Description
Oxford Instruments Plasmalab 800 Plus RIE Reactive Ion Etching System
PC controller provides intuitive user interaction with the system via advanced graphics and process recipe pages.
Footprint is kept to a minimum by locating all electronics and vacuum components within the body of the tool.
Mass flow controllers are housed separately in a wall mounted gas pod.
Four MFC gas controllers. Previous gases O2, CF4, Ar, CHF3.
A 460mm dia. electrode ideally suited for batch processes or single wafer processes with excellent uniformity across chamber.
18.75 in. dia. top electrode with shower head gas delivery.
Vacuum system includes turbo pump and dry pump.
SS252428693386
