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AlN Component

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Description

AlN Component

Application

Equipment demands for high thermal insulation and thermal conductivity

Material Characteristics

Good thermal conductivity, good insulation

Material Comparison Chart:

Nature density(g/㎝3  ) density(g/㎝3  ) (10-6   / ℃) (Kgf/㎜2  ) (J/㎏*°K) (GPa) (MPa) (MPa) (MPa) (MPa*m0.5     ) (Poisson’s ratio) (℃)
Al2-O3 3.9 3.9 8 1600 880 370 262 2600 380 3.6 0.26 2053
ZrO2 6 6 10.1 1400 400 200 700 1850 690 9.5 0.23 2700
SiC 3.2 3.2 4 2300 700 410 400 3900 550 4.6 0.19 2700
Si3 N4 3.3 3.3 2.3 1500 700 310 524 2500 780 7.7 0.24 1900
Cellon  Sialon 3.2 3.2 3 1600 620 300 450 3500 600 6.5 0.23 1900
WC 15 15 6 1600 390 700 896 6100 550 25 0.18 2870
Glass 2.5 2.5 0.5 1000 740 70 1100 69 1 0.2 2200
BN 2 2 2 220 1850 62 41 143 73 0.13 2600
AlN 3.2 3.2 4.4 1200 730 340 400 2070 350 2.6 0.25 2400
B4 C 2.5 2.5 5.6 3200 930 450 350 2800 400 3 0.15 2450
Steel 7.8 7.8 13.6 126 448 200 520 14 0.3 1450

Relatively high thermal conductivity of the substrate table:

Substrate material FR4 MCPCB LTCC Al2-O3 SiC AlN
(W/m*°K) 0.7~1.2 2~6 8~15 20~28 120~140 140~180
Insulativity(Ω×㎝) 1014 108 1013 1015 108 1011
(0.25cm2  )  (W) <0.2 0.5~1 1~1.5 2~3 3~15 15~20
Board size To large-scale To large-scale No more 6″×6″ No more 6″×6″ No more 6″×6″ No more 6″×6

The items are subject to prior sale without notice. These items are only for end users.

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