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Aluminum Nitride Substrate

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Description

Aluminum Nitride Substrate

Application

Thermal dissipation plate for LED, and high power components such as CPU and converter

Material Characteristics

High thermal conductivity, corrosion resistant at high temperature, and high thermal stability

Material Comparison Chart:

Nature density(g/㎝3  ) density(g/㎝3  ) (10-6   / ℃) (Kgf/㎜2  ) (J/㎏*°K) (GPa) (MPa) (MPa) (MPa) (MPa*m0.5     ) (Poisson’s ratio) (℃)
Al2-O3 3.9 3.9 8 1600 880 370 262 2600 380 3.6 0.26 2053
ZrO2 6 6 10.1 1400 400 200 700 1850 690 9.5 0.23 2700
SiC 3.2 3.2 4 2300 700 410 400 3900 550 4.6 0.19 2700
Si3 N4 3.3 3.3 2.3 1500 700 310 524 2500 780 7.7 0.24 1900
Cellon  Sialon 3.2 3.2 3 1600 620 300 450 3500 600 6.5 0.23 1900
WC 15 15 6 1600 390 700 896 6100 550 25 0.18 2870
Glass 2.5 2.5 0.5 1000 740 70 1100 69 1 0.2 2200
BN 2 2 2 220 1850 62 41 143 73 0.13 2600
AlN 3.2 3.2 4.4 1200 730 340 400 2070 350 2.6 0.25 2400
B4 C 2.5 2.5 5.6 3200 930 450 350 2800 400 3 0.15 2450
Steel 7.8 7.8 13.6 126 448 200 520 14 0.3 1450

Relatively high thermal conductivity of the substrate table:

Substrate material FR4 MCPCB LTCC Al2-O3 SiC AlN
(W/m*°K) 0.7~1.2 2~6 8~15 20~28 120~140 140~180
Insulativity(Ω×㎝) 1014 108 1013 1015 108 1011
(0.25cm2  )  (W) <0.2 0.5~1 1~1.5 2~3 3~15 15~20
Board size To large-scale To large-scale No more 6″×6″ No more 6″×6″ No more 6″×6″ No more 6″×6

The items are subject to prior sale without notice. These items are only for end users.

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