
| 92 | OMICRON-Diag-chamber |
| 93 | OMICRON-LT-STM |
| 94 | OMICRON-MBE-Metal (MBE growth of metal films) |
| 95 | OMICRON-MBE-MM (sputter deposition of magnetic materials) |
| 96 | OMICRON-MBE-MOX (MBE growth of metal oxides) |
| 97 | OMICRON-MBE-SC (sputter deposition of superconducting materials) |
| 98 | OMICRON-MBE-TI (MBE growth of topological insulators) |
| 99 | OMICRON-Org-chamber (loadlock and wafer storage) |
| 100 | OMICRON-Prep-chamber |
| 101 | optical profiler [BRUKER-contour] |
| 102 | Oriel Mask Aligner |
| 103 | OXFORD 100 RIE |
| 104 | Oxford 133 RIE |
| 105 | Oxford PlasmaPro 100 Inductively Coupled Plasma (ICP) Deep Reactive Ion Etching (DRIE) Etch System for Si and Oxides |
| 106 | OXFORD-20T |
| 107 | PECVD PlasmaTherm 790 |
| 108 | Perkin-Elmer 2400 |
| 109 | Perkin-Elmer 4400 |
| 110 | Perkin-Elmer 4450 |
| 111 | Photoresist stripper [YES-ash] |
| 112 | Plasma Etch BT1 |
| 113 | PlasmaEtch PE-100 |
| 114 | PlasmaLab 80 Plus |
| 115 | Plasmalab 80+ DPCVD |
| 116 | PlasmaTherm 700 |
| 117 | PlasmaTherm 700 |
| 118 | PlasmaTherm 720 |
| 119 | PlasmaTherm 720 |
| 120 | PlasmaTherm 790 |
| 121 | PlasmaTherm 790 RIE |
| 122 | QuikLaze-50 Multi-Wavelength Laser Trimming Station |
| 123 | ResMap 178 |
| 124 | SAMCO RIE 10 NR |
| 125 | sample cutter [ALLIED-xtal-cut] |
| 126 | sample polisher [ALLIED-polish] |
| 127 | SAVANNAH S200-ALD |
| 128 | Sloan Dektak II |
| 129 | Sputter Deposition |
| 130 | Sputter/E-beam: Dual chamber deposition system [AJA-Sputter-EBeam] |
| 131 | STS ICP Bosch Process |
| 132 | STS ICP HRM |
| 133 | STS ICP Multiplex |
| 134 | STS PECVD |
| 135 | SUSS MicroTec MJB4 Mask Aligner |
| 136 | SUSS MicroTec PMC-150 Cryoprober |
| 137 | Technics 2000 |
| 138 | Technics PE-IIA |
| 139 | Tegal 901e |
| 140 | Tegal 903e |
| 141 | Temescal BJD-1800 |
| 142 | Temescal BJD-1800 |
| 143 | Temescal FC-1800 |
| 144 | Temescal FC-1800 |
| 145 | Tencor Mgage-200 |
| 146 | Tencor Mgage-300 |
| 147 | Tencor Sonogage 200 |
| 148 | TES FC-1800 |
| 149 | Tousimis Automegasamdri-915B, Critical Point Carbon Dioxide (CO2) Dryer |
| 150 | Trion Orion Plasma-Enhanced Chemical Vapour Deposition (PECVD) System |
| 151 | Trion Phantom Reactive Ion Etcher (RIE) |
| 152 | TSST pulsed laser deposition [TSST-PLD] |
| 153 | Varian 3120 E-Beam |
| 154 | WestBond 747677E Three-Way Convertible Manual Bonder |
| 155 | wire saw [WIRETEC-wire-saw] |
| 156 | wirebonder: manual [WESTBOND-wirebond] |
| 157 | Yellow Room (for photolithography) |
| 158 | Zurich Instruments HF2LI Lock-in Amplifier |
| 159 | Zyvex tDriver 1600 Micro-Electro-Mechanical (MEMS) Control Station |
SS3260-20240524
