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Semiconductor Equipment

Semiconductor Equipment

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Please contact us if you are interested in the following  Semiconductor Equipment. The  Semiconductor Equipment are only for end users and are subject to prior sale without notice. Appreciate your time.

  1. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  2. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  3. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  4. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  5. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  6. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  7. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  8. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  9. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  10. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  11. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  12. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  13. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  14. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  15. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  16. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  17. Axcelis Technologies Inc. RapidStrip 320 Stripper/Asher
  18. BE Semiconductor Industries N.V. (BESI) Datacon 2200 APM Plus Die Bonder
  19. BESI ESEC 2008 xP3 Die Bonder
  20. BESI ESEC 2008 xP3 Die Bonder
  21. BESI ESEC 2008 xP3 Die Bonder
  22. BESI ESEC 2008 xP3 Die Bonder
  23. BESI ESEC 2008 xP3 Die Bonder
  24. Blue M Electric Company S05IEU55 Cure Oven
  25. Blue M Electric Company STK Series Cure Oven
  26. Blue M Electric Company STK Series Cure Oven
  27. Blue M Electric Company STK Series Cure Oven
  28. Blue M Electric Company STK Series Cure Oven
  29. BTU International Paragon 98 IR reflow
  30. CAMECA SC Ultra Total Magnetic Sector SIMS
  31. Camtek Eagle-AP Bump Inspection
  32. Canon FPA-6000 ES5 248nm (KrF) Scanner
  33. Canon FPA-6000 ES5 248nm (KrF) Scanner
  34. Canon FPA-6000 ES6a 248nm (KrF) Scanner
  35. Canon FPA-6000 ES6 248nm (KrF) Scanner
  36. Canon FPA-6000 ES6 248nm (KrF) Scanner
  37. Canon FPA-6000 ES6a 248nm (KrF) Scanner
  38. Canon FPA-6000 ES6 248nm (KrF) Scanner
  39. Canon FPA-6000 ES6 248nm (KrF) Scanner
  40. Canon FPA-6000 ES6 248nm (KrF) Scanner
  41. Canon FPA-6000 ES6a 248nm (KrF) Scanner
  42. Crown Simplimatic 8080 FIFO – LIFO Buffer
  43. CSUN MFG. LTD. RIE Plasma Cleaner
  44. Dainippon Screen Mfg. Co. FC-3000 Batch Wafer Processing
  45. Dainippon Screen Mfg. Co. MP-3000 Single Wafer Processing
  46. Delta Design Pyramid Pick & Place SOC Handler
  47. Delta Design Pyramid Pick & Place SOC Handler
  48. Delta Design Pyramid Pick & Place SOC Handler
  49. Delta Design Pyramid Pick & Place SOC Handler
  50. Delta Design Pyramid Pick & Place SOC Handler
  51. Delta Design Pyramid Pick & Place SOC Handler
  52. E.A. Fischione 1020 Plasma Cleaner
  53. Ebara FREX300S Tungsten CMP
  54. Ebara FREX300S Dielectric CMP
  55. ECI Technology Qualilab QL-5EX Plating Bath Analysis
  56. ECI Technology Qualilab QL-100EX Plating Bath Analysis
  57. ECSAL Technologies Pte. Ltd. Hydrotek-03 Flux Cleaner
  58. ECSAL Technologies Pte. Ltd. Hydrotek-03 Flux Cleaner
  59. Entegris FOUP FOUP
  60. Entegris FOUP FOUP
  61. Entegris F300 – non-Cu FOUP
  62. EO Technics WTM200 Laser Scribe
  63. EO Technics Sunyang X2 Laser Scribe
  64. ESCO Ltd. EMD-WA1000S Temperature Desorption Analyzer
  65. ESEC SA 2008 HS3 Plus Die Bonder
  66. ESEC SA 2008 HS3 Plus Die Bonder
  67. ESEC SA 2008 HS3 Plus Die Bonder
  68. Espec EGNU28-12CWL Environmental Chamber
  69. Espec ESX-3CW Environmental Chamber
  70. EV Group EVG150 Coat and Develop Track
  71. FEI Company Strata 400S Focused Ion Beam (FIB)
  72. FEI Company FIB 200 Focused Ion Beam (FIB)
  73. FEI Company Helios NanoLab 1200HP Focused Ion Beam (FIB)
  74. Felicity Technology (FSE) FSE-CS-300 Evaporator Deposition Equipment
  75. First Ten Angstroms FTA3000 Life Sciences, Particle Analysis
  76. Fortrend Engineering SIO-300-200-2 Bake Oven
  77. Fortrend Engineering SIO-300-250-2 Bake Oven
  78. Fries Research & Technology Microprof Profilometer
  79. Fries Research & Technology MicroProf MPR 200 TTV MHU 4 Film Thickness Measurement System
  80. GE Inspection Technologies Phoenix aminer X-ray Inspection
  81. GE Inspection Technologies Phoenix aminer X-ray Inspection
  82. Getech GSR1280E Mechanical
  83. Getech GSR1200 Mechanical
  84. Getech GSR1200 Mechanical
  85. Heller Industries, Inc. 1826 Mark5 IR reflow
  86. Heller Industries, Inc. 1826 Mark5 IR reflow
  87. Hermes Microvision (HMI) eP3 XP E-beam Inspection
  88. Hermes Microvision (HMI) eScan-315XP E-beam Inspection
  89. Hitachi (Semiconductor) U-702 Metal Etch
  90. Hitachi (Semiconductor) U-702 Metal Etch
  91. Hitachi (Semiconductor) U-702 Metal Etch
  92. Hitachi (Semiconductor) U-702 Metal Etch
  93. Hitachi (Semiconductor) RS-6000 SEM – Defect Review (DR)
  94. Hitachi (Semiconductor) U-7050A Metal Etch
  95. Hitachi (Semiconductor) U-702 Metal Etch
  96. Hitachi (Semiconductor) WA3300 Atomic Force Microscope (AFM)
  97. Hitachi (Semiconductor) LS6800 Particle Measurement
  98. Hitachi (Semiconductor) U-702 Metal Etch
  99. Hitachi (Semiconductor) U-702 Metal Etch
  100. Hitachi (Semiconductor) U-7050A Metal Etch
  101. Hitachi (Semiconductor) U-7050A Metal Etch
  102. Hitachi (Semiconductor) CM-700 Die Bonder
  103. Hitachi (Semiconductor) CM-700 Die Bonder
  104. Hitachi (Semiconductor) CM-700 Die Bonder
  105. Hitachi (Semiconductor) CM-700 Die Bonder
  106. Hitachi (Semiconductor) CM-700 Die Bonder
  107. Hitachi (Semiconductor) CM-700 Die Bonder
  108. Hitachi (Semiconductor) CM-700 Die Bonder
  109. Hitachi Kokusai Electric Inc. Quixace II Vertical LPCVD Furnace
  110. JEOL JWS-7555 SEM – Defect Review (DR)
  111. JEOL JSM-6460LV FE SEM
  112. Jordan Valley Semiconductors LTD JVX 6200 X-ray Fluorescence Spectrometer

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