Plasma-Therm Versaline Diamond RIE

Description

Please contact us if you are interested in the Plasma-Therm Versaline Diamond RIE. The Plasma-Therm Versaline Diamond RIE is only for end users and are subject to prior sale without notice. Appreciate your time.

Plasma-Therm’s Versaline Inductive Coupled Plasma (ICP) etching system is a product resulting from decades of technology evolution. Its 2 MHz ICP RF for efficient coupling of power to plasma makes etching results stable and repeatable. Well designed thermal management components control chamber temperatures at desired values from beginning to the end during processes. Major features include:

· ICP RF up to 1,200 W

· RF bias up to 600 W

· Substrate temperatures from 10 °C to 180 °C

· Lid, ceramic spool, and metal liner temperatures from 20 °C to 180 °C

Applications

Diamond etch only

Available Processes

· Thorough O2 plasma chamber cleaning processes for NV center applications

· Nano-feature etch

· Diamond thinning