Oxford Plasmalab 300 RIE

OXFORD PLASMALAB 300 RIE / PE ETCHER SYSTEM consisting of:

– Model: 300 RIE / PE (Reactive Ion Etch/Physical Etch)

– Up to 12″/300mm Wafer Capable
– Setup to etch SiO2, Nitrides, or Polymers
– Platen: 380mm diameter
– Adixen ATH 400HPC Turbo Pump
– HP Computer with Pentium Dual Core Processor
– Advanced Energy RFG 1251 RF generator (13.56MHz)
– Plasma mode: RIE/PE recipe controlled
– Wafer stage temperature control: Neslab RTE-7 chiller
– Gas Box: 6 gas Lines
– Gas Box with 6 MKS 1179A MFC”s installed
– MFC 1 Gas: CHF3, Range: 100 SCCM
– MFC 2 Gas: CF4, Range: 100 SCCM
– MFC 3 Gas: O2, Range: 50 SCCM
– MFC 4 Gas: AR, Range: 100 SCCM
– MFC 5 Gas: N2, Range: 100 SCCM
– MFC 6 Gas:C4F8, Range: 100 SCCM

 -Chamber heating jacket 20-80C manual control

 -300mm Graphite Wafer Holder

 -Alcatel 2033C corrosive roughing pump
– CE Marked
– EMO Button
– Chamber Up/Down Selector Switch
– Hoist Up/Down Buttons
– Operations Manuals & System Restore Disk
– Serial Number: 94-219912
– System Power: 208V, 3ph, 50/60Hz, 20A
– Fully refurbished to meet all OEM specifications