Description
Please contact us if you are interested in the Nanotechnology Equipment . The Nanotechnology Equipment is only for end users and are subject to prior sale without notice. Appreciate your time.
- Nu Plasma HR Multi-collector ICP-MS
- Finnigan MAT 262 TIMS
- Nu AttoM High-resolution ICP-MS
- Picotrace metal-free clean laboratory for sample preparation and purification
- JEOL JXA-8230 electron microprobe
- Raith 150 Electron Beam Writer
- Headway Manual Resist Spinner
- Laurell Manual Resist Spinner
- SVG Resist Coat Tracks
- EVG 101 Resist Spray Coater
- ASML PAS 5500/60 i-line Stepper
- EV Group Contact Aligner Electonic Visions 620 Aligner, evalign
- KarlSuss MA-6 Aligner
- Solidscape 3d Wax Printer
- Fijifilm Dimatix Inkjet Printer
- Nanoscribe Photonics GT
- Heidelberg MLA 150
- Optomec Printer Aerosol Jet (AJ) 300 system
- Alveole Primo
- SVG Resist Develop tracks ,SVG (Silicon Valley Group) developer
- BlueM oven
- Singe Oven
- Mahnaz’s Oven
- Ultraviolet Photoresist Cure
- YES HMDS Oven YES Prime Oven
- Teos furnace
- Thermco LPCVD Low Temperature Oxide
- Thermo LPCVD Nitride
- Thermco LPCVD Poly
- LPCVD BPSG
- EG 1034
- EG 2001X with NAVITAR
- EG4085
- Olympus MX50A-F with Al100-L6
- Nanometrics 210 Nanospec AFT
- HP 4062 and Testers
- First Nano carbon nanotube CVD furnace, CVD-Nanotube
- Aixtron Black Magic graphene CVD furnace, CVD-Graphene
- STS – PECVD Deposition,STS Plasma Enhanced CVD
- PlasmaTherm Shuttlecock PECVD System, PlasmaTherm CCP PECVD
- PlasmaTherm Versaline HDP VCD System, PlasmaTherm Versaline HDPCVD
- Savannah S200 Cambridge Nanotech Savannah Atomic Layer Deposition System
- Cambridge Nanotech/Ultratech Fiji F202 system Fiji Atomic Layer Deposition – semi-clean chamber and gold chamber
- Cambridge Nanotech/Ultratech Fiji F202 system Fiji Atomic Layer Deposition- gold chamber, dielectric dedicated
- Savannah/Plasma Cleaner in Glovebox System ,MVD
- Applied Materials Centurion Epitaxial System EPI, Aixtron MOCVD – III-V system aix200 ,Aixtron MOCVD for III-V and dilute nitride semiconductors: InAs, GaAs, AlAs, InP, GaP, AlP, InGaAs, AlGaAs, InGaP, InGaAsN, InPN, et al.
- Aixtron MOCVD – III-N system,aix-ccs,Aixtron MOCVD for III-N semiconductors: InN, GaN, AlN, InGaN, InAlN, AlGaN, InGaAlN.
