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PA-MOCVD Systems

Description

Nano-Master Main Equipment: Thin FilmEtch | Cleaning | Space Simulation | Hybrid

PA-MOCVD Systems (Download Brochure)

NANO-MASTER has developed the world’s first table top Plasma Assisted Metal Organic Chemical Vapor Deposition (PA-MOCVD) system for GaN, InGaN and AlGaN deposition processes. In this unique system, having a plasma source N2 is used instead of NH3 for growing nitrides thus eliminating abatment of NH3 and lowering H2 content in the films. Plasma enhancement via RF showerhead plasma source also allows lower deposition temperatures (600°C versus 1100°C) making it possible to offer this process in a table top system.

Higher throughput for manufacturing can be achieved through clustering.

Features:
  • Table top system

    Planar ICP Source

  • 10″ SS chamber
  • RF plasma source with shower head gas distribution
  • Auto tuner
  • 4″ Substrate holder, heated up to 900°C
  • Five bubblers with individual cooling/heating baths
  • Heated gas lines
  • Additional MFC’s
  • 250l/s turbomolecular pumping package
  • 5×10-7 torr base pressure
  • Fully automated PC based, recipe driven
  • LabVIEW user interface
  • EMO protection and safety interlocks

Options

  • Stand alone system

    RF Plasma Source with Shower Head Gas Distribution

  • ICP or microwave plasma source
  • 14″ SS electropolished cubical chamber
  • 8″ or 12″ substrate holder
  • 700°C rotating substrate holder for 6″ platen and 950°C for 4″ platen
  • Additional Bubblers and MFCs
  • Auto Load/Unload
  • Cluster configuration compatibility

Applications:

  • III-V Semiconductor layers
  • Blue LEDs
  • Laser Diodes
  • InN Nanorods in UV-Vis-IR optoelectronics
  • MoS2, BN and Graphene in 3D and 2D materials

Research Article: Effect of temperature and V/III ratio on the initial growth of indium nitride using plasma-assisted metal-organic chemical vapor deposition.

The trademarks of the equipment and parts contained on this page belong to the Original Equipment Manufacturers.

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Nano-Master Main Equipment: Thin FilmEtch | Cleaning | Space Simulation | Hybrid

SS10840

The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers