Description
Plasmatherm 790 MF Plasma RIE Reactive Ion Etch System
PC controlled plasma etching system.
Single process chamber with shower head style gas input and a 7 in. dia. platen.
500W, 13.56 MHz RF generator.
Five MFC gas flow channels, previous gases used: HC-23, N2, 02, SF6.
Roughing pump with blower.
Does not include water chiller.
SS252155339404