- Innotec ES26C E-Gun Evaporator
- Metallica Sputter System
- IntlVac Nanochrome I Sputter System
- IntlVac Nanochrome I Evaporator System
- Lesker Sputter
- Heatpulse 8800
- Heatpulse 8108
- Heatpulse 4108
- Heatpulse 4100
- Heatpulse 610
- Mini-Pulse 310
- Heatpulse 610
- Heatpulse 210
- RTP-3000
- AJA Evaporator
- Hummer V Sputter Coater
- Oerlikon Leybold Oerlikon Leybold Univex 400 RF/DC Sputter Station
- PDS 2010 LABCOTER 2 Parylene Deposition System (parcoater)
- AMT Oxide Plasma Etcher,AMT 8100 Plasma Etcher
- Drytek 100 Plasma Etcher
- Gasonics Aura 1000 Asher
- Lam Research TCP 9400 Poly Etcher
- Matrix 105 Plasma Resist Strip
- Branson IPC 3000
- Matrix 105
- Matrix 205
- Matrix Bobcat 209S
- Matrix Bobcat 209S
- Gasonics L3510
- Gasonics L3500
- Gasonics Aura 2000LL
- Matrix System One Stripper
- Plasma Therm 700 Plasma Etch&PECVD
- AMAT AMP-3300 PECVD
- Varian 3118 E-Beam Thermal Evaporator
- CVC Products AST-601 Sputter
- Airco Temescal FC-1800 Evaporator
- Temescal FC-1800 Evaporation
- Temescal FC-1800 Evaporator
- Temescal FC-1800 Evaporator
- Airco Temescal FC-1800 Evaporator
- Temescal BJD-1800 Sputter
- MRC 603 Sputter
- MRC 643 Sputter
- MRC 603 Sputter
- MRC 603 MRC 693 TES-600 Sputter
- Perkin-Elmer 4400 Sputter
- Perkin-Elmer 4400 Sputter
- Kurt J Lesker Dual Thermo Evaporator
- Plasmalab CVD-2
- MRC Reactive Ion Etcher
- Applied Materials P5000 Etcher
- Plasma Therm Versaline LL ICP Deep Silicon Etcher
- Plasma Therm Versaline LL ICP Metal Etcher
- Plasma Therm Versaline LL ICP Dielectric Etcher
- Plasma Quest ECR Etcher
- Oxford III-V etcher
- Oxford Dielectric Etcher
- STS Deep RIE Etcher
- SPTS uetch vapor etch
- Xactix Xenon Difluoride Etcher, Xactix: A XeF2 dry, chemical etcher
- Plasmaetch PE-50
- Intlvac Ion Mill Etcher
- Oxford PlasmaPro 80 – Reactive Ion etcher
- Thermco Oxidation Furnace Thermco
- FormingGas Anneal Furnace
- Phos Predep Furnace (POCl3), Tylan
- AllWin 610 Rapid Thermal Annealer
- Critical Point Dryer
- Lithography Solvent Bench
- Mask Scrubber
- Clean Wetbench
- Ebeam Process Wetbench
- Flexible Corrosive Wetbench and GaAs
- Flexible Corrosive Wetbench
- Metal Wetbench
- Miscellaneous Photoresist Wetbench
- Clean_resist-piranha-HF Wet Bench
- Decon and Clean Wetbench
- Solvent Wetbench
- Headway
- Laurel_Dev-etch
- Micromist Coater
- GnP Poli-400L
- EV Group Wafer Bonder
- Karl Suss Wafer Bonder
- Finetech Lambda
- DISCO Wafer Saw
- DISCO Backgrind
- Epilog Fusion M2 Lasercutter
- Micromill
- Keyence Digital Microscope VHX-6000
- Digital Instruments Nanoscope 3000 AFM
- Alphastep 500 Profilometer
- Nanospec Film Thickness Measurement System
- Prometrix Resistivity Mapping System
- Tencor P2 Profilometer
- Sensofar S-neox, non contact 3D optical profiling
- Flexus 2320
- J.A. Woollam M2000 Spectroscopic Ellipsometer
- micromanipulator6000 IV-CV probe station
- Malvern Dynamic Light Scattering (DLS) Zetasizer
- Sinton Lifetime Tester
- AFM-Asylum
- Bio-Logic Potentiostat
- Jasco UV-Vis-NIR Spectrometer
- Glovebox- side with spin coater
- Glovebox- side with transfer station
- Fumehood
- Fisher AccuSpin 24C
- IKA disperser
- Thinky mixer
- Q700 Probe Sonicator
- SCS G3P-8 Spin Coater
- Torrey Pines Hotplate
- STS PRO ICP Etcher
- STS Multiplex DRIE
- STS Multiplex ICP
- STS MESC Multiplex ICP
- Multiplex ICP MACS
- STS multi-chamber Cluster
- STS Mutiplex ICP
- Matrix 302
- Matrix 303
- Tegal 903e Plasma Etch
- Tegal 903e Plasma Etch
- Tegal 903e Plasma Etch
- Lam AutoEtch 590
- Lam Auto Etch 590
- Lam Rainbow 4728
- Plasma Therm 700
- Plasmatherm SLR 720
- Plasmatherm 790
- Branson/IPC 4150
- Branson/IPC 3000
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