Nanotechnology Equipment

Description

Please contact us if you are interested in the Nanotechnology Equipment . The Nanotechnology Equipment is only for end users and are subject to prior sale without notice. Appreciate your time.

1. Advanced Vacuum HDPCVD,The Apex SLR ICP is a high density plasma-enhanced chemical vapor deposition system with an inductively coupled plasma configuration.
2. Airco Temescal FC-1800 Evaporator
3. Airco Temescal FC-1800  Evaporator
4. AJA Sputtere, ATC 2000 RF-DC metal deposition system.
5. AJA Sputterer,ATC 2200 RF-DC metal deposition system.
6. ALD,Savannah Atomic layer deposition system
7. AMAT AMP-3300 PECVD
8. Asher  Technics Oxygen Asher ,Oxygen plasma cleaning system.
9. Atomic Force Microscope DI3000, Dimension 3000, Atomic force microscope measuring tool.
10. Atomic Force Microscope DI5000 ,Dimension 5000 ,This is a Scanning Probe Microscopy (SPM) tool that produces high resolution, three-dimensional images by scanning a sharp tip over the sample surface.
11. AV Etcher ,Reactive ion etching system with Fl gases. AV Vision 320
12. Biosafety Hoods,Three level 2 biosafety hoods, one with external exhaust for working with hazardous solvents.
13. Blue M exhausted bake oven , 008A-3-26
14. Branson IPC 3000
15. Branson/IPC 3000
16. Branson/IPC 4150
17. Canon Stepper ,Canon 2500 i3 ,An optical (I-Line) imaging lithography system. The method of lithography is sometimes called a projection form of lithography.
18. CEE 200X Spinner,Used for applying E-beam resists and imprint resists uniformly on a substrate. Spin speed, length, acceleration, and exhaust rate can be altered to achieve desired resist thickness.
19. Cell Culture Incubators,Two incubators for cell culturing at temperatures above ambient with controlled CO2 content. One custom chilled incubator for culturing at low temperatures (down to 4C) with full CO2 and O2 control.
20. CHA Evaporator,SEC 600 E-beam deposition system.
21. Confocal Microscope ,HS200A Optical profiler designed for fast and non-invasive inspection and measurement of the 3-dimensional geometry of probe marks, probe cards, MEMS, micro lenses and similar micro and nano engineered or precision-machined structures.
22. Confocal/fluorescence Microscope,A high performance inverted microscope for life science use; allows both confocal and wide-field imaging at multiple wavelengths.
23. Critical Point Dryer,915B, 915 B,MEMS drying system.
24. CVC Products AST-601 Sputter
25. CV-IV ,HP4145A & HP4280A  , Capacitance voltage-current voltage system.
26. DC Sputter,Perkin Elmer 2400,DC metal deposition system
27. Deep Trench Etcher ,SLR -770 Silicon etching system.
28. EG 1034
29. EG 2001X with NAVITAR
30. EG4085
31. Film Sense,FS-1, Thin film measuring system using 4 wavelengths. Has automated stage and wafer mapping.
32. Filmetrics ,F50-EXR , Thin film thickness measuring system with automated stage and wafer mapping.
33. Four Point Probe,Veeco FPP5000, Thin film or surface sheet resistance measuring system
34. Gaertner Ellipsometer,LSE-USB, Laser based measuring system
35. Gasonics Aura 2000LL
36. Gasonics L3500
37. Gasonics L3510
38. Graphene Furnace ,Graphene CVD Furnace is a CVD system capable of make single and bilayer graphene on Copper foil substrates. Graphene is a 2D material with many research opportunities.
39. Hard-bake oven, Lab-Line Duo-Vac
40. Headway ,AC101E, Photo resist dispensing system.
41. Heatpulse 210
42. Heatpulse 4100
43. Heatpulse 4108
44. Heatpulse 610
45. Heatpulse 610
46. Heatpulse 8108
47. Heatpulse 8800
48. Heidelberg Laser Writer DWL200 Mask Maker,Used for either mask making or direct write on substrate (minimum size 1″x1″). Minimum feature size is 1.5 µm for line or space for the 5mm write head and 1.0µm line or space with 2mm write head.
