Description
Used Semiconductor Equipment Parts-CMP / Grinding / Dicing / Polishing
Valid: Subject to prior payment/sale without notice. This is only for end users. Appreciate your time!
The trademarks of the equipment and parts contained in this website belonged to the Original Equipment Manufacturers.
| ID# | Equipment Description | OEM | Max Size |
| 1 | DFD-321 Dicing Saw | Disco | 150mm |
| 2 | DFD-651 Dicing Saw | Disco | 200mm |
| 3 | DFD-6361 Dicing Saw | Disco | 200mm |
| 4 | DFD-6362 Dicing Saw | Disco | 200mm |
| 5 | UH108 Dry-Film Laminator | Ultron | 200mm |
| 6 | ATM-1100E Automating Taping System | Takatori | 200mm |
| 7 | RAD-2500M/8 Saw Mounter | Lintec | 200mm |
| 8 | RAD-2000F/8 UV Tool | Lintec | 200mm |
| 9 | RAD-2500 Wafer Mounter | Lintec | 200mm |
SS0992-S-5-7
