Kurt J Lesker CMS-18 Dual Chamber Sputtering System

Kurt J Lesker (CMS-18) Dual Chamber Sputtering System

Kurt J Lesker R&D sputter tool for the exploration of unique materials and thin film devices:

• Dual chamber with load lock (3 cathodes in each chamber)
• PLC process control (programmable depositions)
• Substrates up to 8” diameter
• Substrate rotation (improved uniformity)
• Substrate bias, RF & DC (improved adhesion and density)
• Substrate heater, up to 500C (improved surface  mobility)
• 3” magnetron sputter cathodes (multiple materials without        venting)
• RF & DC power supplies (DC for metals, RF for non-conducting materials)
• Co-sputter capability