49. Hotplate HP131725/133735
50. HP 4062 and Testers
51. Intlvac Ion Mill,Ion etching system.
52. Inverted Microscope,An inverted microscope ideal for examining cell cultures and other biological material; has bright field and dark field illumination, polarization, a digital camera, and image processing software.
53. JEOL 6610 SEM,The JSM-6610LV is a scanning electron microscope (SEM) comprised of a tungsten electron column and an Oxford Instruments Inca X-Act EDS. It can image and analyze a wide range of conducting and non-conducting samples, as well as provide compositional information using the EDS.
54. JEOL 6700 FE SEM,The JEOL 6700 FE SEM is a field-emission scanning electron microscope (FE SEM) which utilizes a cold emission source. It can image features down to the 5 to 10nm range.
55. Karl Suss MA6 and MABA6, Karl Suss Contact Mask Aligner,Used for optical lithography (350nm – 450nm wavelength range).
56. Karl Suss Wafer Bonder SB6 ,Wafer bonding system
57. KLA-Tencor P-16 ,Surface profile measurement system
58. KLA-Tencor P-16 Surface profile measurement system.
59. Kurt J Lesker Dual Thermo Evaporator
60. Labconco Protector, Controlled Atmosphere Glovebox,Stainless steel enclosure that can be filled with a dry, inert atmosphere for working with materials sensitive to moisture and oxygen.
61. Lam Auto Etch 590
62. Lam AutoEtch 590
63. Lam Rainbow 4728
64. MA6 & Maba6 Karl Suss Contact Mask Aligner,Used for optical lithography (350nm – 450nm wavelength range).
65. MA6 Karl Suss Contact Mask Aligner PAN ,Used for optical lithography (350nm – 450nm wavelength range).
66. Materials Microscope,High quality upright materials microscope with polarization, DIC, digital camera, and image processing software.
67. Matrix 105
68. Matrix 205
69. Matrix 302
70. Matrix 303
71. Matrix Bobcat 209S
72. Matrix Bobcat 209S
73. Matrix System One Stripper
74. Microtrac Bluewave Laser Diffraction Particle Size Analyzer,For measuring size distributions of particles in the range 100 nm to 2500 microns.
75. Microtrac NanoFlex Dynamic Light Scattering Particle Size Analyzer,For measuring size distributions of fine particles from 1 nm to 6 microns in size.
76. Microtrac SIA , Optical Particle Size and Shape Analyzer,Uses a high speed camera to image individual particles between 1 and 2000 microns in size. Can measure size distributions and provide quantitative measurements of particle shape.
77. Mini-Brute Furnace ,A horizontal tube atmospheric furnace system for oxidation, annealing, and alloying that is manually controlled by the user.
78. Mini-Pulse 310
79. MRC 603 MRC 693 TES-600 Sputter
80. MRC 603 Sputter
81. MRC 603 Sputter
82. MRC 643 Sputter
83. Multiplex ICP MACS
84. Nanometrics 210 Nanospec AFT
85. Nanonex NX-B200 Nanoimprinter, transfering a pattern to a wafer with good resolution. This nanoimprinter is designed for thermal and UV-curable nanoimprint lithography (NIL).
86. NanoSight LM-10 Nanoparticle Tracking Analyzer,The NanoSight is a nanoparticle characterization tool that tracks the motion of nanoparticles suspended in a liquid. This took calculates size distributions for particles in the size range 40 nm to about 1 µm.
