Drytek DRIE-100 Cassette Planar Plasma Wafer Etcher System

Drytek DRIE-100 Cassette Planar Plasma Wafer Etcher System

Drytek DRIE-100 Cassette Planar Plasma Wafer Etcher System

• Uses chlorine- and fluorine-based chemistries for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films.+
• Low energy etching for minimal substrate damage.
• Excellent selectivity, e.g., 20:1 poly Si:SiO2
• Laser interferometer for etch rate determination and end-point detection.
• Leybold-Heraeus D60A Trivac Rotary Vane Vacuum Pump w/Breaker Box available for unit
• Various Accessories & Wafer Holders Included
• Complete Manuals Included
• Leybold-Heraeus D60A Trivac Rotary Vane Vacuum Pump Available