Axic Benchmark 800 ICP Plasma Enhanced Chemical Vapor Deposition System PECVD

Description

Axic Benchmark 800 ICP Plasma Enhanced Chemical Vapor Deposition System PECVD

  • Tool used in research, process development or low volume production for precise etching and deposition on substrates up to 8-inches in diameter.
  •  The system can be operated in either a batch or single slice mode.
  • Features single-piece chamber construction, proven process recipes, field proven components, computer control with Windows programming.
  • Previous gases used N2, SF6, He, SiH4, NH3, N2O.
  • Dual Advanced Energy Dressler Cesar RF generators

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