87. Nanospec 200,Dielctric film thickness measuring system model 200.
88. Nanospec200, Dielctric film thickness measuring system model 200.
89. Olympus MX50A-F with Al100-L6
90. Oriel 8095, Oriel flood exposure system ,Photo resist exposing system.
91. Ovens and Hot Plates,Photo resist baking system.
92. Oxford PlasmaLab System 100 ICP ,Reactive ion etching system with Fl and Cl gases, ICP, and load lock.
93. Parylene 2010 Labcoater ,Parylene Deposition System,Parylene, a polymer, deposits in a vapor form at room temperature under vacuum conditions. It forms a conformal coating on all exposed surfaces.
94. PEALD,The Fiji 200 Gen 2 plasma-assisted atomic layer deposition (PE-ALD) system is from UltraTech. It has a loadlock chamber to allow the deposition chamber to remain under vacuum reducing contamination effects of oxygen and water vapor in the films. Wafers up to 200mm in size. Aluminum oxide, aluminum nitride, titanium oxide, titanium nitride, hafnium oxide, and hafnium nitride are the current films.
95. PECVD,Plasmatherm 790 Plasma-enhanced chemical vapor deposition system.
96. Perkin-Elmer 4400 Sputter
97. Perkin-Elmer 4400 Sputter
98. Plasma Therm 700
99. Plasma Therm 700 Plasma Etch&PECVD
100. Plasmalab CVD-2
101. Plasmatherm 790
102. Plasmatherm SLR 720
103. Pre-bake oven, Blue M Stable Therm
104. Precision Spin Coater 100,Used to coat most positive and some negative photoresist that are compatible with acetone solvent on 4″ wafers only.
105. Precision Spin Coater 200X  ,Used to coat most positive and some negative photoresist that are compatible with acetone solvent on any size substrate.
106. Precision Spin Coater200X  ,Used to coat SU8, LOR and SOG resists on any size substrate.
107. RTA,RTP-600S Rapid thermal annealing system.
108. RTP-3000
109. Rudolph Ellipsometer MS14C2C,Laser based measuring system
110. SEMY LPCVD , Low pressure chemical vapor deposition system.  Low Stress Nitride and regular Nitride process tube that is able to do 6″ (150 mm) or 4″ wafers.  Poly deposition tube, which is for both N or P type doped Poly or undoped Poly.Low Temperature Oxide tube for both undoped and N and P doped films: LTO, PSG, BPSG.
111. Soft-bake oven, Lab-Line Imperial III
112. Spray/Puddle Developer 200X,Used for spray/puddle develop of photoresist with developer solution and for rinse with deionized water on all substrates.
113. Stabino Zeta Potential Analyzer,For measuring he zeta potential of particles in suspension.
114. Stress Test FSM 900TC,Wafer stress or warpage system.
115. STS 320 Etcher,Reactive ion etching system with Fl gases.
116. STS MESC Multiplex ICP
117. STS multi-chamber Cluster
118. STS Multiplex DRIE
119. STS Multiplex ICP
120. STS Mutiplex ICP
121. STS PRO ICP Etcher
122. Tegal 903e Plasma Etch
123. Tegal 903e Plasma Etch
124. Tegal 903e Plasma Etch
125. Temescal BJD-1800 Sputter
126. Temescal E-beam,E-beam deposition system.
127. Temescal FC-1800 Evaporation
128. Temescal FC-1800  Evaporator
129. Temescal FC-1800  Evaporator
130. Thermal Evaporator ,Metal evaporation system.
131. Tylan Furnace Bank Titian,Atmosphere oxidation system
132. UVO Cleaner Jelight UVO 42
133. Varian 3118 E-Beam Thermal Evaporator
134. Varian 3118 E-beam,Varian E-beam evaporation,E-beam deposition system.
135. Vistec EBPG5000+,100 KeV E-beam lithography system.
136. Wafer Saw ,Disco DAC-552 ,Wafer cutting system.Disco wafer dicing saw
137. Wet Benches
138. Xenon di-fluoride e1-series etching system ,Xetch e1 series . Used to dry-etch Si and other compatible material, isotropically, without the aid of a plasma.
139. YES 310 ,Image reversal processing system. Image Reversal Oven

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